2010年AEC-Q200修订版：汽车电子行业被动元件应力测试与认证

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AEC-Q200标准文件是专为汽车行业设计的，尤其是针对被动无线元件的应力测试和质量认证标准。该文档于2010年6月1日更新，由Automotive Electronics Council (AEC) 的Component Technical Committee发布。AEC-Q200标准旨在确保汽车电子元件在严苛的环境条件下能够提供可靠性和耐用性，这对于汽车电子系统的整体性能至关重要。 AEC-Q200REVD涵盖了被动元件在车辆运行中的承受能力，包括但不限于电阻、电容、电感等元器件。它规定了对这些元件进行压力测试和筛选的程序，这些测试包括但不限于温度循环、振动、冲击、湿度暴露和电源波动等。这些测试的目的是评估元件在长时间工作和极端环境下的性能稳定性，以保证其在汽车应用中的安全性与耐久性。参与该标准制定的技术委员会成员来自多家知名企业，如Delphi、Visteon、Continental、Autoliv和JCI等，他们的经验和专业知识为标准的制定做出了关键贡献。其中，持续支持者（Sustaining Members）如Robert Hulka Jr., Bob Knoell, Ken Kirby Jr., Ron Haberl, Hadi Mehrooz, Jason Larson 和 Gary Fisher 等人，以及技术成员（Technical Members）如Steve Maloy 代表了各公司在材料科学、设计和制造领域的深度理解。通过AEC-Q200标准，制造商和供应商可以遵循统一的质量标准，确保他们的产品符合汽车行业的严格要求。对于汽车工程师和采购人员来说，理解和遵循这个标准对于选择合适的电子元件，优化系统设计和降低故障风险具有重要意义。此外，对于消费者而言，这意味着他们驾驶的汽车配备了经过严格测试和验证的电子元件，提高了车辆的安全性和可靠性。

AEC-Q200 REV D

June 1, 2010

Component Technical Committee

Automotive Electronics Council

Page 16 of 74

TABLE 2 - TABLE OF METHODS REFERENCED

TANTALUM & CERAMIC CAPACITORS

Stress

No.

Reference

Additional Requirements

Pre- and Post-

Stress Electrical

Test

User Spec.

Test is performed at 25±5°C except as specified in

the applicable stress reference and the additional

requirements in Table 2.

High Temperature

Exposure

(Storage)

MIL-STD-

202 Method

108

Unpowered

1000 hours. Measurement at 24±4 hours after test

conclusion. The maximum rated temperature

should be employed for the dielectric used in the

device.

Temperature

Cycling

JESD22

Method

JA-104

1000 Cycles (-55°C to +125°C)

Measurement at 24±4 hours after test conclusion.

30min maximum dwell time at each temperature

extreme. 1 min. maximum transition time.

Destructive

Physical Analysis

EIA-469

Only applies to SMD Ceramics. Electrical Test not

required.

Biased Humidity

MIL-STD-

202 Method

103

1000 hours 85°C/85% RH. Note: Ceramics only -

Specified conditions: Rated Voltage and 1.3 to 1.5

volts. Add 100Kohm resistor. Tantalums - Rated

Voltage Only. Measurement at 24±4 hours after test

conclusion. For ceramics that have silver content

(e.g., PdAg electrodes), the low voltage portion of

this test must also be performed.

Operational Life

MIL-STD-

202

Method 108

Condition D Steady State T

=125°C.

2/3 rated for Tantalum caps

Full rated for Ceramic caps

Measurement at 24±4 hours after test conclusion.

The maximum rated temperature and voltage rating

for the dielectric employed in the device shall be

used.

External Visual

MIL-STD-

883 Method

2009

Inspect device construction, marking and

workmanship. Electrical Test not required

Physical

Dimension

JESD22

Method

JB-100

Verify physical dimensions to the applicable device

specification. Note: User(s) and Suppliers spec.

