ii AdvancedTCA Base Specification PICMG 3.0 R2.0 Member Review Draft D1.90 September 28, 2004
Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This Specification
Contents
2.3 RTM assembly .........................................................................................2-25
2.3.1 RTM direct mate to Front Board..................................................2-25
2.3.1.1 RTM PCB thickness ....................................................2-27
2.3.1.2 RTM Pitch and offset ...................................................2-27
2.3.1.3 RTM PCB bow, warp, component height, and
stiffening ......................................................................2-27
2.3.1.4 RTM ESD discharge strip ............................................2-28
2.3.1.5 RTM Face Plate and Covers .......................................2-29
2.3.1.6 RTM Face Plate alignment/GND features ...................2-31
2.3.1.7 RTM retention screws..................................................2-31
2.3.1.8 RTM filler panels..........................................................2-32
2.3.1.9 RTM airflow requirements and direction......................2-32
2.3.1.10 Zone 3 airflow seal ......................................................2-32
2.3.1.11 RTM Zone 3 keying .....................................................2-34
2.3.2 Zone 3 cable bulkhead ................................................................2-34
2.3.3 RTM connection to Zone 3 midplane ..........................................2-35
2.4 Zone 1, 2, and 3 connectors.....................................................................2-37
2.4.1 Zone 1 connector ........................................................................2-37
2.4.1.1 Description...................................................................2-37
2.4.1.2 -48 VDC power circuit definitions ................................2-40
2.4.1.3 Metallic Test Bus circuits .............................................2-41
2.4.1.4 Ringing Generator Bus circuit......................................2-42
2.4.1.5 Shelf management circuit definitions...........................2-43
2.4.2 Zone 2 connectors.......................................................................2-43
2.4.2.1 General description of Zone 2 connectors...................2-44
2.4.2.2 Pin numbering .............................................................2-44
2.4.2.3 Sequential mating........................................................2-44
2.4.3 Zone 3 connectors.......................................................................2-44
2.4.3.1 General description .....................................................2-45
2.4.3.2 Zone 3 connector envelope .........................................2-45
2.4.3.3 Insertion force..............................................................2-47
2.4.3.4 Alignment allowances/gatherability .............................2-47
2.4.4 Front Board and RTM alignment/keying......................................2-47
2.4.4.1 Alignment overview .....................................................2-47
2.4.4.2 Keying overview ..........................................................2-47
2.4.4.3 Zone 1 and Zone 2 keying/alignment ..........................2-49
2.4.4.4 RTM alignment ............................................................2-51
2.4.4.5 Zone 3 alignment and keying ......................................2-54
2.5 Backplanes...............................................................................................2-57
2.5.1 Description ..................................................................................2-58
2.5.2 Connector locations.....................................................................2-59
2.6 Subrack ....................................................................................................2-61
2.6.1 Subrack features .........................................................................2-61
2.6.2 Backplane support bar ................................................................2-67
2.6.3 Subrack interface requirements for Front Boards .......................2-69
2.6.4 Subrack EMC gasketing requirements........................................2-70
2.6.5 Guide Rail requirements..............................................................2-70
2.6.5.1 Front Board and RTM Guide Rail requirements ..........2-70
2.6.5.2 Logical Slot identification .............................................2-72
2.6.5.3 ESD clip position in the Guide Rails ............................2-72
2.6.6 Face Plate alignment and safety ground pin ...............................2-74
2.6.7 Retention screw receptacle .........................................................2-74
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