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datasheet_scl3300-d01.pdf
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scl3300-d01,datasheet,数据描述表,高性能3轴倾角传感器 在倾斜测定方面具有超高性能 尺寸: 7.6×8.6×3.3mm (宽×长×高) 针对用途以及要求值可从4种模式中选择测定模式 超低噪声、高分辨率 0.001°/√Hz SPI数字接口 使用温度范围:-40~125℃ 供给电源:3.0~3.6V 优越的机械阻尼特性 尺寸: 8.6×7.6×3.3mm (长×宽×高) 成熟的静电容量3D-MEMS技术 特点: 高性能 坚固耐用设计 应用: SCL3300针对在严苛的环境中有较高稳定性需求的应用 主要用途例 水平仪 倾斜补偿 机器控制 结构健康监测 惯性测量装置(IMUs) 机器人 定位导航系统
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1 (41)
Murata Electronics Oy SCL3300-D01 Doc.No. 4921
www.murata.com Rev. 1
Data Sheet
SCL3300-D01
3-axis inclinometer with angle output
and digital SPI interface
Features
3-axis (XYZ) inclinometer
User selectable measurement modes:
3000 LSB/g with 70 Hz LPF
6000 LSB/g with 40 Hz LPF
12000 LSB/g with 10 Hz LPF
Angle output resolution 0.0055°/LSB
−40°C…+125°C operating range
3.0V…3.6V supply voltage
SPI digital interface
Ultra-low 0.001 °/√Hz noise density
Excellent offset stability
Size 8.6 x 7.6 x 3.3 mm (l × w × h)
Proven capacitive 3D-MEMS technology
Applications
SCL3300-D01 is targeted at applications demanding high
stability and accuracy with tough environmental
requirements.
Typical applications include:
Leveling
Tilt sensing
Machine control
Structural health monitoring
Inertial measurement units (IMUs)
Robotics
Positioning and guidance systems
Overview
The SCL3300-D01 is a high performance inclinometer sensor component. It is a three-axis inclinometer sensor with
angle output based on Murata's proven capacitive 3D-MEMS technology. Signal processing is done in a mixed
signal ASIC with flexible SPI digital interface. Sensor element and ASIC are packaged into 12 pin pre-molded
plastic housing that guarantees reliable operation over product's lifetime.
The SCL3300-D01 is designed, manufactured and tested for high stability, reliability and quality requirements. The
component has extremely stable output over wide range of temperature and vibration. The component has several
advanced self-diagnostics features, is suitable for SMD mounting and is compatible with RoHS and ELV directives.
2 (41)
Murata Electronics Oy SCL3300-D01 Doc.No. 4921
www.murata.com Rev. 1
TABLE OF CONTENTS
1 Introduction ................................................................................................................................... 4
2 Specifications ............................................................................................................................... 4
2.1 Abbreviations ........................................................................................................................... 4
2.2 General Specifications ............................................................................................................. 4
2.3 Performance Specifications for Inclinometer ........................................................................... 5
2.4 Performance Specification for Temperature Sensor ............................................................... 7
2.5 Specification for Angle Outputs ............................................................................................... 7
2.6 Absolute Maximum Ratings ..................................................................................................... 7
2.7 Pin Description ........................................................................................................................ 8
2.8 Performance characteristics .................................................................................................... 9
2.9 Digital I/O Specification ......................................................................................................... 10
2.9.1 SPI DC Characteristics ..................................................................................................... 10
2.9.2 SPI AC Characteristics ..................................................................................................... 11
2.10 Measurement Axis and Directions ......................................................................................... 12
2.11 Package Characteristics ........................................................................................................ 13
2.11.1 Package Outline Drawing .............................................................................................. 13
2.12 PCB Footprint ........................................................................................................................ 14
3 General Product Description ..................................................................................................... 14
3.1 Factory Calibration ................................................................................................................ 15
4 Component Operation, Reset and Power Up ........................................................................... 15
4.1 Component Operation ........................................................................................................... 15
4.2 Start-up sequence ................................................................................................................. 16
4.3 Operation modes ................................................................................................................... 17
5 Component Interfacing .............................................................................................................. 17
5.1.1 General ............................................................................................................................. 17
5.1.2 Protocol ............................................................................................................................ 17
5.1.3 SPI frame ......................................................................................................................... 19
5.1.4 Operations ........................................................................................................................ 20
5.1.5 Return Status ................................................................................................................... 21
5.2 Checksum (CRC) .................................................................................................................. 21
6 Register Definition ...................................................................................................................... 22
6.1 Sensor Data Block ................................................................................................................. 24
6.1.1 Example of Acceleration Data Conversion ....................................................................... 25
6.1.2 Example of Temperature Data Conversion ...................................................................... 26
3 (41)
Murata Electronics Oy SCL3300-D01 Doc.No. 4921
www.murata.com Rev. 1
6.1.3 Example of Angle Data Conversion ................................................................................. 27
6.2 STO ....................................................................................................................................... 28
6.2.1 Example of Self-Test Analysis .......................................................................................... 29
6.3 STATUS ................................................................................................................................ 30
6.4 Error Flag Block ..................................................................................................................... 31
6.4.1 ERR_FLAG1 .......................................................................................................................... 31
6.4.2 ERR_FLAG2 .......................................................................................................................... 32
6.5 CMD ...................................................................................................................................... 33
6.6 ANG_CTRL ........................................................................................................................... 34
6.7 WHOAMI ............................................................................................................................... 34
6.8 Serial Block ............................................................................................................................ 35
6.8.1 Example of Resolving Serial Number ............................................................................... 35
6.9 SELBANK .............................................................................................................................. 37
7 Application information ............................................................................................................. 37
7.1 Application Circuitry and External Component Characteristics ............................................. 37
7.2 Assembly Instructions ............................................................................................................ 39
8 Frequently Asked Questions ..................................................................................................... 39
9 Order Information ....................................................................................................................... 40
4 (41)
Murata Electronics Oy SCL3300-D01 Doc.No. 4921
www.murata.com Rev. 1
1 Introduction
This document contains essential technical information about the SCL3300-D01 sensor
including specifications, SPI interface descriptions, user accessible register details,
electrical properties and application information. This document should be used as a
reference when designing in SCL3300-D01 component.