Electrical Test not required.

Terminal Strength

(Leaded)

MIL-STD-

202 Method

211

Test leaded device lead integrity only. Conditions:

Ceramics: A (454 g), C (227 g), E (1.45 kg-mm).

Tantalums: A (2.27 kg), C (227 g), E (1.45 kg-mm).

Resistance to

Solvents

MIL-STD-

202 Method

215

Note: It is applicable to marked and/or coated

components. Add Aqueous wash chemical

OKEMCLEAN (A 6% concentrated Oakite cleaner)

or equivalent. Do not use banned solvents.

Mechanical Shock

MIL-STD-

202

Method 213

Figure 1 of Method 213 SMD: Condition F LEADED:

Condition C

AEC-Q200 REV D

June 1, 2010

Component Technical Committee

Automotive Electronics Council

Page 18 of 74

TABLE 2A - Ceramic/Tantalum Process Change Qualification Guidelines for the Selection of Tests

For a given change listed below, the supplier should justify why a suggested test does not apply for the given

part(s) under consideration. Collaboration with their customer base is highly recommended.

3. High Temperature Exposure (Storage) 12. Resistance to Solvents

4. Temperature Cycling 13. Mechanical Shock 22. Terminal Strength (SMD)

5. Destructive Physical Analysis 14. Vibration 23. Beam Load Test

6. Moisture Resistance 15. Resistance to Soldering Heat

7. Biased Humidity 16. Thermal Shock

8. Operational Life 17. Electrostatic Discharge (ESD)

9 External Visual 18. Solderability

10. Physical Dimension 19. Electrical Characterization

11. Terminal Strength (Leaded) 21. Board Flex

Note: A letter or "" indicates that performance of that stress test should be considered (not necessarily required) for the appropriate process change

Test # From Table 2

MATERIAL

Binder Material



Dielectric Change



Electrode Attach



Electrode Material



Encapsulation



Lead Material



PROCESS

Dicing



Electrode Apply

Firing Profile



Lamination/Press

Technique



Powder Particle Size



Screening/Printing

Termination Process



DESIGN

Electrode Thickness



Layer Thickness



Lead Diameter



Number of Layers

Termination Area



Terminal Interface



MISCELLANEOUS

Mfg. Site Transfer



Material Suppliers



New/Modified Mfg.

Equipment



a = termination equipment only B = comparative data (unchanged vs. Changed) required C =

Ceramics only D = Tantalums only

AEC-Q200 REV D

June 1, 2010

Component Technical Committee

Automotive Electronics Council

Page 19 of 74

Table 2B – Acceptance Criteria for Ceramic C0G SMD Capacitors

Note: The contents in this table are meant to serve as examples of wording or limits for each test

and relative parameter to be measured and NOT actual requirements. Variables are denoted by

lower-case letters (e.g., x, y). The measured parameters, values and wording of each acceptance

criteria for each test should be agreed to between the user and supplier.

Acceptance Criteria

Measured Parameter =>

AEC-Q200 Test:

Capacitance Q Insulation

Resistance

1a. Initial limits Within specified

limits

Within specified limits

Within specified

limits

3. High temp exposure Initial limit Initial limit Initial limit

4. Temperature cycling

Change <= greater of

+/-x% or +/-y pF

Initial limit Initial limit

5. Destructive physica

analysis

Per AEC-Q200 – Electrical test not required.

6. Moisture resistance Change <= greater of

+/-x% or +/-y pF

>= a >= m% Initial

limit

7. Biased Humidity Change <= greater of

+/-x% or +/-y pF

<a pF: Q >= b + (c /pf * C)

>=a pF: Q >= d% initial

>= m% Initial

limit

8. Operational Life Change <= greater of

+/-x% or +/-y pF

<a pF: Q >= b + (c /pf * C)

d pF to e pF: Q>= f + (g /pf * C)

>= h pF: Q >= i

>= m% Initial

limit

9. External Visual Per AEC-Q200 – Electrical test not required.

10. Physical Dimensions

Per AEC-Q200 – Electrical test not required.

