没有合适的资源?快使用搜索试试~ 我知道了~
首页AEC_Q100_Rev_I.pdf
资源详情
资源评论
资源推荐
AEC - Q100 - Rev-I
May 30, 2017
FAILURE MECHANISM BASED
STRESS TEST QUALIFICATION
FOR
INTEGRATED CIRCUITS
Component Technical Committee
Automotive Electronics Council
AEC - Q100 - REV-I
May 30, 2017
Component Technical Committee
Automotive Electronics Council
TABLE OF CONTENTS
AEC-Q100 Failure Mechanism Based Stress Test Qualification for Integrated Circuits
Appendix 1: Definition of a Qualification Family
Appendix 2: Q100 Certification of Design, Construction and Qualification
Appendix 3: Plastic Package Opening for Wire Bond Testing
Appendix 4: Minimum Requirements for Qualification Plans and Results
Appendix 5: Part Design Criteria to Determine Need for EMC Testing
Appendix 6: Part Design Criteria to Determine Need for SER Testing
Appendix 7 AEC-Q100 and the Use of Mission Profiles
Attachments
AEC-Q100-001: WIRE BOND SHEAR TEST
AEC-Q100-002: HUMAN BODY MODEL (HBM) ELECTROSTATIC DISCHARGE (ESD) TEST
AEC-Q100-003: MACHINE MODEL (MM) ELECTROSTATIC DISCHARGE (ESD) TEST
(DECOMMISSIONED)
AEC-Q100-004: IC LATCH-UP TEST
AEC-Q100-005: NONVOLATILE MEMORY WRITE/ERASE ENDURANCE, DATA RETENTION,
AND OPERATIONAL LIFE TEST
AEC-Q100-006: ELECTRO-THERMALLY INDUCED PARASITIC GATE LEAKAGE (GL) TEST
(DECOMMISSIONED)
AEC-Q100-007: FAULT SIMULATION AND TEST GRADING
AEC-Q100-008: EARLY LIFE FAILURE RATE (ELFR)
AEC-Q100-009: ELECTRICAL DISTRIBUTION ASSESSMENT
AEC-Q100-010: SOLDER BALL SHEAR TEST
AEC-Q100-011: CHARGED DEVICE MODEL (CDM) ELECTROSTATIC DISCHARGE (ESD)
TEST
AEC-Q100-012: SHORT CIRCUIT RELIABILITY CHARACTERIZATION OF SMART POWER
DEVICES FOR 12V SYSTEMS
AEC - Q100 - REV-I
May 30, 2017
Component Technical Committee
Automotive Electronics Council
Revision Summary
This informative section briefly describes the changes made in the AEC-Q100 Rev-I document, compared to
previous document version, AEC-Q100 Rev-H (Sept. 11, 2014). Punctuation and text improvements are not
included in this summary.
• Section 1.2.1 – Automotive Reference Documents: Added reference to AEC-Q006 Qualification
Requirements for Components Using Copper (Cu) Wire Interconnections
• NEW Section 1.3.6 – Flip-Chip Ball Grid Array (FC-BGA) Package Configuration: Added new definition
for FC-BGA
• NEW Figure 1 – Illustration of a Flip-Chip BGA Package Configuration: Added new Figure illustrating FC-
BGA
• NEW Section 3.4 – Qualification of a Device Using Copper (Cu) Wire Interconnects: Added new section
on qualification of devices using Cu wire
• Table 2 – Qualification Test Methods:
o Added note C (Cu Wire) to tests A2, A4, A5, and A6
o Added note F (FC-BGA) to tests A1-A6, B1-B3, C3-C5, C7-C9, E1-E5, and E10
o Added NEW tests C7 (BST – Bump Shear Test), C8 (DPT – Die Pull/Peeling Test), and C9
(LPT - Lid/Heat Sink Pull Test)
o Table 2 Legend: Added Note C reference for Cu wire devices and Note F for FC-BGA
devices
• Table 3 – Process Change Qualification Guidelines for the Selection of Tests:
o Added NEW Tests C7 (BST – Bump Shear Test), C8 (DPT – Die Pull/Peeling Test), and C9
(LPT - Lid/Heat Sink Pull Test)
o Added NEW Wafer section and process change items Redistribution, Under Bump Metal,
Bump Material, and Bump Site Transfer
o Added NEW letter P for Cu Wire to Wire Bonding process change
• Appendix 1 – Definition of a Product Qualification Family: Complete revision
o Section A1.3 – Assembly Process: Added reference for FC-BGA
• Appendix 2 – Q100 Certification of Design, Construction and Qualification
o Added NEW Section 12a – Wafer Bump and sub-items UBM stack & thickness, UBM
dimensions, Bump dimensions, and Bump materials
• Appendix Template 4A – AEC-Q100 Qualification Test Plan:
o Added NEW Tests C7 (BST – Bump Shear Test), C8 (DPT – Die Pull/Peeling Test), and C9
(LPT - Lid/Heat Sink Pull Test)
• Appendix Template 4B – AEC-Q100 Generic Data:
