IMX265LLR-C_Data_Sheet.pdf

CMOS

SONY

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Diagonal 8.9 mm (Type 1/1.8) CMOS solid-state Image Sensor with Square Pixel for

Monochrome Cameras

IMX265LLR-C

Description

The IMX265LLR-C is a diagonal 8.9 mm (Type 1/1.8) CMOS active pixel type solid-state image sensor with a square

pixel array and 3.19 M effective pixels. This chip features a global shutter with variable charge-integration time. This

chip operates with analog 3.3 V, digital 1.2 V, and interface 1.8 V triple power supply, and has low power consumption.

High sensitivity, low dark current and low PLS characteristics are achieved.

(Applications: FA cameras, ITS cameras)

Features

◆ CMOS active pixel type dots

◆ Built-in timing adjustment circuit, H/V driver and serial communication circuit

◆ Global shutter function

◆ Input frequency

37.125 MHz / 74.25 MHz / 54 MHz

◆ Number of recommended recording pixels: 2048 (H) × 1536 (V) approx. 3.15 M pixels

Readout mode

All-pixel scan mode

1080p-Full HD readout mode

Vertical / Horizontal 1 / 2 Subsampling mode

ROI mode

Vertical / Horizontal‐Normal / Inverted readout mode

◆ Readout rate

Maximum frame rate in

All-pixel scan mode: 12 bit: 55.6 frame/s

◆ Variable-speed shutter function (resolution 1 H units)

◆ 12-bit A/D converter

◆ CDS / PGA function

0 dB to 24 dB: Analog Gain (0.1 dB step)

24.1 dB to 48 dB: Analog Gain: 24 dB + Digital Gain: 0.1 dB to 24 dB (0.1 dB step)

◆ I/O interface

Low voltage LVDS (150 mVp-p) serial (4 ch) DDR output

◆ Recommended lens F number: 2.8 or more (Close side)

◆ Recommended exit pupil distance: –100 mm to –∞

Sony reserves the right to change products and specifications without prior notice.

This information does not convey any license by any implication or otherwise under any patents or other right.

Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for

any problems arising out of the use of these circuits.

IMX265LLR-C

USE RESTRICTION NOTICE

This USE RESTRICTION NOTICE ("Notice") is for customers who are considering or currently using the

image sensor products ("Products") set forth in this specifications book. Sony Corporation ("Sony") may,

at any time, modify this Notice which will be available to you in the latest specifications book for the

Products. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has its

own use restriction notice on the Products, such a use restriction notice will additionally apply between

you and the subsidiary or distributor. You should consult a sales representative of the subsidiary or

distributor of Sony on such a use restriction notice when you consider using the Products.

Use Restrictions

 The Products are intended for incorporation into such general electronic equipment as office products,

communication products, measurement products, and home electronics products in accordance with

the terms and conditions set forth in this specifications book and otherwise notified by Sony from time

to time.

 You should not use the Products for critical applications which may pose a life- or injury-threatening

risk or are highly likely to cause significant property damage in the event of failure of the Products. You

should consult your sales representative beforehand when you consider using the Products for such

critical applications. In addition, you should not use the Products in weapon or military equipment.

 Sony disclaims and does not assume any liability and damages arising out of misuse, improper use,

modification, use of the Products for the above-mentioned critical applications, weapon and military

equipment, or any deviation from the requirements set forth in this specifications book.

Design for Safety

 Sony is making continuous efforts to further improve the quality and reliability of the Products; however,

failure of a certain percentage of the Products is inevitable. Therefore, you should take sufficient care

to ensure the safe design of your products such as component redundancy, anti-conflagration features,

and features to prevent mis-operation in order to avoid accidents resulting in injury or death, fire or

other social damage as a result of such failure.

Export Control

 If the Products are controlled items under the export control laws or regulations of various countries,

approval may be required for the export of the Products under the said laws or regulations.

You should be responsible for compliance with the said laws or regulations.

No License Implied

 The technical information shown in this specifications book is for your reference purposes only. The

availability of this specifications book shall not be construed as giving any indication that Sony and its

licensors will license any intellectual property rights in such information by any implication or otherwise.

Sony will not assume responsibility for any problems in connection with your use of such information or

for any infringement of third-party rights due to the same. It is therefore your sole legal and financial

responsibility to resolve any such problems and infringement.

Governing Law

 This Notice shall be governed by and construed in accordance with the laws of Japan, without reference

to principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relating

to this Notice shall be submitted to the exclusive jurisdiction of the Tokyo District Court in Japan as the

court of first instance.

Other Applicable Terms and Conditions

 The terms and conditions in the Sony additional specifications, which will be made available to you when

you order the Products, shall also be applicable to your use of the Products as well as to this

specifications book. You should review those terms and conditions when you consider purchasing

and/or using the Products.

