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Date: 2019/12/11
COMMITTEE LETTER BALLOT
Item # JC-42.6-1854.99A
SUBJECT: Proposed LPDDR5 Specification
BACKGROUND: Reference:
https://members.jedec.org/file_upload/filegallery/download-document/index/document_id/70960
<Mofification: 2019/12/11>
Table of tWCK2DQ AC parameters was updated.
SPONSOR: Micron
Osamu Nagashima: onagashima@micron.com
Shunichi Saito: shsaito@micron.com
DISTRIBUTION: List all committees that this ballot should be distributed to JC-42.6.
KEYWORDS & ACRONYMS:
LPDDR5, Specification
LPDDR5 Specification Item# 1854.99A
Page 1
Item # JC-42.6-1854.99A .............................................................................................................. i
1 Scope ......................................................................................................................... 23
2 Overview .................................................................................................................... 24
2.1 Features ..................................................................................................................... 24
2.2 Functional Description ............................................................................................... 24
2.2.1 Pad Definition and Description .................................................................................. 26
2.2.2 Pin per byte ................................................................................................................ 27
2.2.3 LPDDR5 Bank Architecture ....................................................................................... 28
2.2.3.1 Block diagram of bank configuration and Read operation outline ............................. 29
2.2.3.1.1 4Banks / 4Bank Groups Configuration ...................................................................... 29
2.2.3.1.2 8Banks Mode Configuration ...................................................................................... 30
2.2.3.1.3 16Banks Mode Configuration .................................................................................... 31
2.2.3.2 Address Translation Table ......................................................................................... 32
2.2.3.3 Bank architecture transition ....................................................................................... 32
2.2.3.4 Burst Operation .......................................................................................................... 33
2.2.4 LPDDR5 SDRAM Addressing .................................................................................... 39
2.2.5 Speed Grades ............................................................................................................ 45
2.2.6 Burst Sequence ......................................................................................................... 46
3 WCK Clocking ............................................................................................................ 47
4 Initialization and Training ........................................................................................... 50
4.1 Power-up, Initialization and Power-off Procedure ...................................................... 50
4.1.1 Voltage Ramp and Device Initialization ..................................................................... 50
4.1.2 Reset Initialization with Stable Power ........................................................................ 55
4.1.3 Power-off Sequence .................................................................................................. 55
4.1.4 Uncontrolled Power-off Sequence ............................................................................. 55
4.2 Training ...................................................................................................................... 56
4.2.1 ZQ Calibration ............................................................................................................ 57
4.2.1.1 Calibration During Powerup and Initialization ............................................................ 57
4.2.1.1.1 Background Calibration ............................................................................................. 58
4.2.1.1.2 Latching ZQ Calibration Results in Background Calibration Mode ............................ 59
4.2.1.1.3 Command-Based Calibration ..................................................................................... 59
4.2.1.1.4 Latching ZQ Calibration Results in Command-Based Calibration Mode ................... 60
4.2.1.1.5 Maintaining Accurate Calibration - Background Calibration Mode............................. 61
4.2.1.1.6 Maintaining Accurate Calibration - Command-Based Calibration Mode .................... 62
4.2.1.1.7 Changing between Calibration Modes ....................................................................... 62
4.2.1.1.7.1 Changing between Calibration Modes when DVFSQ is not active ............................ 62
4.2.1.1.7.2 Changing between Calibration Modes when DVFSQ is active .................................. 63
4.2.1.2 ZQ Stop Functionality ................................................................................................ 64
4.2.1.2.1 ZQ Resistor Sharing by Other Device(s) ................................................................... 64
4.2.1.2.1.1 ZQ Resistor Sharing in Background Calibration Mode .............................................. 64
4.2.1.2.1.2 ZQ Resistor Sharing in Command-Based Calibration Mode ..................................... 64
4.2.1.2.2 Stopping Background Calibration when DVFSQ is active ......................................... 64
4.2.1.2.3 Stopping Background Calibration when VDDQ is Powered Off ................................. 65
4.2.1.3 ZQ Reset ................................................................................................................... 66
4.2.1.4 Multi-die Package Considerations ............................................................................. 66
4.2.1.4.1 Other Considerations in Background Calibration Mode ............................................. 67
4.2.1.4.2 Other Considerations in Command-Based Calibration Mode .................................... 67
4.2.1.5 ZQ External Resistor, Tolerance, and Capacitive Loading ........................................ 67
