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AP6255-datasheet-V1.1-04262015.pdf
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更新于2023-05-27
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AP6255是一款支持蓝牙BT4.2+WiFi支持11ac双频的蓝牙11ac双频WiFi二合一模块,采用博通BCM43455方案,支持Win10/Android操作系统;
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AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
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SPECIFICATION
SPEC. NO.:
::
: REV: 1.1
DATE:
::
: 04. 26. 2015
PRODUCT NAME:
::
: AP6255
APPROVED CHECKED PREPARED DCC ISSUE
NAME

AMPAK Technology Inc. www.ampak.com.tw Proprietary & Confidential Information
Doc. NO:
1
AMPAK
AP6255
WiFi 11ac + Bluetooth 4.1
Module Spec Sheet

AP6255 Datasheet
AMPAK Technology Inc. www.ampak.com.tw
Proprietary & Confidential Information
Doc. NO:
2
Revision History
Date Revision Content Revised By
Version
2015/04/09 - Preliminary Gary 1.0
2015/04/26 - Add GPIO pin definiion Gary 1.1

AP6255 Datasheet
AMPAK Technology Inc. www.ampak.com.tw
Proprietary & Confidential Information
Doc. NO:
3
Contents
Contents ................................................................................................................... 3
1. Introduction ......................................................................................................... 4
2. Features............................................................................................................... 5
3. Deliverables ........................................................................................................ 6
3.1 Deliverables .................................................................................................... 6
3.2 Regulatory certifications ......................
........................................................... 6
4. General Specification ......................................................................................... 7
4.1 General Specification ...................................................................................... 7
4.2 Voltages .......................................................................................................... 7
4.2.1 Absolute Maximum Ratings .................................................................... 7
4.2.2 Recommended Operating Rating ........................................................... 7
The module requires two power supplies: VBAT and VDDIO. ......................... 7
5. Wi-Fi RF Specification ........................................................................................ 8
5.1 2.4GHz RF Specification................................................................................. 8
5.1 5GHz RF Specification.................................................................................. 10
6. Bluetooth Specification .................................................................................... 13
6.1 Bluetooth Specification ................................................................................. 13
7. Pin Assignments ............................................................................................... 14
7.1 Pin Outline .................................................................................................... 14
7.2 Pin Definition .................................
............................................................... 14
8. Dimensions ....................................................................................................... 16
8.1 Physical Dimensions .................................................................................... 16
8.2 Layout Recommendation .............................................................................. 17
9. External clock reference .................................................................................. 18
10.1 SDIO Pin Description .................................................................................. 19
10. Host Interface Timing Diagram ........................................................................ 20
10.1 Power-up Sequence Timing Diagram ......................................................... 20
10.2 SDIO Default Mode Timing Diagram........................................................... 22
10.3 SDIO High Speed Mode Timing Diagram ................................................... 23
10.4 SDIO Bus Timing Specifications in SDR Modes ......................................... 24
10.5 SDIO Bus Timing Specifications in DDR50 Mode ....................................... 26
11. Recommended Reflow Profile ......................................................................... 28
Solder Paste definition .......................................................................................... 29
12. Package Information ............................
............................................................ 30
12.1 Label ........................................................................................................... 30
Label C
Inner box label . .................................................................................... 30
Label D
Carton box label . ................................................................................. 30

AP6255 Datasheet
AMPAK Technology Inc. www.ampak.com.tw
Proprietary & Confidential Information
Doc. NO:
4
12.2 Dimension ................................................................................................... 31
12.3 MSL Level / Storage Condition ................................................................... 33
1. Introduction
AMPAK Technology would like to announce a low-cost and low-power consumption module
which has all of the Wi-Fi, Bluetooth functionalities. The highly integrated module makes the
possibilities of web browsing, VoIP, Bluetooth headsets applications. With seamless roaming
capabilities and advanced security, also could interact with different vendors’
802.11a/b/g/n/ac Access Points in the wireless LAN.
The wireless module complies with IEEE 802.11 a/b/g/n/ac standard and it can achieve up
to a speed of 433.3Mbps with single stream in 802.11ac draft to connect to the wireless LAN.
The integrated module provides SDIO interface for Wi-Fi, UART / PCM interface for
Bluetooth.
This compact module is a total solution for a combination of Wi-Fi + BT technologies. The
module is specifically developed for Smart phones and Portable devices.
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