General-0.0.8

IMX265LLR-C

CONTENTS

Description ......................................................................................................................................................................1

Features ..........................................................................................................................................................................1

Device Structure ..............................................................................................................................................................2

Absolute Maximum Ratings ..............................................................................................................................................3

Recommended Operating Conditions ...............................................................................................................................3

USE RESTRICTION NOTICE ..........................................................................................................................................4

Chip Center and Optical Center ........................................................................................................................................7

Pixel Arrangement ...........................................................................................................................................................8

Block Diagram and Pin Configuration ...............................................................................................................................9

Pin Description .............................................................................................................................................................. 11

Electrical Characteristics ................................................................................................................................................ 15

DC Characteristics ..................................................................................................................................................... 15

Power Consumption ................................................................................................................................................... 15

AC Characteristics...................................................................................................................................................... 16

Master Clock (INCK) Waveform Diagram ................................................................................................................. 16

XVS / XHS Input Characteristics in Slave Mode (XMASTER = High) ......................................................................... 17

XTRIG Input Characteristics in Slave Mode (XMASTER = High) only ........................................................................ 17

Serial Communication ............................................................................................................................................. 18

DLCKP1 / DLCKM1, DLOPx1 / DLOMx1 ................................................................................................................. 20

I/O Equivalent Circuit Diagram ....................................................................................................................................... 21

Spectral Sensitivity Characteristics ................................................................................................................................. 22

Image Sensor Characteristics ........................................................................................................................................ 23

Zone Definition of Video Signal Shading...................................................................................................................... 23

Image Sensor Characteristics Measurement Method ...................................................................................................... 24

Measurement Conditions ............................................................................................................................................ 24

Definition of standard imaging conditions .................................................................................................................... 24

Measurement Method................................................................................................................................................. 25

Setting Registers Using Serial Communication ............................................................................................................... 26

Description of Setting Registers (4-wire) ..................................................................................................................... 26

Register Communication Timing (4-wire) ..................................................................................................................... 27

Register Write and Read (4-wire) ................................................................................................................................ 28

Description of Setting Registers (I

C) .......................................................................................................................... 29

C).......................................................................................................................... 30

C Communication Protocol ....................................................................................................................................... 31

C Serial Communication Read/Write Operation ......................................................................................................... 32

Single Read from Random Location ........................................................................................................................ 32

Single Read from Current Location .......................................................................................................................... 32

Sequential Read Starting from Random Location ..................................................................................................... 33

Sequential Read Starting from Current Location ....................................................................................................... 33

Register Map ................................................................................................................................................................. 34

Chip ID = 02 (Write: Chip ID = 02h, Read: Chip ID = 82h, I

C: 30**h) ........................................................................ 35

Chip ID = 03 (Write: Chip ID = 03h, Read: Chip ID = 83h, I

C: 31**h) ........................................................................ 41

Chip ID = 04 (Write: Chip ID = 04h, Read: Chip ID = 84h, I

C: 32**h) ........................................................................ 42

Chip ID = 05 (Write: Chip ID = 05h, Read: Chip ID = 85h, I

C: 33**h) ........................................................................ 43

Chip ID = 06 (Write: Chip ID = 06h, Read: Chip ID = 86h, I

C: 34**h) ........................................................................ 43

Chip ID = 07 (Write: Chip ID = 07h, Read: Chip ID = 87h, I

C: 35**h) ........................................................................ 43

Chip ID = 08 (Write: Chip ID = 08h, Read: Chip ID = 88h, I

C: 36**h) ........................................................................ 43

Chip ID = 09 (Write: Chip ID = 09h, Read: Chip ID = 89h, I

C: 37**h) ........................................................................ 43

Chip ID = 0A (Write: Chip ID = 0Ah, Read: Chip ID = 8Ah, I

C: 38**h) ....................................................................... 43

Chip ID = 0B (Write: Chip ID = 0Bh, Read: Chip ID = 8Bh, I

C: 39**h) ....................................................................... 43

Chip ID = 0C (Write: Chip ID = 0Ch, Read: Chip ID = 8Ch, I

C: 3A**h) ...................................................................... 44

Chip ID = 0D (Write: Chip ID = 0Dh, Read: Chip ID = 8Dh, I

C: 3B**h) ...................................................................... 44

Chip ID = 0E (Write: Chip ID = 0Eh, Read: Chip ID = 8Eh, I

C: 3C**h) ...................................................................... 44

Chip ID = 0F (Write: Chip ID = 0Fh, Read: Chip ID = 8Fh, I

C: 3D**h) ....................................................................... 44

Chip ID = 10 (Write: Chip ID = 10h, Read: Chip ID = 90h, I

C: 3E**h) ....................................................................... 44

Chip ID = 11 (Write: Chip ID = 11h, Read: Chip ID = 91h, I

C: 3F**h) ........................................................................ 44

Chip ID = 12 (Write: Chip ID = 12h, Read: Chip ID = 92h, I

C: 40**h) ........................................................................ 44

Readout Drive Modes .................................................................................................................................................... 45