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RCJ10J0030-0300
16
Rev.3.00
发行: 2007年 02月 14日
瑞萨FLASH微机编程系统
本资料所记载的内容,均为本资料发行时的信息,瑞萨科技对于本资料所记载的
产品或者规格可能会作改动,恕不另行通知。
请通过瑞萨科技的主页确认发布的最新信息。
瑞萨FLASH开发工具箱3.07
(Windows
®
98SE/Me,Windows
®
NT4.0,Windows
®
2000 and Windows
®
XP用
用户手册
1. This document is provided for reference purposes only so that Renesas customers may select the appropriate
Renesas products for their use. Renesas neither makes warranties or representations with respect to the
accuracy or completeness of the information contained in this document nor grants any license to any
intellectual property rights or any other rights of Renesas or any third party with respect to the information in
this document.
2. Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising
out of the use of any information in this document, including, but not limited to, product data, diagrams, charts,
programs, algorithms, and application circuit examples.
3. You should not use the products or the technology described in this document for the purpose of military
applications such as the development of weapons of mass destruction or for the purpose of any other military
use. When exporting the products or technology described herein, you should follow the applicable export
control laws and regulations, and procedures required by such laws and regulations.
4. All information included in this document such as product data, diagrams, charts, programs, algorithms, and
application circuit examples, is current as of the date this document is issued. Such information, however, is
subject to change without any prior notice. Before purchasing or using any Renesas products listed in this
document, please confirm the latest product information with a Renesas sales office. Also, please pay regular
and careful attention to additional and different information to be disclosed by Renesas such as that disclosed
through our website. (http://www.renesas.com )
5. Renesas has used reasonable care in compiling the information included in this document, but Renesas
assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information
included in this document.
6. When using or otherwise relying on the information in this document, you should evaluate the information in
light of the total system before deciding about the applicability of such information to the intended application.
Renesas makes no representations, warranties or guaranties regarding the suitability of its products for any
particular application and specifically disclaims any liability arising out of the application and use of the
information in this document or Renesas products.
7. With the exception of products specified by Renesas as suitable for automobile applications, Renesas
products are not designed, manufactured or tested for applications or otherwise in systems the failure or
malfunction of which may cause a direct threat to human life or create a risk of human injury or which require
especially high quality and reliability such as safety systems, or equipment or systems for transportation and
traffic, healthcare, combustion control, aerospace and aeronautics, nuclear power, or undersea communication
transmission. If you are considering the use of our products for such purposes, please contact a Renesas
sales office beforehand. Renesas shall have no liability for damages arising out of the uses set forth above.
8. Notwithstanding the preceding paragraph, you should not use Renesas products for the purposes listed below:
(1) artificial life support devices or systems
(2) surgical implantations
(3) healthcare intervention (e.g., excision, administration of medication, etc.)
(4) any other purposes that pose a direct threat to human life
Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who
elect to use Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas
Technology Corp., its affiliated companies and their officers, directors, and employees against any and all
damages arising out of such applications.
9. You should use the products described herein within the range specified by Renesas, especially with respect
to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
characteristics, installation and other product characteristics. Renesas shall have no liability for malfunctions or
damages arising out of the use of Renesas products beyond such specified ranges.
10. Although Renesas endeavors to improve the quality and reliability of its products, IC products have specific
characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use
conditions. Please be sure to implement safety measures to guard against the possibility of physical injury, and
injury or damage caused by fire in the event of the failure of a Renesas product, such as safety design for
hardware and software including but not limited to redundancy, fire control and malfunction prevention,
appropriate treatment for aging degradation or any other applicable measures. Among others, since the
evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or
system manufactured by you.
11. In case Renesas products listed in this document are detached from the products to which the Renesas
products are attached or affixed, the risk of accident such as swallowing by infants and small children is very
high. You should implement safety measures so that Renesas products may not be easily detached from your
products. Renesas shall have no liability for damages arising out of such detachment.
12. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written
approval from Renesas.
13. Please contact a Renesas sales office if you have any questions regarding the information contained in this
document, Renesas semiconductor products, or if you have any other inquiries.
