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DDR2 SDRAM
MT47H128M4 – 32 Meg x 4 x 4 banks
MT47H64M8 – 16 Meg x 8 x 4 banks
MT47H32M16 – 8 Meg x 16 x 4 banks
Features
•
Vdd = +1.8V ±0.1V, VddQ = +1.8V ±0.1V
•
JEDEC-standard 1.8V I/O (SSTL_18-compatible)
•
Differential data strobe (DQS, DQS#) option
•
4n-bit prefetch architecture
•
Duplicate output strobe (RDQS) option for x8
•
DLL to align DQ and DQS transitions with CK
•
4 internal banks for concurrent operation
•
Programmable CAS latency (CL)
•
Posted CAS additive latency (AL)
•
WRITE latency = READ latency - 1
t
CK
•
Selectable burst lengths: 4 or 8
•
Adjustable data-output drive strength
•
64ms, 8,192-cycle refresh
•
On-die termination (ODT)
•
Industrial temperature (IT) option
•
Automotive temperature (AT) option
•
RoHS compliant
•
Supports JEDEC clock jitter specification
Options
1
Marking
•
Configuration
–
256 Meg x 4 (32 Meg x 4 x 4 banks) 128M4
–
128 Meg x 8 (16 Meg x 8 x 4 banks) 64M8
–
64 Meg x 16 (8 Meg x 16 x 4 banks) 32M16
•
FBGA package (Pb-free) – x16
–
84-ball FBGA (12mm x 12.5mm) Rev. B CC
–
84-ball FBGA (10mm x 12.5mm) Rev. D BN
–
84-ball FBGA (8mm x 12.5mm) Rev. F HR
•
FBGA package (Pb-free) – x4, x8
–
60-ball FBGA (12mm x 10mm) Rev. B CB
–
60-ball FBGA (10mm x 10mm) Rev. D B6
–
60-ball FBGA (8mm x 10mm) Rev. F CF
•
FBGA package (lead solder) – x16
–
84-ball FBGA (12mm x 12.5mm) Rev. B GC
–
84-ball FBGA (10mm x 12.5mm) Rev. D FN
–
84-ball FBGA (8mm x 12.5mm) Rev. F HW
•
FBGA package (lead solder) – x4, x8
–
60-ball FBGA (12mm x 10mm) Rev. B GB
–
60-ball FBGA (10mm x 10mm) Rev. D F6
–
60-ball FBGA (8mm x 10mm) Rev. F JN
•
Timing – cycle time
–
2.5ns @ CL = 5 (DDR2-800) -25E
–
2.5ns @ CL = 6 (DDR2-800) -25
–
3.0ns @ CL = 4 (DDR2-667) -3E
–
3.0ns @ CL = 5 (DDR2-667) -3
–
3.75ns @ CL = 4 (DDR2-533) -37E
–
5.0ns @ CL = 3 (DDR2-400) -5E
•
Self refresh
–
Standard None
–
Low-power L
•
Operating temperature
– Commercial (0°C ≤ T
C
≤ 85°C)
None
– Industrial (–40°C ≤ T
C
≤ 95°C;
–40°C ≤ T
A
≤ 85°C)
IT
–
Automotive, Revision :D only
(–40°C ≤ T
C
, T
A
≤ 105°C)
AT
•
Revision :B/:D/:F
Note:
1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on www.micron.com for
product offerings and availability.
512Mb: x4, x8, x16 DDR2 SDRAM
Features
PDF: 09005aef82f1e6e2
Rev. M 9/08 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2004 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.

Table 1: Key Timing Parameters
Speed Grade
Data Rate (MT/s)
t
RC (ns)
CL = 3 CL = 4 CL = 5 CL = 6
-25E
400 533 800 800 55
-25 400 533 667 800 55
-3E 400 667 667 n/a 54
-3 400 533 667 n/a 55
-37E 400 533 n/a n/a 55
-5E 400 400 n/a n/a 55
Table 2: Addressing
Parameter 128 Meg x 4 64 Meg x 8 32 Meg x 16
Configuration
32 Meg x 4 x 4 banks 16 Meg x 8 x 4 banks 8 Meg x 16 x 4 banks
Refresh count 8K 8K 8K
Row address A[13:0] (16K) A[13:0] (16K) A[12:0] (8K)
Bank address BA[1:0] (4) BA[1:0] (4) BA[1:0] (4)
Column address A[11, 9:0] (2K) A[9:0] (1K) A[9:0] (1K)
Figure 1: 512Mb DDR2 Part Numbers
Example Part Number: MT47H128M4B6-25E :D
Configuration
256 Meg x 4
128 Meg x 8
64 Meg x 16
128M4
64M8
32M16
Speed Grade
t
CK = 5ns, CL = 3
t
CK = 3.75ns, CL = 4
t
CK = 3ns, CL = 5
t
CK = 3ns, CL = 4
t
CK = 2.5ns, CL = 6
t
CK = 2.5ns, CL = 5
-5E
-37E
-3
-3E
-25
-25E
-
ConfigurationMT47H Package Speed
Revision
:
{
Package
Pb-free
84-ball 12mm x 12.5mm FBGA
60-ball 12mm x 10mm FBGA
Lead solder
84-ball 12mm x 12.5mm FBGA
60-ball 12mm x 10mm FBGA
CC
CB
GC
GB
Low power
Industrial temperature
Automotive temperature
L
IT
AT
Revision
:B/:D/:F
Note:
1. Not all speeds and configurations are available in all packages.
512Mb: x4, x8, x16 DDR2 SDRAM
Features
PDF: 09005aef82f1e6e2
Rev. M 9/08 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2004 Micron Technology, Inc. All rights reserved.