4.2.1.6 Flow Chart Examples ................................................................................................. 67
4.2.2 Command Bus Training ............................................................................................. 73
4.2.2.1 Three physical Mode Register ................................................................................... 73
4.2.2.2 Command Bus Training Mode1 ................................................................................. 74
LPDDR5 Specification Item# 1854.99A
Page 2
4.2.2.3 Command Bus Training Mode1 (FSP with DVFSQ enable) ...................................... 83
4.2.2.4 Command Bus Training Mode2 ................................................................................. 88
4.2.2.5 Command Bus Training Mode2 (FSP with DVFSQ enable) .................................... 100
4.2.3 CA VREF Training .................................................................................................... 105
4.2.4 DQ VREF Training ................................................................................................... 105
4.2.5 WCK2CK Leveling ................................................................................................... 106
4.2.5.1 WCK2CK Leveling Mode (write-leveling called in LPDDR4) ................................... 106
4.2.5.2 WCK2CK Leveling Procedure and Related AC parameters .................................... 107
4.2.6 Duty Cycle Adjuster (DCA) ...................................................................................... 111
4.2.6.1 Duty Cycle Adjuster Range ...................................................................................... 111
4.2.6.2 Relationship between WCK waveform and DCA Code Change .............................. 112
4.2.6.3 The relationship between DCA Code Change and DQ output/RDQS timing ........... 113
4.2.7 Duty Cycle Monitor (DCM) ....................................................................................... 114
4.2.7.1 DCM Functional Description .................................................................................... 114
4.2.7.2 DCM Sequence ....................................................................................................... 115
4.2.8 READ DQ Calibration .............................................................................................. 117
4.2.8.1 READ DQ Calibration Training Procedure ............................................................... 117
4.2.8.2 READ DQ Calibration Example ............................................................................... 120
4.2.8.3 READ DQ Calibration after Power Down Exit .......................................................... 121
4.2.8.4 DMI Behavior Control for RDC ................................................................................ 122
4.2.8.4.1.1 DMI Output Behavior Mode 1 .................................................................................. 122
4.2.8.4.1.2 DMI Output Behavior Mode 2 .................................................................................. 123
4.2.9 WCK-DQ Training .................................................................................................... 124
4.2.9.1 Training procedure ................................................................................................... 124
4.2.9.1.1 Relationship between MR setting and FIFO training behavior................................. 125
4.2.9.1.1.1 DMI Output Behavior Mode 1 .................................................................................. 127
4.2.9.1.1.2 DMI Output Behavior Mode 2 .................................................................................. 128
4.2.9.2 WCK-RDQS_t/Parity Training .................................................................................. 129
4.2.9.3 FIFO Pointer Reset and Synchronism ..................................................................... 130
4.2.9.4 Command constraints for Write/Read FIFO command ............................................ 135
4.2.10 RDQS toggle mode .................................................................................................. 138
4.2.11 Enhanced RDQS training mode .............................................................................. 140
4.2.12 Read/Write-based WCK-RDQS_t Training .............................................................. 145
4.2.12.1 Relationship between MR setting and Read/Write-based WCK-RDQS_t Training
behavior 146
5 Simplified LPDDR5 State Diagram .......................................................................... 148
6 Mode Register Definition ......................................................................................... 153
6.1 Mode Register Assignment and Definition in LPDDR5 SDRAM .............................. 153
6.2 Mode Register Definition ......................................................................................... 156
6.2.1 Mode Register definition .......................................................................................... 156
7 Operating ................................................................................................................. 206
7.1 Truth Table ............................................................................................................... 206
7.1.1 Command Truth Table .............................................................................................. 206
7.2 WCK Operation ........................................................................................................ 210
7.2.1 WCK2CK Synchronization operation ....................................................................... 210
7.2.1.1 WCK2CK Synchronization ....................................................................................... 210
7.2.1.2 CAS Command with WCK2CK Synchronization Bits .............................................. 210
7.2.1.3 WCK2CK Sync operation followed by a WRITE command ..................................... 211
7.2.1.4 WCK2CK Sync operation followed by a READ command ....................................... 213
7.2.1.5 WCK2CK Sync operation with CAS(WS_FAST=1) ................................................. 216
7.2.1.6 Rank to rank WCK2CK Sync operation ................................................................... 218