12. Resistance to

Solvents

Initial limit Initial limit Initial limit

13. Mechanical Shock Initial limit Initial limit Initial limit

14. Vibration Initial limit Initial limit Initial limit

15. Resistance to

Soldering Heat

Change <= greater of

+/-x% or +/-y pF

Initial limit Initial limit

16. Thermal shock Change <= greater of

+/-x% or +/-y pF

Initial limit Initial limit

17. ESD Initial limit Initial limit Initial limit

18. Solderability Per AEC-Q200 – Electrical test not required.

19a. Elec. Char.

@ 25ºC

Initial limit Initial limit Initial limit

Dielectric Withstanding Voltage: 250% rated voltage

19b. Elec. Char. @ -

55ºC

Change <= +/-x% No spec No spec

19c. Elec. Char. @

125ºC

Change <= +/-x% No spec >= m% Initial

limit

21. Board Flex Initial limit Initial limit Initial limit

>=x mm (record deflection at point of electrical failure)

22. Terminal Strength

(SMD)

Initial limit Initial limit Initial limit

0603 and greater: x N

0402 and less: y N

23. Beam Load Test Per AEC-Q200 – Electrical test not required.

AEC-Q200 REV D

June 1, 2010

Component Technical Committee

Automotive Electronics Council

Page 20 of 74

Table 2C -

Acceptance Criteria for Ceramic X7R and X5R SMD Capacitors

Note: The contents in this table are meant to serve as examples of wording or limits for each test

and relative parameter to be measured and NOT actual requirements. Variables are denoted by

lower-case letters (e.g., x, y). The measured parameters, values and wording of each acceptance

criteria for each test should be agreed to between the user and supplier.

Acceptance Criteria

Measured Parameter =>

AEC-Q200 Test

Capacitance Dissipation Factor Insulation

Resistance

1a. Initial limits Within specified limits Within specified limits Within specified

limits

3. High temp exposure Initial limit Initial limit Initial limit

4. Temperature

cycling

Change <= +/-x % Initial limit Initial limit

5. Destructive

physical analysis

Per AEC-Q200 – Electrical test not required.

6. Moisture

resistance

Change <= +/-x% >=a V: <= b%

c V to < d V: <= e%

d to < f V: <=g%

>= m% Initial

limit

7. Biased Humidity Change <= +/-x% <a% initial >= m% Initial

limit

8. Operational Life Change <= +/-x% <a% initial >=m% Initial

limit

9. External Visual Per AEC-Q200 – Electrical test not required.

10. Physical

Dimensions

Per AEC-Q200 – Electrical test not required.

12. Resistance to

Solvents

Initial limit Initial limit Initial limit

13. Mechanical Shock Initial limit Initial limit Initial limit

14. Vibration Initial limit Initial limit Initial limit

15. Resistance to

Soldering Heat

Change <= +/-x% Initial limit Initial limit

16. Thermal shock Change <= +/-x% Initial limit Initial limit

17. ESD Initial limit Initial limit Initial limit

18. Solderability Per AEC-Q200 – Electrical test not required.

19a. Elec. Char.

@ 25ºC

Initial limit Initial limit Initial limit

Dielectric Withstanding Voltage: 250% rated voltage

19b. Elec. Char.

@ -55ºC

Change <= +/-x% No spec No spec

19c. Elec. Char.

@ 125ºC

Change <= +/-x% No spec >=m% Initial

limit

21. Board Flex Initial limit Initial limit Initial limit

>=x mm (record deflection at point of electrical failure)

22. Terminal Strength

(SMD)

Initial limit Initial limit Initial limit

0603 and greater: x N

0402 and less: y N

23. Beam Load Test Per AEC-Q200 – Electrical test not required.

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