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PCI Express
®
External Cabling
Specification
Revision 1.0
January 4, 2007
PCI EXPRESS EXTERNAL CABLING SPECIFICATION, REV. 1.0
2
Revision Revision History DATE
1.0
Initial public release.
1/4/2007
PCI-SIG
®
disclaims all warranties and liability for the use of this document and the information contained
herein and assumes no
responsibility for any errors that may appear in this document, nor does PCI-SIG
make a commitment to update the information contained herein.
Contact the PCI-SIG office to obtain the latest revision of this specification.
Questions regarding this specification or membership in PCI-SIG may be forwarded to:
Membership Services
www.pcisig.com
E-mail: administration@pcisig.com
Phone: 503-619-0569
Fax: 503-644-6708
Technical Support
techsupp@pcisig.com
DISCLAIMER
This specification is provided “as is” with no warranties whatsoever, including any warranty of
merchantability, noninfringement, fitness for any particular purpose, or any warranty otherwise arising
out of any proposal, specification, or sample. PCI-SIG disclaims all liability for infringement of
proprietary rights, relating to use of information in this specification. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted herein.
PCI, PCI Express, PCIe, ExpressModule, and PCI-SIG are trademarks or registered trademarks of PCI-
SIG.
*
All other product names are trademarks, registered trademarks, or servicemarks of their respective
owners.
Copyright © 2007 PCI-SIG
PCI EXPRESS EXTERNAL CABLING SPECIFICATION, REV. 1.0
3
Contents
1. INTRODUCTION .................................................................................................................11
1.1. TERMS AND ACRONYMS ................................................................................................ 11
1.2. REFERENCE DOCUMENTS............................................................................................... 12
1.3. DOCUMENTATION CONVENTIONS .................................................................................. 12
1.4. SPECIFICATION CONTENTS............................................................................................. 13
1.5. OBJECTIVES ................................................................................................................... 13
1.6. OVERVIEW ..................................................................................................................... 14
2. AUXILIARY SIGNALS .......................................................................................................15
2.1. SIGNAL COMPATIBILITY MATRIX .................................................................................. 16
2.2. POWER-DOMAIN ISOLATION .......................................................................................... 17
2.3. CABLE REFERENCE CLOCK (REQUIRED)........................................................................ 18
2.3.1. Clocking Dependencies........................................................................................... 19
2.3.2. Spread Spectrum Clock (SSC) Sources................................................................... 19
2.3.3. AC-coupling............................................................................................................ 19
2.3.4. Impact of Jitter on Bit Error Ratio (BER) .............................................................. 19
2.3.5. CREFCLK Distribution .......................................................................................... 20
2.4. CABLE PRESENT (REQUIRED)......................................................................................... 20
2.5. CABLE PLATFORM RESET (REQUIRED) .......................................................................... 22
2.6. CABLE POWER ON (REQUIRED) ..................................................................................... 23
2.7. SIDEBAND RETURN (REQUIRED).................................................................................... 24
2.8. CABLE WAKE# (REQUIRED)......................................................................................... 24
2.9. POWER (OPTIONAL +3.3V)............................................................................................ 26
2.10. ESD............................................................................................................................... 26
2.11. POWER SEQUENCING ..................................................................................................... 26
2.11.1. Power-Up Sequencing......................................................................................... 26
2.11.2. Power-Down Sequencing.................................................................................... 27
2.11.3. Power Management Sequencing......................................................................... 29
2.12. AUXILIARY SIGNAL PARAMETRIC SPECIFICATIONS ....................................................... 30
2.12.1. DC Specifications................................................................................................ 30
2.12.2. AC Specifications for Single-Ended Signals ....................................................... 32
2.12.3. Cable Reference Clock Specification.................................................................. 33
2.12.4. Phase Jitter.......................................................................................................... 37
3. PCI EXPRESS SIGNALS .....................................................................................................39
3.1. INTERCONNECT.............................................................................................................. 39
3.1.1. Link Definition ........................................................................................................ 40
3.2. ELECTRICAL BUDGETS................................................................................................... 41
3.2.1. AC-coupling............................................................................................................ 41
3.2.2. Insertion Loss.......................................................................................................... 42
3.2.3. Jitter Budgets .......................................................................................................... 43
3.2.4. Interconnect Jitter Budget Allocation..................................................................... 44
PCI EXPRESS EXTERNAL CABLING SPECIFICATION, REV. 1.0
4
3.2.5. Crosstalk ................................................................................................................. 46
3.2.6. Lane-to-Lane Skew.................................................................................................. 46
