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MSP432P401R, MSP432P401M
ZHCSET7G –MARCH 2015–REVISED SEPTEMBER 2017
www.ti.com.cn
内容
版权 © 2015–2017, Texas Instruments Incorporated
内内容容
1 器器件件概概述述 .................................................... 1
1.1 特性 ................................................... 1
1.2 应用 ................................................... 2
1.3 说明 ................................................... 2
1.4 功能方框图............................................ 3
2 修修订订历历史史记记录录............................................... 5
3 Device Comparison ..................................... 6
3.1 Related Products ..................................... 7
4 Terminal Configuration and Functions.............. 8
4.1 Pin Diagrams ......................................... 8
4.2 Pin Attributes ........................................ 11
4.3 Signal Descriptions.................................. 17
4.4 Pin Multiplexing ..................................... 27
4.5 Buffer Types......................................... 27
4.6 Connection for Unused Pins ........................ 27
5 Specifications........................................... 28
5.1 Absolute Maximum Ratings ........................ 28
5.2 ESD Ratings ........................................ 28
5.3 Recommended Operating Conditions............... 28
5.4 Recommended External Components ............. 29
5.5 Operating Mode V
CC
Ranges ....................... 29
5.6 Operating Mode CPU Frequency Ranges ......... 30
5.7 Operating Mode Peripheral Frequency Ranges .... 30
5.8 Operating Mode Execution Frequency vs Flash
Wait-State Requirements ........................... 31
5.9 Current Consumption During Device Reset......... 31
5.10 Current Consumption in LDO-Based Active
Modes – Dhrystone 2.1 Program ................... 31
5.11 Current Consumption in DC-DC-Based Active
Modes – Dhrystone 2.1 Program ................... 32
5.12 Current Consumption in Low-Frequency Active
Modes – Dhrystone 2.1 Program ................... 32
5.13 Typical Characteristics of Active Mode Currents for
CoreMark Program.................................. 33
5.14 Typical Characteristics of Active Mode Currents for
Prime Number Program............................. 34
5.15 Typical Characteristics of Active Mode Currents for
Fibonacci Program .................................. 35
5.16 Typical Characteristics of Active Mode Currents for
While(1) Program ................................... 36
5.17 Typical Characteristics of Low-Frequency Active
Mode Currents for CoreMark Program.............. 37
5.18 Current Consumption in LDO-Based LPM0 Modes. 38
5.19 Current Consumption in DC-DC-Based LPM0
Modes ............................................... 38
5.20 Current Consumption in Low-Frequency LPM0
Modes ............................................... 38
5.21 Current Consumption in LPM3, LPM4 Modes ...... 39
5.22 Current Consumption in LPM3.5, LPM4.5 Modes .. 39
5.23 Current Consumption of Digital Peripherals ........ 40
5.24 Thermal Resistance Characteristics ................ 40
5.25 Timing and Switching Characteristics ............... 41
6 Detailed Description ................................... 90
6.1 Overview ............................................ 90
6.2 Processor and Execution Features ................. 90
6.3 Memory Map ........................................ 91
6.4 Memories on the MSP432P401x .................. 111
6.5 DMA................................................ 114
6.6 Memory Map Access Details ...................... 115
6.7 Interrupts........................................... 117
6.8 System Control..................................... 119
6.9 Peripherals......................................... 124
6.10 Code Development and Debug .................... 134
6.11 Performance Benchmarks ......................... 136
6.12 Input/Output Diagrams ............................. 138
6.13 Device Descriptors (TLV) .......................... 176
6.14 Identification........................................ 178
7 Applications, Implementation, and Layout ...... 180
7.1 Device Connection and Layout Fundamentals .... 180
7.2 Peripheral and Interface-Specific Design
Information ......................................... 181
8 器器件件和和文文档档支支持持......................................... 183
8.1 入门和下一步....................................... 183
8.2 器件和开发工具命名规则........................... 183
8.3 工具和软件 ......................................... 184
8.4 文档支持 ........................................... 186
8.5 相关链接 ........................................... 187
8.6 社区资源 ........................................... 188
8.7 商标 ................................................ 188
8.8 静电放电警告....................................... 188
8.9 出口管制提示....................................... 188
8.10 术语表 .............................................. 188
9 机机械械、、封封装装和和可可订订购购信信息息 .............................. 188
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