Notes regarding these materials
1. ᴀ䌘᭭ᰃЎњ䅽⫼᠋ḍ⫼䗨䗝ᢽড়䗖ⱘᴀ݀ৌѻકⱘখ㗗䌘᭭ˈᇍѢᴀ䌘᭭Ё᠔䆄䕑ⱘᡔᴃֵᙃˈᑊ䴲ᛣ
ⴔᇍᴀ݀ৌ㗙ϝ㗙ⱘⶹ䆚ѻᴗঞ݊Ҫᴗ߽خߎֱ䆕ᇍᅲᮑᴗ䖯㸠ⱘᡓ䇎DŽ
2. ᇍѢՓ⫼ᴀ䌘᭭᠔䆄䕑ⱘѻક᭄ǃǃ㸼ǃᑣǃㅫ⊩ঞ݊Ҫᑨ⫼⬉䏃՟㗠ᓩ䍋ⱘᤳᆇ㗙ᇍϝ㗙ⱘ
ⶹ䆚ѻᴗঞ݊Ҫᴗ߽䗴៤։⢃ˈᴀ݀ৌϡᡓᢙӏԩ䋷ӏDŽ
3. ϡ㛑ᇚᴀ䌘᭭᠔䆄䕑ⱘѻકᡔᴃ⫼Ѣ㾘⸈ണᗻ℺఼ⱘᓔথㄝⳂⱘǃݯџⳂⱘ݊Ҫⱘݯ䳔⫼䗨ᮍ䴶DŽ
ˈߎষᯊᖙ乏䙉ᅜ᮹ᴀⱘlj∛ঞ䌌ᯧ⊩NJঞ݊ҪߎষⱘⳌ݇⊩Ҹᑊሹ㸠䖭ѯ⊩ҸЁ㾘ᅮⱘᖙ㽕
㓁DŽ
4. ᴀ䌘᭭᠔䆄䕑ⱘѻક᭄ǃǃ㸼ǃᑣǃㅫ⊩ҹঞ݊Ҫᑨ⫼⬉䏃՟ㄝ᠔ֵ᳝ᙃഛЎᴀ䌘᭭থ㸠ᯊⱘݙᆍˈ
ᴀ݀ৌ᳝ৃ㛑خџܜ䗮ⶹⱘᚙމϟˈᇍᴀ䌘᭭᠔䆄䕑ⱘѻક㗙ѻક㾘Ḑ䖯㸠ᬍDŽ᠔ҹ䌁фՓ⫼
ᴀ݀ৌⱘᇐԧѻકПࠡˈ䇋џܜᴀ݀ৌⱘ㧹Ϯにষ⹂䅸᳔ᮄⱘֵᙃᑊ㒣ᐌ⬭ᛣᴀ݀ৌ䗮䖛݀ৌЏ义
˄http://www.renesas.com˅ㄝ݀ᓔⱘ᳔ᮄֵᙃDŽ
5. ᇍѢᴀ䌘᭭Ё᠔䆄䕑ⱘֵᙃˈࠊᯊ៥Ӏሑֱ䆕ߎ⠜ᯊⱘ㊒⹂ᗻˈԚϡᡓᢙᴀ䌘᭭ⱘভ䗄ϡᔧ㗠㟈Փ乒
ᅶ䙁ফᤳ༅ㄝⱘӏԩⳌ݇䋷ӏDŽ
6. Փ⫼ᴀ䌘᭭᠔䆄䕑ⱘѻક᭄ǃǃ㸼ㄝ᠔⼎ⱘᡔᴃݙᆍǃᑣǃㅫ⊩ঞ݊Ҫᑨ⫼⬉䏃՟ᯊˈϡҙ㽕ᇍ᠔
Փ⫼ⱘᡔᴃֵᙃ䖯㸠⣀䆘Ӌˈ䖬㽕ᇍᭈϾ㋏㒳䖯㸠ܙߚⱘ䆘ӋDŽ䇋乒ᅶ㞾㸠䋳䋷ˈ䖯㸠ᰃ৺䗖⫼ⱘ߸ᮁDŽ
ᴀ݀ৌᇍѢᰃ৺䗖⫼ϡ䋳ӏԩ䋷ӏDŽ
7. ᴀ䌘᭭Ё᠔䆄䕑ⱘѻકᑊ䴲䩜ᇍϛϔߎ⦄ᬙ䱰ᰃ䫭䇃䖤㸠ህӮ࿕㚕ࠄҎⱘ⫳㒭Ҏԧᏺᴹᆇⱘᴎ఼ǃ
㋏㒳བ⾡ᅝܼ㺙㕂㗙䖤䕧Ѹ䗮⫼ⱘǃ⭫ǃ➗⚻ࠊǃ㟾఼ẄǃḌ㛑ǃ⍋ᑩЁ㒻⫼ⱘᴎ఼㋏㒳ㄝ
㗠䆒䅵ࠊ䗴ⱘ⡍߿ᰃᇍѢક䋼ৃ䴴ᗻ㽕∖ᵕ催ⱘᴎ఼㋏㒳ㄝ˄ᇚᴀ݀ৌᣛᅮ⫼Ѣ≑䔺ᮍ䴶ⱘѻક⫼
Ѣ≑䔺ᯊ䰸˅DŽབᵰ㽕⫼ѢϞ䗄ⱘⳂⱘˈ䇋ࡵᖙџܜᴀ݀ৌⱘ㧹Ϯにষ䆶DŽˈᇍѢ⫼ѢϞ䗄Ⳃⱘ
㗠䗴៤ⱘᤳ༅ㄝˈᴀ݀ৌὖϡ䋳䋷DŽ
8. 䰸Ϟ䗄乍ݙᆍˈϡ㛑ᇚᴀ䌘᭭Ё䆄䕑ⱘѻક⫼Ѣҹϟ⫼䗨DŽབᵰ⫼Ѣҹϟ⫼䗨㗠䗴៤ⱘᤳ༅ˈᴀ݀ৌ
ὖϡ䋳䋷DŽ
1˅⫳㓈ᣕ㺙㕂DŽ
2˅ỡඟѢҎԧՓ⫼ⱘ㺙㕂DŽ
3˅⫼Ѣ⊏⭫˄ߛ䰸ᙷ䚼ǃ㒭㥃ㄝ˅ⱘ㺙㕂DŽ
4˅݊ҪⳈᕅડࠄҎⱘ⫳ⱘ㺙㕂DŽ
9. Փ⫼ᴀ䌘᭭᠔䆄䕑ⱘѻકᯊˈᇍѢ᳔乱ᅮؐǃᎹ⬉⑤⬉ⱘ㣗ೈǃᬒ⛁⡍ᗻǃᅝ㺙ᴵӊঞ݊Ҫᴵӊ䇋
ᴀ݀ৌ㾘ᅮⱘֱ䆕㣗ೈݙՓ⫼DŽབᵰ䍙ߎњᴀ݀ৌ㾘ᅮⱘֱ䆕㣗ೈՓ⫼ᯊˈᇍѢ⬅ℸ㗠䗴៤ⱘᬙ䱰ߎ⦄
ⱘџᬙˈᴀ݀ৌᇚϡᡓᢙӏԩ䋷ӏDŽ
10.ᴀ݀ৌϔⳈ㟈Ѣᦤ催ѻકⱘ䋼䞣ৃ䴴ᗻˈԚϔ㠀ᴹ䇈ˈᇐԧѻકᘏӮҹϔᅮⱘὖ⥛থ⫳ᬙ䱰ǃ㗙⬅
