TI官方CC2530芯片数据手册：2.4GHz IEEE802.15.4与ZigBee应用SoC解决方案

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"CC2530Datasheet是德州仪器(TI)官方提供的技术文档，主要介绍了一款专用于2.4GHz IEEE 802.15.4和ZigBee应用的系统级芯片(SoC)解决方案。这款芯片有多个版本，包括CC2530F32、CC2530F64、CC2530F128和CC2530F256，适用于不同存储需求的场景。" CC2530是一款集成了微控制器单元(MCU)和无线射频(RF)收发器的SoC，特别设计用于低功耗的无线通信应用，如智能家居、传感器网络和物联网(IoT)设备。以下是该芯片的一些关键特性： 1. **MAC定时器和通用定时器**: 包含一个16位定时器和两个8位定时器，可用于各种任务调度和时间间隔管理。 2. **RF/布局**: 内置2.4GHz IEEE 802.15.4兼容的RF收发器，支持高效能的无线传输。 3. **IR生成电路**: 提供红外(IR)信号生成能力，可用于遥控或类似应用。 4. **32kHz睡眠定时器**: 在低功耗模式下依然保持计时功能，并具有捕获功能，有利于节能设计。 5. **优秀的接收灵敏度和干扰抗性**: 提高了无线通信的稳定性和可靠性。 6. **CSMA/CA硬件支持**: 实现载波侦听多址访问/冲突避免(CSMA/CA)，确保网络中的数据包传输不会发生碰撞。 7. **数字RSSI/LQI支持**: 提供准确的接收信号强度指示(RSSI)和链路质量指示(LQI)，有助于评估无线连接质量。 8. **可编程输出功率**: 最大可到4.5dBm，可根据应用场景灵活调整。 9. **电池监测和温度传感器**: 为设备提供实时的电源状态和环境温度信息。 10. **12位ADC**: 配备8个输入通道，可配置分辨率，用于采集模拟信号。 11. **单晶振设计**: 只需一个晶体振荡器即可满足所有时钟需求，简化了系统设计。 12. **异步网络支持**: 内置AES安全协处理器，保障数据加密和安全通信。 13. **强大的USART**: 支持多种串行协议，如UART、SPI和I2C，便于与其他设备交互。 14. **21个GPIO引脚**: 提供多样化的接口选项，每个引脚可驱动4mA至20mA的电流。 15. **封装形式**: 采用6mm x 6mm QFN40封装，节省空间，适合小型化设计。 16. **全球无线电频率合规**: 符合欧洲的ETSI EN 300 328和EN 300 440标准，以及其它地区的无线频率规定。 CC2530芯片以其集成度高、功能强大、低功耗和易用性，成为开发2.4GHz无线应用的理想选择，特别是对于需要符合IEEE 802.15.4和ZigBee标准的项目。在实际应用中，开发者可以根据具体需求选择不同内存容量的版本，以优化成本和性能。

CC2530F32, CC2530F64

CC2530F128, CC2530F256

www.ti.com

SWRS081B –APRIL 2009–REVISED FEBRUARY 2011

RF TRANSMIT SECTION

Measured on Texas Instruments CC2530 EM reference design with T

= 25°C, VDD = 3 V and f

= 2440 MHz, unless

otherwise noted.

Boldface limits apply over the entire operating range, T

= –40°C to 125°C, VDD = 2 V to 3.6 V and f

= 2394 MHz to 2507

MHz.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Delivered to a single-ended 50-Ω load through a balun using

0 4.5 8

maximum-recommended output-power setting

Nominal output power dBm

–8 10

[1] requires minimum –3 dBm

Programmable output power 32 dB

range

Spurious emissions Max recommended output power setting

(1)

Measured conducted 25 MHz–1000 MHz (outside restricted bands) –60

according to stated

25 MHz–2400 MHz (within FCC restricted bands) –60

regulations. Only largest

25 MHz–1000 MHz (within ETSI restricted bands) –60

spurious emission stated

1800–1900 MHz (ETSI restricted band) –57

within each band.

5150–5300 MHz (ETSI restricted band)

–55

dBm

At 2 × f

and 3 × f

(FCC restricted band)

–42

At 2 × f

and 3 × f

(ETSI EN 300-440 and EN 300-328)

(2)

–31

1 GHz–12.75 GHz (outside restricted bands)

–53

At 2483.5 MHz and above (FCC restricted band)

= 2480 MHz

(3)

–42

Measured as defined by [1] using maximum-recommended

output-power setting

Error vector magnitude (EVM) 2%

[1] requires maximum 35%.

Differential impedance as seen from the RF port (RF_P and RF_N)

Optimum load impedance 69 + j29 Ω

towards the antenna

(1) Texas Instruments CC2530 EM reference design is suitable for systems targeting compliance with EN 300 328, EN 300 440, FCC

CFR47 Part 15 and ARIB STD-T-66.

(2) Margins for passing conducted requirements at the third harmonic can be improved by using a simple band-pass filter connected

between matching network and RF connector (1.8 pF in parallel with 1.6 nH); this filter must be connected to a good RF ground.

(3) Margins for passing FCC requirements at 2483.5 MHz and above when transmitting at 2480 MHz can be improved by using a lower

output-power setting or having less than 100% duty cycle.

Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256

CC2530F32, CC2530F64

CC2530F128, CC2530F256

SWRS081B –APRIL 2009–REVISED FEBRUARY 2011

www.ti.com

32-MHz CRYSTAL OSCILLATOR

Measured on Texas Instruments CC2530 EM reference design with T

= 25°C and VDD = 3 V, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Crystal frequency 32 MHz

Crystal frequency accuracy

–40 40 ppm

requirement

(1)

ESR Equivalent series resistance 6 60 Ω

Crystal shunt capacitance 1 7 pF

Crystal load capacitance 10 16 pF

Start-up time 0.3 ms

The crystal oscillator must be in power down for a

guard time before it is used again. This

Power-down guard time requirement is valid for all modes of operation. The 3 ms

need for power-down guard time can vary with

crystal type and load.

(1) Including aging and temperature dependency, as specified by [1]

32.768-kHz CRYSTAL OSCILLATOR

Measured on Texas Instruments CC2530 EM reference design with T

= 25°C and VDD = 3 V, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Crystal frequency 32.768 kHz

Crystal frequency accuracy

–40 40 ppm

requirement

(1)

ESR Equivalent series resistance 40 130 kΩ

Crystal shunt capacitance 0.9 2 pF

Crystal load capacitance 12 16 pF

Start-up time 0.4 s

(1) Including aging and temperature dependency, as specified by [1]

32-kHz RC OSCILLATOR

Measured on Texas Instruments CC2530 EM reference design with T

= 25°C and VDD = 3 V, unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Calibrated frequency

(1)

32.753 kHz

Frequency accuracy after calibration ±0.2%

Temperature coefficient

(2)

0.4 %/°C

Supply-voltage coefficient

(3)

3 %/V

Calibration time

(4)

2 ms

(1) The calibrated 32-kHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 977.

(2) Frequency drift when temperature changes after calibration

(3) Frequency drift when supply voltage changes after calibration

(4) When the 32-kHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator

is performed while SLEEPCMD.OSC32K_CALDIS is 0.

Product Folder Link(s): CC2530F32 CC2530F64 CC2530F128 CC2530F256

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