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Cover
ASR3601
Datasheet
Communications Processor
Doc. No. ASR3601, Rev. A
CONFIDENTIAL
Document Classification: Proprietary Information
Document Conventions
Note: Provides related information or information of special importance.
Caution: Indicates potential damage to hardware or software, or loss of data.
Warning: Indicates a risk of personal injury.
Document Status
Doc Status: Preliminary
Technical Publication: x.xx
Disclaimer
No part of this document may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, for any purpose, without the express written
permission of ASR. ASR retains the right to make changes to this document at any time, without notice. ASR makes no warranty of any kind, expressed or implied, with regard to any information
contained in this document, including, but not limited to, the implied warranties of merchantability or fitness for any particular purpose. Further, ASR does not warrant the accuracy or completeness of
the information, text, graphics, or other items contained within this document.
ASR products are not designed for use in life-support equipment or applications that would cause a life-threatening situation if any such products failed. Do not use ASR products in these types of
equipment or applications.
At all times hereunder, the recipient of any such information agrees that they shall be deemed to have manually signed this document in connection with their receipt of any such information.
Copyright © 2015–2018. ASR Microelectronics (Shanghai) Co., Ltd. All rights reserved .
Patent(s) Pending—Products identified in this document may be covered by one or more ASR patents and/or patent applications.
ASR3601
Communications Processor
Datasheet
Document Purpose
This document constitutes software related specifications and thermal
specifications, mechanical data, package signal locations, targeted electrical
specifications, functional bus waveforms, and board design considerations for
the ASR3601, including functional overviews for the applications processor and
cellular modem subsystems.
Number Representation
In this document, the numbers used to represent bit states are given in:
binary numbers with a
prefix of 0b For example,
0b1 or 0b11
or
hexadecimal with a prefix
of 0x For example 0x6B
Single-bit items have either of two states:
Clear — the item contains the value 0b0.
Set — the item contains the value 0b1.
PRODUCT OVERVIEW
General
- 28nm process, BGA package
with 0.4mm pitch.
- Operation temperature: -40~85C
Application Processor
- ARM Cortex-R5 with 624MHz
clock
32K I-Cache
32K D-Cache
64KB TCM
- 32KB ROM and 64KB on-chip
SRAM for application usage
Memory
- Embedded 8bit Octal-SPI
pSRAM at 200MHz, support
both SDR and DDR mode. Up to
800Mbyte/s bandwidth.
- QuadSPI NAND/NOR flash
controller with XIP (eXecute In
Place) and QPI mode support, up
to 120MHz.
Peripheral Controllers
- Keypad controller:
Support 8x8 keypad with
hardware scanner and
internal pull-up resistors.
Support multiple key
press for gaming
- GPIO (×32)
Pull-up/pull-down
programmable
1.8V IO8
- UART (×3)
With hardware flow-
control, up to 3.6Mbps
- USB 2.0(×1)
- SD 3.0 Host-controller(×2)
1 for SD card
1 for WiFi
- I2C (×4)
Modes:
100KHz/400KHz/1MHz
/3.4MHz
- General SSP interface(×2)
Support both master and
slave mode
Can be configured to
SPI, PCM, I2S and
Microwire format.
- PWM (×4)
- Dual SIM/USIM card controller
Security System
- True Random Number Generator
- 512bits OTP for security key
- Secure Boot/Strap/Bonding
Wireless connection interfaces
- 802.11a/b/g/n WiFi, Bluetooth
4.0, FM
Auxiliary analog inputs
- Auxiliary ADC with 1 input
Audio Codec
- Integrated High quality audio
codec and audio front-end
Debug System
- JTAG for CPU & DSP sub-
system
- UARTs and USB
Boot System
- Initial AP boot from
UART/USB/SPI NAND
- Strap pin & OTP for boot control
- 32KB BootROM
With hardware flow-
control, up to 3.6Mbps
- USB 2.0(×1)
- SD 3.0 Hostcontroller(×2)
1 for SD card
1 for WiFi
Table of Contents
COVER 1
DOCUMENT PURPOSE ............................................................................................................................................................... 3
NUMBER REPRESENTATION ........................................................................................................................................................ 3
PRODUCT OVERVIEW .......................................................................................................................................................... 4
NAMING CONVENTIONS .......................................................................................................................................................... 12
1 INTRODUCTION ........................................................................................................................................... 14
1.1
SOC DEVICE FEATURES ............................................................................................................................................. 14
2 FUNCTIONAL DESCRIPTION OVERVIEW .................................................................................................................. 18
2.1
ARCHITECTURE OVERVIEW ........................................................................................................................................ 18
2.2
CHIP CONFIGURATION .............................................................................................................................................. 20
2.3
MEMORY MAP ....................................................................................................................................................... 20
2.4
INTERRUPT CONNECTIVITY AND ASSIGNMENTS ............................................................................................................... 23
2.5
DMA CONNECTIVITY AND ASSIGNMENTS ...................................................................................................................... 31
3 PIN MUXING AND MULTI-FUNCTION PINS .............................................................................................................. 38
3.1
FUNCTION ASSIGNMENTS FOR MULTIPLEXED I/O PINS .................................................................................................... 38
3.2
PINOUT ................................................................................................................................................................. 41
3.3
MULTIPLEXED SIGNAL FUNCTIONS .............................................................................................................................. 48
3.4
PAD-RING I/O DOMAINS POWER CONTROL .................................................................................................................. 54
3.5
PIN CONTROL UNIT ................................................................................................................................................. 58
3.6
FUNCTION ASSIGNMENTS FOR MULTI-FUNCTION I/O PINS.............................................................................................. 70
3.7
REGISTER DESCRIPTIONS ........................................................................................................................................... 72
4 ARM CORTEX-R5 MODEM SUBSYSTEM ................................................................................................................... 73
4.1
OVERVIEW ............................................................................................................................................................. 73
4.2
FUNCTIONAL DESCRIPTION ........................................................................................................................................ 74
4.3
MEMORY MAP ...................................................................................................................................................... 76
4.4
INTERRUPT ............................................................................................................................................................. 76
5 SQU ........................................................................................................................................................................ 77
5.1
OVERVIEW ............................................................................................................................................................. 77
5.2
FUNCTIONALITY ...................................................................................................................................................... 77
6 PSRAM MEMORY CONTROLLER .............................................................................................................................. 79
6.1
INTRODUCTION ....................................................................................................................................................... 79
6.2
FEATURE LIST ......................................................................................................................................................... 79
6.3
OVERVIEW ............................................................................................................................................................. 80
6.4
FUNCTIONAL DESCRIPTION ........................................................................................................................................ 81
7 SD HOST CONTROLLER ............................................................................................................................................ 85
7.1
FEATURES .............................................................................................................................................................. 85
7.2
SIGNAL DESCRIPTIONS .............................................................................................................................................. 87
7.3
SD/MMC BUS PROTOCOL DESCRIPTION .................................................................................................................... 88
7.4
SPECIAL BUS TRANSACTIONS ..................................................................................................................................... 90
7.5
CARD DETECTION .................................................................................................................................................... 97
7.6
SPI MODE ............................................................................................................................................................. 97
7.7
MMC MODE ......................................................................................................................................................... 97
7.8
CE-ATA MODE ...................................................................................................................................................... 97
7.9
REGISTER DESCRIPTIONS ........................................................................................................................................... 97
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