ѢՓ⫼ᴵӊϡৠ㗠ߎ⦄䫭䇃䖤㸠ㄝDŽЎњ䙓ܡᴀ݀ৌⱘѻકথ⫳ᬙ䱰㗙䫭䇃䖤㸠㗠ᇐ㟈Ҏ䑿џᬙ☿♒
䗴៤⼒Ӯᗻⱘᤳ༅ˈᏠᳯᅶ᠋㛑㞾㸠䋳䋷䖯㸠ݫԭ䆒䅵ǃ䞛পᓊ⚻ᇍㄪঞ䖯㸠䰆ℶ䫭䇃䖤㸠ㄝⱘᅝܼ䆒䅵
˄ࣙᣀ⹀ӊ䕃ӊϸᮍ䴶ⱘ䆒䅵˅ҹঞ㗕࣪໘⧚ㄝˈ䖭ᰃЎᴎ఼㋏㒳ⱘߎֱ䆕DŽ⡍߿ᰃ⠛ᴎⱘ䕃ӊˈ
⬅Ѣ⣀䖯㸠偠䆕ᕜೄ䲒ˈ᠔ҹ㽕∖乒ᅶࠊ䗴ⱘ᳔㒜ⱘᴎ఼ঞ㋏㒳Ϟ䖯㸠ᅝܼẔ偠ᎹDŽ
11. བᵰᡞᴀ䌘᭭᠔䆄䕑ⱘѻકҢ݊䕑ԧ䆒Ϟϟˈ᳝ৃ㛑䗴៤၈ܓ䇃৲ⱘ䰽DŽ乒ᅶᇚᴀ݀ৌѻકᅝ㺙ࠄ
乒ᅶⱘ䆒Ϟᯊˈ䇋乒ᅶ㞾㸠䋳䋷ᇚᴀ݀ৌѻક䆒㕂Ўϡᆍᯧ࠹㨑ⱘᅝܼ䆒䅵DŽབᵰҢ乒ᅶⱘ䆒Ϟ࠹㨑㗠
䗴៤џᬙᯊˈᴀ݀ৌᇚϡᡓᢙӏԩ䋷ӏDŽ
12.ᕫࠄᴀ݀ৌⱘџܜк䴶䅸ৃᯊˈϡৃᇚᴀ䌘᭭ⱘϔ䚼ߚ㗙ܼ䚼䕀䕑㗙ࠊDŽ
13.བᵰ䳔㽕њ㾷݇Ѣᴀ䌘᭭ⱘ䆺㒚ݙᆍˈ㗙᳝݊Ҫ݇ᖗⱘ䯂乬ˈ䇋ᴀ݀ৌⱘ㧹Ϯにষ䆶DŽ
݇Ѣ߽⫼ᴀ䌘᭭ᯊⱘ⊼ᛣџ乍
⊼ᛣ
ᴀ᭛াᰃখ㗗䆥᭛ˈࠡ义᠔䕑㣅᭛⠜“Cautions”᳝ℷᓣᬜDŽ
前言
关于本手册
本手册将说明瑞萨 FLASH 开发工具箱 (以下简称 FDT)的使用方法。
第 1 章, [ 简介 ],对本工具及其特点进行了简要说明。
第 2 章, [ 系统概要 ],说明 FDT 图形用户界面 (GUI)的功能构成。
第 3 章, [FDT 的使用方法 ],对 FDT 的启动和 FLASH ROM 的写入进行简单的说明。
第 4 章, [ 等待脚本 ]
第 5 章, [ 存取权限 ],说明用户名和密码的设定。
第 6 章, [ 用户界面的配置 ],说明 FDT 图形用户界面的配置方法。
第 7 章, [ 菜单 ] 和第 8 章, [ 窗口 ],说明菜单和窗口的操作方法及功能。
第 9 章, [Simple Interface Mode],说明简化的 FDT 图形用户界面的使用方法。
第 10 章, [Basic Simple Interface Mode],说明无需设置工作空间 (Workspace)及工程 (Project)的简化
FDT 图形用户界面的使用方法。
第 11 章, [ 现场写入 ],说明如何利用现场写入功能向其他的 FDT 用户发送工程,以及如何使用该工程。
第 12 章, [E8 的升级
],说明 FDT 如何更新 E8 固化软件。
第 13 章, [E8Direct],说明如何将 E8 作为 E8Direct 来使用。
第 14 章, [QzROM 的程序设计 ],说明瑞萨 FLASH 产品的新型程序设计。
第 15 章, [ 锁定 ],说明当使用具有擦除块锁定功能的芯片时的 FDT 运行。
第 16 章, [ 升级到 FDT3.07],说明升级到 FDT3.07 时的注意事项。