o Added NEW Tests C7 (BST – Bump Shear Test), C8 (DPT – Die Pull/Peeling Test), and C9
(LPT - Lid/Heat Sink Pull Test)
o Added FC-BGA reference and attributes to A1.3 Assembly Process Section
AEC - Q100 - REV-I
May 30, 2017
Component Technical Committee
Automotive Electronics Council
Acknowledgment
Any document involving a complex technology brings together experience and skills from many sources. The
Automotive Electronics Council would especially like to recognize the following significant contributors to the
revision of this document:
AEC-Q100 Flip-Chip BGA Sub-Committee Members:
Klaus Pietrczak AMKOR
Evelyn Brandlhofer AMS
Maricel Wolfertz Autoliv
James Roberts Continental Corporation
Ramon Aziz Delphi Corporation
Ulrich Abelein Infineon Technologies
Werner Kanert Infineon Technologies
Tim Haifley Intel
Ife Hsu Intel
Robert Kinyanjui John Deere
Sheila Dal Lattice Semiconductor
Tom Lawler Lattice Semiconductor
Arnaud Devos Melexis
Richard Oshiro Monolithic Power
Bob Knoell [Q100 Team Leader] NXP Semiconductors
Romuald Roucou NXP Semiconductors
Henri Wijk NXP Semiconductors
Lee McNally Texas Instruments
Larry Ting Texas Instruments
Weiyen Kuo TSMC
Ron Boja Xilinx
Krimo Semmoud [FC-BGA Sub-Committee Leader] Xilinx
Inderjit Singh Xilinx
Antai Xu Xilinx
Desmond Yeo Xilinx
AEC - Q100 - REV-I
May 30, 2017
Component Technical Committee
Automotive Electronics Council
NOTICE
AEC documents contain material that has been prepared, reviewed, and approved through the AEC Technical
Committee.
AEC documents are designed to serve the automotive electronics industry through eliminating
misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of
products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use
by those other than AEC members, whether the standard is to be used either domestically or internationally.
AEC documents are adopted without regard to whether or not their adoption may involve patents or articles,
materials, or processes. By such action AEC does not assume any liability to any patent owner, nor does it
assume any obligation whatever to parties adopting the AEC documents. The information included in AEC
documents represents a sound approach to product specification and application, principally from the
automotive electronics system manufacturer viewpoint. No claims to be in Conformance with this document
shall be made unless all requirements stated in the document are met.
Inquiries, comments, and suggestions relative to the content of this AEC document should be addressed to the
AEC Technical Committee on the link http://www.aecouncil.com.
Published by the Automotive Electronics Council.
This document may be downloaded free of charge, however AEC retains the copyright on this material. By
downloading this file, the individual agrees not to charge for or resell the resulting material.
Printed in the U.S.A.
All rights reserved
Copyright © 2017 by the Automotive Electronics Council. This document may be freely reprinted with this
copyright notice. This document cannot be changed without approval from the AEC Component Technical
Committee.
剩余48页未读,继续阅读
weixin_39405465
- 粉丝: 0
- 资源: 1
上传资源 快速赚钱
- 我的内容管理 收起
- 我的资源 快来上传第一个资源
- 我的收益 登录查看自己的收益
- 我的积分 登录查看自己的积分
- 我的C币 登录后查看C币余额
- 我的收藏
- 我的下载
- 下载帮助
会员权益专享
最新资源
- 2022年中国足球球迷营销价值报告.pdf
- 房地产培训 -营销总每天在干嘛.pptx
- 黄色简约实用介绍_汇报PPT模板.pptx
- 嵌入式系统原理及应用:第三章 ARM编程简介_3.pdf
- 多媒体应用系统.pptx
- 黄灰配色简约设计精美大气商务汇报PPT模板.pptx
- 用matlab绘制差分方程Z变换-反变换-zplane-residuez-tf2zp-zp2tf-tf2sos-sos2tf-幅相频谱等等.docx
- 网络营销策略-网络营销团队的建立.docx
- 电子商务示范企业申请报告.doc
- 淡雅灰低面风背景完整框架创业商业计划书PPT模板.pptx
- 计算模型与算法技术:10-Iterative Improvement.ppt
- 计算模型与算法技术:9-Greedy Technique.ppt
- 计算模型与算法技术:6-Transform-and-Conquer.ppt
- 云服务安全风险分析研究.pdf
- 软件工程笔记(完整版).doc
- 电子商务网项目实例规划书.doc
资源上传下载、课程学习等过程中有任何疑问或建议,欢迎提出宝贵意见哦~我们会及时处理!
点击此处反馈
安全验证
文档复制为VIP权益,开通VIP直接复制
信息提交成功
评论5