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首页H26M51002HPR H26M62002GMR H26M74002EMR H26M88002AMR 规格书
H26M51002HPR H26M62002GMR H26M74002EMR H26M88002AMR 规格书
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更新于2023-03-16
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SK hynix e-NAND consists of NAND flash and MMC controller. e-NAND has the built-in intelligent controller which manages interface protocols, wear leveling, bad block management, garbage collection, and ECC. e-NAND protects the data contents from the host sudden power off failure.
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Rev 1.2 / Jun. 2016 1
SK hynix e-NAND Product Family
eMMC5.1 Compatible
Rev 1.2 / Jun. 2016 2
Revision History
Revision No. History Date Remark
0.1
Preliminary
Oct. 27, 2015
0.2
Apply test result for performance, power consumption and register
Nov. 05, 2015
0.3
Add a sentence ‘The first XGB data have to be written with sequential LBA’ in 4.1.4 PSA.
Update register field for 128GB(ODP)
Nov. 19, 2015
0.4
Modify typo (EXC_CSD[16]=0B -> 3B, EXT_CSD[498]=03 -> 00)
Dec. 03, 2015
0.5
Modify CMD8 timeout from 5ms to 20ms
Dec. 14, 2015
0.6
Comment in Table 6
Change in Production State Awareness
Jan. 07, 2016
1.0
Version changed to 1.0
Mar. 09, 2016
1.01
Specified current measurement in 3.2.2
Mar. 16, 2016
1.02
Modification of power value (p.57)
Modification of PSN value and usage guidance
Apr. 20, 2016
1.1
Modify CMD6 Switch Timeout
Jun. 03, 2016
1.2
Revised TYPO [p71_Extended CSD_230]
Jun. 10, 2016
Rev 1.2 / Jun. 2016 3
Table of Contents
1. Introduction ................................................................................................................. 5
1.1 General Description ............................................................................................................................................................. 5
1.2 Product Line-up ................................................................................................................................................................. 5
1.3 Key Features ...................................................................................................................................................................... 5
2. Package Configurations ................................................................................................ 6
2.1 Pin connection .................................................................................................................................................................... 6
2.2 Package Mechanical Drawing ............................................................................................................................................... 8
3. e-NAND Characteristics ............................................................................................... 10
3.1 Performance ..................................................................................................................................................................... 10
3.2 Power .............................................................................................................................................................................. 11
4. e-NAND New features (eMMC5.0 and eMMC5.1).......................................................... 13
4.1 eMMC5.0 New features............................................................................................................................................ 13
4.1.1 HS400 mode .................................................................................................................................................................. 13
4.1.2 Field firmware update ..................................................................................................................................................... 20
4.1.3 Health report ................................................................................................................................................................. 23
4.1.4 Production state awareness ............................................................................................................................................. 24
4.1.5 Sleep notification ............................................................................................................................................................ 25
4.1.6 Secure removal type ....................................................................................................................................................... 26
4.2 eMMC5.1 New features........................................................................................................................................... 27
4.2.1 Command queuing ......................................................................................................................................................... 27
4.2.2 Cache barrier ................................................................................................................................................................. 31
4.2.3 Cache Flushing report ..................................................................................................................................................... 33
4.2.4 Background operation(BKOP) control ............................................................................................................................... 33
4.2.5 Secure Write Protection .................................................................................................................................................. 34
4.2.6 Enhanced strobe ............................................................................................................................................................ 39
4.2.7 RPMB throughput improvement ....................................................................................................................................... 43
4.3 Enhanced features from eMMC4.5 to eMMC5.1 ....................................................................................................... 44
5. e-NAND general parameters ....................................................................................... 45
5.1 Timing ............................................................................................................................................................................. 45
5.2 Bus signal ......................................................................................................................................................................... 50
5.3 Power mode ..................................................................................................................................................................... 54
5.4 Connection guide .............................................................................................................................................................. 58
6. e-NAND basic operations ............................................................................................. 59
6.1 Partitioning ....................................................................................................................................................................... 59
6.2 Boot operation .................................................................................................................................................................. 62
Rev 1.2 / Jun. 2016 4
7. Timeout ....................................................................................................................... 63
8. Register ....................................................................................................................... 65
8.1 Operation conditions register (OCR) .................................................................................................................................... 65
8.2 Card identification (CID) register ......................................................................................................................................... 66
8.3 Card specific data register(CSD) ......................................................................................................................................... 66
8.4 Extended CSD register ....................................................................................................................................................... 69
8.5 RCA (Relative Card Address) ............................................................................................................................................... 76
8.6 DSR (Driver Stage Register) .............................................................................................................................................. 76
Rev 1.2 / Jun. 2016 5
1. Introduction
1.1 General Description
SK hynix e-NAND consists of NAND flash and MMC controller.
e-NAND has the built-in intelligent controller which manages interface protocols, wear leveling, bad block management,
garbage collection, and ECC. e-NAND protects the data contents from the host sudden power off failure.
e-NAND is compatible with JEDEC standard eMMC5.1 specification.
1.2 Product Line-up
1.3 Key Features
• eMMC5.1 compatible
(Backward compatible to eMMC4.5 & eMMC5.0)
• Bus mode
- Data bus width : 1bit (default), 4bits, 8bits
- Data transfer rate: up to 400MB/s (HS400)
- MMC I/F Clock frequency : 0~200MHz
- MMC I/F Boot frequency : 0~52MHz
• Operating Voltage Range
- V
cc
(NAND) : 2.7V ~ 3.6V
- V
ccq
(CTRL) : 1.7V ~ 1.95V / 2.7V ~ 3.3V
• Temperature
- Operation (-25℃ ~ +85℃)
- Storage without operation (-40℃ ~ +85℃)
• Others
- This product is compliance with the RoHS directive
Density Part Number NAND Stack PKG Size (mm) Package Type
16GB H26M51002HPR 128Gb x 1 11.5 x 13 x 0.8
153FBGA
32GB H26M62002GMR 128Gb x 2 11.5 x 13 x 1.0
64GB H26M74002EMR 128Gb x 4 11.5 x 13 x 1.0
128GB H26M88002AMR 128Gb x 8 11.5 x 13 x 1.0
• Supported Features
- HS400, HS200
- HPI, BKOPS, BKOP operation control
- Packed CMD, CMD queuing
- Cache, Cache barrier, Cache flushing report
- Partitioning, RPMB, RPMB throughput improve
- Discard, Trim, Erase, Sanitize
- Write protect, Secure write protection
- Lock/Unlock
- PON, Sleep/Awake
- Reliable Write
- Boot feature, Boot partition
- HW/SW Reset
- Field Firmware Update
- Configurable driver strength
- Health(Smart) report
- Production state awareness
- Secure removal type
- Data Strobe pin, Enhanced data strobe
(Bold features are added in eMMC5.1)
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