前提
本手册以用户使用过 Microsoft
®
Windows
®
的应用程序为前提。
.
缩写
Target / Device
连接到 (用于编程的) PC 的可编程微控制器或微机
DLL Dynamic Linked Library
FDT FLASH Development Toolkit
F-ZTAT
®
Flexible Zero Turn-Around Time
QzROM
只可编程一次的存储器
HEW Renesas High-performance Embedded Workshop
PC Personal Computer
USB
Universal Serial Bus 1.1 以上
FDM
FLASH Development Module (USB 接口电路板)
UPB
Universal Programming Board – 结合 Protocol A (Legacy) 芯片核心程序使用的 Legacy HMSE 接口电
路板
HMSE
Hitachi Micro Systems Europe Ltd. – Renesas Technology Europe Engineering Division 部分以前的名
称
FCF
FLASH Configuration File – 用于保存芯片及闪存特性的信息。
DDI
Device Data Image – 这是一种混合型 S-Record 文件格式,可在拥有多个闪存区的芯片中保存数据。
Kernel
这是用于控制芯片的代码,拥有再编程功能。这种代码多被下载到芯片中。
Micro Kernel
这是芯片核心程序中最先被执行的部分,可进行初始配置及主核心程序的下载。
Main Kernel
这是芯片核心程序中被微核心程序下载的部分,(若需要)可下载具有读、写、空白检查、擦除等功
能的附加模块。
E8 / E8USB
这是一种 USB 接口电路板。支持单线接口的编程及 4 线接口的时钟同步编程等。
FoUSB
是由 RTA 开发的 USB 接口电路板,用于闪存的写入以及内部电路的调试。在亚洲地区的 FDT 版本中
暂不支持。
Field
Programming –
Publishing
此功能可将所有的核心程序文件及数据文件合成一个文件,轻松发送到其他 FDT 用户。
E8Direct
(使用现有的 E8 硬件)对于 E8 进行了升级的固件。其设计与 FDM 极其相似。
剩余120页未读,继续阅读
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