AEC - Q100 - REV-I
May 30, 2017
Component Technical Committee
Automotive Electronics Council
Revision Summary
This informative section briefly describes the changes made in the AEC-Q100 Rev-I document, compared to
previous document version, AEC-Q100 Rev-H (Sept. 11, 2014). Punctuation and text improvements are not
included in this summary.
• Section 1.2.1 – Automotive Reference Documents: Added reference to AEC-Q006 Qualification
Requirements for Components Using Copper (Cu) Wire Interconnections
• NEW Section 1.3.6 – Flip-Chip Ball Grid Array (FC-BGA) Package Configuration: Added new definition
for FC-BGA
• NEW Figure 1 – Illustration of a Flip-Chip BGA Package Configuration: Added new Figure illustrating FC-
BGA
• NEW Section 3.4 – Qualification of a Device Using Copper (Cu) Wire Interconnects: Added new section
on qualification of devices using Cu wire
• Table 2 – Qualification Test Methods:
o Added note C (Cu Wire) to tests A2, A4, A5, and A6
o Added note F (FC-BGA) to tests A1-A6, B1-B3, C3-C5, C7-C9, E1-E5, and E10
o Added NEW tests C7 (BST – Bump Shear Test), C8 (DPT – Die Pull/Peeling Test), and C9
(LPT - Lid/Heat Sink Pull Test)
o Table 2 Legend: Added Note C reference for Cu wire devices and Note F for FC-BGA
devices
• Table 3 – Process Change Qualification Guidelines for the Selection of Tests:
o Added NEW Tests C7 (BST – Bump Shear Test), C8 (DPT – Die Pull/Peeling Test), and C9
(LPT - Lid/Heat Sink Pull Test)
o Added NEW Wafer section and process change items Redistribution, Under Bump Metal,
Bump Material, and Bump Site Transfer
o Added NEW letter P for Cu Wire to Wire Bonding process change
• Appendix 1 – Definition of a Product Qualification Family: Complete revision
o Section A1.3 – Assembly Process: Added reference for FC-BGA
• Appendix 2 – Q100 Certification of Design, Construction and Qualification
o Added NEW Section 12a – Wafer Bump and sub-items UBM stack & thickness, UBM
dimensions, Bump dimensions, and Bump materials
• Appendix Template 4A – AEC-Q100 Qualification Test Plan:
o Added NEW Tests C7 (BST – Bump Shear Test), C8 (DPT – Die Pull/Peeling Test), and C9
(LPT - Lid/Heat Sink Pull Test)
• Appendix Template 4B – AEC-Q100 Generic Data:
o Added NEW Tests C7 (BST – Bump Shear Test), C8 (DPT – Die Pull/Peeling Test), and C9
(LPT - Lid/Heat Sink Pull Test)
o Added FC-BGA reference and attributes to A1.3 Assembly Process Section
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