PCI EXPRESS 板卡设计指南: 1. Physical Interconnect Layout Design................................................ 5 1.1 Introduction ........................................................................................................ 5 1.2 Topology and Interconnect Overview .............................................................. 5 1.2.1 Card Interoperability ............................................................................................... 7 1.2.2 Bowtie Topology Considerations ............................................................................ 7 1.2.2.1 Lane Polarity Inversion.................................................................................................... 8 1.2.2.2 Lane Reversal and Width Negotiation ............................................................................. 8 1.3 Physical Layout Design Constraints............................................................... 11 1.3.1 PCB Stackup.......................................................................................................... 11 1.3.1.1 Desktop System Board and Add-in Card (4-layer) Stackup .......................................... 12 1.3.1.2 Server, Workstation and Mobile (6-layer, 8-layer and 10-layer) Stackups.................... 15 1.3.1.3 Add-in Card and Mobile (6-layer) Stackup ................................................................... 16 1.3.2 PCB Trace and Other Element Considerations ..................................................... 17 1.3.2.1 Differential Pair Width and Spacing Impacts ................................................................ 20 1.3.2.2 Differential Pair Length Restrictions and Budgets ........................................................ 23 1.3.2.3 Length Matching............................................................................................................ 24 1.3.2.4 Reference Planes............................................................................................................ 25 1.3.2.5 Breakout Area Specific Routing Guidelines .................................................................. 27 1.3.2.6 Edge Finger Design: Add-in Card ................................................................................. 29 1.3.2.7 Via Usage and Placement .............................................................................................. 30 1.3.2.8 Bends ............................................................................................................................. 32 1.3.2.9 Test Points and Probing ................................................................................................. 35 1.3.3 PCI Express Topologies ........................................................................................ 35 1.3.3.1 Interconnect Topologies for Two Components on the Baseboard ................................. 36 1.3.3.2 Interconnect Topologies for Baseboard with Add-in Card ............................................ 37 1.3.4 Passive Components and Connectors .................................................................... 38 1.3.4.1 AC Coupling Capacitors ................................................................................................ 38 1.3.4.2 Connectors ..................................................................................................................... 40 1.4 Summary........................................................................................................... 41
剩余40页未读,继续阅读
- 粉丝: 26
- 资源: 33
- 我的内容管理 收起
- 我的资源 快来上传第一个资源
- 我的收益 登录查看自己的收益
- 我的积分 登录查看自己的积分
- 我的C币 登录后查看C币余额
- 我的收藏
- 我的下载
- 下载帮助
会员权益专享
最新资源
- 27页智慧街道信息化建设综合解决方案.pptx
- 计算机二级Ms-Office选择题汇总.doc
- 单链表的插入和删除实验报告 (2).docx
- 单链表的插入和删除实验报告.pdf
- 物联网智能终端项目设备管理方案.pdf
- 如何打造品牌的模式.doc
- 样式控制与页面布局.pdf
- 武汉理工Java实验报告(二).docx
- 2021线上新品消费趋势报告.pdf
- 第3章 Matlab中的矩阵及其运算.docx
- 基于Web的人力资源管理系统的必要性和可行性.doc
- 基于一阶倒立摆的matlab仿真实验.doc
- 速运公司物流管理模式研究教材
- 大数据与管理.pptx
- 单片机课程设计之步进电机.doc
- 大数据与数据挖掘.pptx
评论5