3.2.7. Equalization............................................................................................................ 46
3.2.8. Skew Within the Differential Pair (Intra-Pair Skew).............................................. 46
3.3. EYE DIAGRAMS COMPLIANCE MEASUREMENTS ............................................................ 47
3.3.1. Transmitter Compliance Eye .................................................................................. 47
3.3.2. Receiver Compliance Eye ....................................................................................... 48
3.4. ESD............................................................................................................................... 49
3.5. LINK POWER MANAGEMENT.......................................................................................... 49
4. CABLE INTEROPERABILITY ...........................................................................................51
4.1. CABLE CONNECTOR IDENTIFICATION ............................................................................ 51
4.2. CABLE LENGTH.............................................................................................................. 51
4.3. CABLE ASSEMBLY CONFIGURATION.............................................................................. 52
5. CONNECTOR DEFINITION ...............................................................................................53
5.1. SIGNAL DESCRIPTION .................................................................................................... 53
5.2. X1 CONNECTOR DEFINITION .......................................................................................... 53
5.2.1. Pin-out (x1)............................................................................................................. 53
5.2.2. Board-Side Mechanical Drawings.......................................................................... 55
5.2.3. Recommended Footprint......................................................................................... 57
5.2.4. Electrical Requirements.......................................................................................... 60
5.2.5. Current and Voltage Rating Requirements............................................................. 61
5.2.6. Mechanical Requirements....................................................................................... 61
5.3. X4 CONNECTOR DEFINITION .......................................................................................... 62
5.3.1. Pin-out (x4)............................................................................................................. 62
5.3.2. Board-Side Mechanical Drawings.......................................................................... 64
5.3.3. Recommended Foot Print ....................................................................................... 71
5.3.4. Electrical Requirements.......................................................................................... 73
5.3.5. Current and Voltage Rating Requirements............................................................. 73
5.3.6. Mechanical Requirements....................................................................................... 74
5.4. X8 CONNECTOR DEFINITION .......................................................................................... 74
5.4.1. Pin-out (x8)............................................................................................................. 74
5.4.2. Board-Side Mechanical Drawings.......................................................................... 77
5.4.3. Recommended Footprint......................................................................................... 86
5.4.4. Electrical Requirements.......................................................................................... 88
5.4.5. Current and Voltage Rating Requirements............................................................. 88
5.4.6. Mechanical Requirements....................................................................................... 89
5.5. X16 CONNECTOR DEFINITION ........................................................................................ 89
5.5.1. Pin-out (x16)........................................................................................................... 89
5.5.2. Board-Side Mechanical Drawings.......................................................................... 94
5.5.3. Recommended Footprint....................................................................................... 100
5.5.4. Electrical Requirements........................................................................................ 102
5.5.5. Current and Voltage Rating Requirements........................................................... 102
5.5.6. Mechanical Requirements..................................................................................... 102
5.6. CONNECTOR DURABILITY............................................................................................ 103
5.7. ENVIRONMENTAL PERFORMANCE................................................................................ 103
PCI EXPRESS EXTERNAL CABLING SPECIFICATION, REV. 1.0
5
6. CABLE SPECIFICATION..................................................................................................105
6.1. CABLE CONFIGURATION .............................................................................................. 105
6.1.1. x1 Cable Assembly................................................................................................ 105
6.1.2. x4 Cable Assembly................................................................................................ 110
6.1.3. x8 Cable Assembly................................................................................................ 117
6.1.4. x16 Cable Assembly.............................................................................................. 125
6.2. REQUIREMENTS............................................................................................................ 134
6.2.1. Physical and Mechanical Performance................................................................ 134
6.2.2. Electrical Performance......................................................................................... 135
6.3. SHIELDING ................................................................................................................... 139
6.4. ACTIVE CABLES........................................................................................................... 139
ACKNOWLEDGEMENTS.........................................................................................................141
剩余141页未读,继续阅读
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