FBGA Part Number System
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:
http://www.micron.com.
512Mb: x4, x8, x16 DDR2 SDRAM
Features
PDF: 09005aef82f1e6e2
Rev. M 9/08 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2004 Micron Technology, Inc. All rights reserved.

Contents
State Diagram .................................................................................................................................................. 9
Functional Description ................................................................................................................................... 10
Industrial Temperature .............................................................................................................................. 10
Automotive Temperature ........................................................................................................................... 11
General Notes ............................................................................................................................................ 11
Functional Block Diagrams ............................................................................................................................. 12
Ball Assignments and Descriptions ................................................................................................................. 15
Packaging ...................................................................................................................................................... 20
Package Dimensions .................................................................................................................................. 20
FBGA Package Capacitance ......................................................................................................................... 26
Electrical Specifications – Absolute Ratings ..................................................................................................... 27
Temperature and Thermal Impedance ........................................................................................................ 27
Electrical Specifications – Idd Parameters ........................................................................................................ 30
Idd Specifications and Conditions ............................................................................................................... 30
Idd7 Conditions ......................................................................................................................................... 31
AC Timing Operating Specifications ................................................................................................................ 35
AC and DC Operating Conditions .................................................................................................................... 46
ODT DC Electrical Characteristics ................................................................................................................... 47
Input Electrical Characteristics and Operating Conditions ............................................................................... 48
Output Electrical Characteristics and Operating Conditions ............................................................................. 51
Output Driver Characteristics ......................................................................................................................... 53
Power and Ground Clamp Characteristics ....................................................................................................... 57
AC Overshoot/Undershoot Specification ......................................................................................................... 58
Input Slew Rate Derating ................................................................................................................................ 60
Commands .................................................................................................................................................... 74
Truth Tables ............................................................................................................................................... 74
DESELECT ................................................................................................................................................. 78
NO OPERATION (NOP) .............................................................................................................................. 79
LOAD MODE (LM) ..................................................................................................................................... 79
ACTIVATE .................................................................................................................................................. 79
READ ......................................................................................................................................................... 79
WRITE ....................................................................................................................................................... 79
PRECHARGE .............................................................................................................................................. 80
REFRESH ................................................................................................................................................... 80
SELF REFRESH ........................................................................................................................................... 80
Mode Register (MR) ........................................................................................................................................ 80
Burst Length .............................................................................................................................................. 81
Burst Type ................................................................................................................................................. 81
Operating Mode ......................................................................................................................................... 83
DLL RESET ................................................................................................................................................. 83
Write Recovery ........................................................................................................................................... 84
Power-Down Mode .................................................................................................................................... 84
CAS Latency (CL) ........................................................................................................................................ 85
Extended Mode Register (EMR) ....................................................................................................................... 86
DLL Enable/Disable ................................................................................................................................... 87
Output Drive Strength ................................................................................................................................ 87
DQS# Enable/Disable ................................................................................................................................. 87
RDQS Enable/Disable ................................................................................................................................. 87
Output Enable/Disable ............................................................................................................................... 87
On-Die Termination (ODT) ........................................................................................................................ 88
512Mb: x4, x8, x16 DDR2 SDRAM
PDF: 09005aef82f1e6e2
Rev. M 9/08 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2004 Micron Technology, Inc. All rights reserved.

Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 88
Posted CAS Additive Latency (AL) ............................................................................................................... 88
Extended Mode Register 2 (EMR2) .................................................................................................................. 90
Extended Mode Register 3 (EMR3) .................................................................................................................. 91
Initialization .................................................................................................................................................. 92
ACTIVATE ...................................................................................................................................................... 96
READ ............................................................................................................................................................. 98
READ with Precharge ................................................................................................................................ 102
READ with Auto Precharge ......................................................................................................................... 104
WRITE .......................................................................................................................................................... 109
PRECHARGE ................................................................................................................................................. 119
REFRESH ...................................................................................................................................................... 120
SELF REFRESH .............................................................................................................................................. 121
Power-Down Mode ....................................................................................................................................... 123
Precharge Power-Down Clock Frequency Change .......................................................................................... 130
Reset ............................................................................................................................................................. 131
CKE Low Anytime ...................................................................................................................................... 131
ODT Timing .................................................................................................................................................. 133
MRS Command to ODT Update Delay ........................................................................................................ 135
512Mb: x4, x8, x16 DDR2 SDRAM
PDF: 09005aef82f1e6e2
Rev. M 9/08 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2004 Micron Technology, Inc. All rights reserved.
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