BES2300-L_Datasheet_v0.19.pdf_bes2300规格书

BES2300-L规格书

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BES2300-L

Bluetooth Audio Platform with Support for

FWS* and Google Bisto

Product Specification Rev 0.19

* FWS: Fully Wireless Stereo, BES’s stereo connection between primary and secondary Voice Box.

Bestechnic (Shanghai) Co.,Ltd.

Room 201, Tower B, ChamtimePlaza, Lane 2889 Jinke Road,

Pudong New District, Shanghai 201203, China

PHONE: (86)21 6886 7870

FAX: (86)21 6886 7870 - 617

Confidential and Proprietary – Bestechnic (Shanghai) Co, Ltd.

DISCLAIMER:

No part of this document may be reproduced or transmitted in any form or by any means, electronic or mechanical,

including photocopying and recording, for any purpose, without the express written permission of Bestechnic. Bestechnic

retains the right to make changes to this document at any time, without notice. Bestechnic makes no warranty of any

kind, expressed or implied, with regard to any information contained in this document, including, but not limited to, the

implied warranties of merchantability or fitness for any particular purpose. Further, Bestechnic does not warrant the

accuracy or completeness of the information, text, graphics, or other items contained within this document.

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confidential

BES2300-L Product Specification

Rev 0.19 Page3 / 28 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd

Table of contents

Datasheet Status ................................................................................................................................................................... 2

Revision History .................................................................................................................................................................... 2

List of Tables and figures ...................................................................................................................................................... 5

1 General Description ...................................................................................................................................................... 6

1.1 Applications ............................................................................................................................................................ 6

1.2 Features .................................................................................................................................................................. 7

2 Platform Feature ........................................................................................................................................................... 8

2.1 MCU Subsystem ...................................................................................................................................................... 8

2.2 Memory .................................................................................................................................................................. 8

2.3 System Peripherals.................................................................................................................................................. 9

2.4 Power Management ............................................................................................................................................... 9

2.5 Audio Interface ....................................................................................................................................................... 9

3 Bluetooth Modem Description ................................................................................................................................... 11

3.1 Radio ..................................................................................................................................................................... 11

3.2 Auxiliary feature .................................................................................................................................................... 11

3.3 Bluetooth Stack ..................................................................................................................................................... 11

4 Electrical Characteristics ............................................................................................................................................. 12

4.1 Electrical Characteristics ....................................................................................................................................... 12

4.2 Bluetooth Radio Electrical Characteristics ............................................................................................................ 13

4.3 Audio Codec Electrical Characteristics .................................................................................................................. 15

4.4 BUCK Electrical Characteristics ............................................................................................................................. 17

5 Pin Map & Application Schematic ............................................................................................................................... 18

5.1 Pin Description ...................................................................................................................................................... 18

5.2 Application Schematic........................................................................................................................................... 21

6 Package Dimensions ................................................................................................................................................... 22

6.1 BGA Dimensions .................................................................................................................................................... 22

7 SMT Caution ................................................................................................................................................................ 23

7.1 Land Pad and Stencil Design ................................................................................................................................. 23

7.2 Solder Reflow Profile ............................................................................................................................................ 23

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confidential

BES2300-L Product Specification

Rev 0.19 Page5 / 28 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd

List of Tables and figures

Table 4-1 DC Electrical Specification (Recommended Operation Conditions) ............................................................ 12

Table 4-2 DC Electrical Specification (Absolute Maximum Ratings) ........................................................................... 12

Table 4-3 Power Consumption.................................................................................................................................... 12

Table 4-4 Receiver Characteristics - Basic Data Rate .................................................................................................. 13

Table 4-5 Transmitter Characteristics - Basic Data Rate ............................................................................................. 13

Table 4-6 Receiver Characteristics - Enhanced Data Rate .......................................................................................... 14

Table 4-7 Transmitter Characteristics - Enhanced Data Rate ..................................................................................... 15

Table 4-8 Digital to Analogue Converter under 1.95V ................................................................................................ 15

Table 4-9 Codec - Analogue to Digital Converter under 1.95V ................................................................................... 16

Table 4-10 DCDC Characteristics ................................................................................................................................. 17

Table 5-1 BES2300-L Pins Description ......................................................................................................................... 18

Table 7-1 Package peak reflow temperature - Sn/Pb ................................................................................................. 23

Table 7-2 Package peak reflow temperature - Pb-Free .............................................................................................. 23

Table 7-3 Solder Reflow Profile Feature ..................................................................................................................... 24

Figure 1-1 BES2300-L Top View .................................................................................................................................... 6

Figure 2-1 Platform Architecture .................................................................................................................................. 8

Figure 5-1 BES2300-L Pins ........................................................................................................................................... 18

Figure 6-1 BES2300-L Dimension ................................................................................................................................ 22

Figure 7-1 Solder Reflow Profile ................................................................................................................................. 23

Figure 9-1 Tape Orientation ........................................................................................................................................ 27

Figure 9-2 Reel Dimensions ........................................................................................................................................ 27

Figure 9-3 Tape Dimensions........................................................................................................................................ 28

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confidential