7.2.2 WCK2CK SYNC Off Timing Definition ..................................................................... 219
LPDDR5 Specification Item# 1854.99A
Page 3
7.2.3 Write Clock Always on mode (WCK Always on mode) ............................................ 229
7.3 Row operation .......................................................................................................... 234
7.3.1 Active Command ..................................................................................................... 234
7.3.1.1 8-Bank mode SDRAM Operation ............................................................................. 236
7.3.1.2 BG mode SDRAM Operation ................................................................................... 236
7.3.2 Pre-Charge Operation ............................................................................................. 237
7.3.2.1 Pre-Charge Operation ............................................................................................. 237
7.3.2.2 Auto-Precharge Operation ....................................................................................... 241
7.3.2.2.1 Delay time from Write to Read with Auto Precharge ................................................ 242
7.3.2.2.2 Burst Read with Auto-Precharge ............................................................................. 243
7.3.2.2.3 Burst Write with Auto-Precharge .............................................................................. 244
7.4 Read/Write Operation .............................................................................................. 246
7.4.1 Read and Write Access Operations ......................................................................... 246
7.4.2 Read Preamble and Postamble ............................................................................... 246
7.4.3 Burst Read Operation .............................................................................................. 247
7.4.3.1 Read Timing ............................................................................................................. 247
7.4.3.2 Read to Read Operation without additional WCK2CK-sync .................................... 248
7.4.3.3 Read to Read Operation with additional WCK2CK-sync ......................................... 249
7.4.3.4 Read operation followed by write operation ............................................................. 249
7.4.4 READ Burst end to PRECHARGE Delay (tRBTP)................................................... 251
7.4.5 RDQS Mode ............................................................................................................ 253
7.4.5.1 RDQS Timing ........................................................................................................... 253
7.4.5.2 RDQS Related Functionalities ................................................................................. 254
7.4.5.3 Mode Registers for RDQS ....................................................................................... 255
7.4.5.4 RDQS Pattern Definition .......................................................................................... 256
7.4.6 Write Preamble and Postamble ............................................................................... 259
7.4.7 Burst Write Operation .............................................................................................. 260
7.4.7.1 Write Timing ............................................................................................................. 260
7.4.7.2 Write to Write Operation without additional WCK2CK-sync ..................................... 261
7.4.7.3 Write to Write Operation with additional WCK2CK-sync .......................................... 262
7.4.7.4 Write operation followed by read operation ............................................................. 262
7.4.8 Read and Write Latency .......................................................................................... 263
7.4.8.1 Read and Read-to-Precharge Latencies ................................................................. 263
7.4.8.2 Write Latency ........................................................................................................... 264
7.4.8.3 Write Recovery time ................................................................................................. 267
7.4.9 Masked Write ........................................................................................................... 269
7.4.10 Data Mask (DM) and Data Bus Inversion (DBI-DC) Function .................................. 274
7.4.10.1 DMI Pin Behavior with Write Related Commands ................................................... 275
7.4.10.2 DMI Pin Behavior with Read and MRR Command .................................................. 277
7.4.10.3 DMI Pin Behavior with Read FIFO and Read DQ Calibration Commands .............. 278
7.5 Refresh operation .................................................................................................... 280
7.5.1 Refresh command ................................................................................................... 280
7.5.2 Refresh Requirement ............................................................................................... 288
7.5.3 Optimized Refresh ................................................................................................... 289
7.5.4 Self Refresh Operation ............................................................................................ 290
7.5.4.1 Power Down Entry and Exit during Self refresh ....................................................... 292
7.5.4.2 Command input Timing after Power Down Exit during Self Refresh ........................ 294
7.5.4.3 Self Refresh AC Timing Table .................................................................................. 295
7.5.4.4 MRR, MRW, RFF, WFF, RDC, MPC Command during tXSR .................................. 296
7.5.5 Partial Array Self Refresh (PASR) ............................................................................ 297
7.5.5.1 PASR Segment Masking .......................................................................................... 297
7.5.6 Partial Array Refresh Control (PARC) ...................................................................... 297
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