2 Specifications
2.1 Abbreviations
ASIC Application Specific Integrated Circuit
SPI Serial Peripheral Interface
RT Room Temperature, +23 °C
FS Full Scale
CSB Chip Select
SCK Serial Clock
MOSI Master Out Slave In
MISO Master In Slave Out
MCU Microcontroller
STO Self-test Output
2.2 General Specifications
General specifications for SCL3300-D01 component are presented in Table 1. All
analog voltages are related to the potential at AVSS and all digital voltages are related
to the potential at DVSS.
Table 1 General specifications
Parameter Condition Min Typ Max Units
Supply voltage: VDD, DVIO 3.0 3.3 3.6 V
Current consumption: I_VDD
Temperature range -40 ... +125 °C
Standard operation
Mode 4
1.2
2.1
mA
Current consumption: I_VDD in
power down mode
Temperature range -40 ... +125 °C
Power down mode (PD)
Typical value is at room temperature
(+23°C)
3 10 µA
5 (41)
Murata Electronics Oy SCL3300-D01 Doc.No. 4921
www.murata.com Rev. 1
2.3 Performance Specifications for Inclinometer
Table 2 Inclinometer performance specifications. Supply voltage VDD = 3.3 V and room
temperature (RT) +23 °C unless otherwise specified. Definition of gravitational acceleration:
g = 9.819 m/s
2
.
Parameter Condition Min Nom Max Unit
Measurement range
Mode 1
Mode 2
Mode 3, Mode 4
(A
1.8
3.6
-
g
Mode 1
Mode 2
Mode 3, Mode 4
(A
±90
±90
±10
°
Offset error
(B
-40°C ... +125°C
-20
-1.15
20
1.15
mg
°
Offset temperature drift
(C
-40°C ... +125°C
X, Y
-10
-0.57
10
0.57
mg
°
-40°C ... +125°C
Z
-15
-0.86
15
0.86
mg
°
Sensitivity (acceleration output)
Mode 1
Mode 2
Mode 3, Mode 4
6000
3000
12000
LSB/g
Mode 1
Mode 2
Mode 3, Mode 4
valid only between 0…1°
(D
105
52
209
LSB/°
Sensitivity (inclination output) All modes 182
LSB/°
Sensitivity error
(B
-40°C ... +125°C
Mode 1
-0.7 0.7 %
Sensitivity temperature drift
(C
-40°C ... +25°C
Mode 1
-0.3 0.3 %
Linearity error
(E
-1g ... +1g range
TBD
mg
Integrated noise (RMS,
accelerometer)
Mode 3, X, Y, Z channels
Mode 4, X, Z channels
Mode 4, Y channel
0.13
0.08
0.06
mg
RMS
Noise density
(F
Mode 3, X, Y, Z channels
Mode 4, X, Z channels
Mode 4, Y channel
32
20
15
µg/√Hz
Mode 3, X, Y, Z channels
Mode 4, X, Z channels
Mode 4, Y channel
0.0018
0.0012
0.0009
°/√Hz
Cross axis sensitivity
(G
per axis -1 1 %
Amplitude response,
-3dB frequency
Mode 1 40 Hz
Mode 2 70 Hz
Mode 3, Mode 4 10 Hz
Power on start-up time 15
(H
ms
ODR 2000 Hz
Min/Max values are ±3 sigma variation limits from test population at the minimum. Min/Max values are not guaranteed.
A) Inclination mode. Dynamic range is dependent on orientation in gravity.
B) Includes calibration error, temperature, supply voltage and drift over lifetime.
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