JEDEC Standard No. 209-5
-i-
Contents
1 Scope......................................................................................................................................... 1
2 Overview ................................................................................................................................... 2
2.1 Features ..................................................................................................................... 2
2.2 Functional Description .................................................................................................. 2
2.2.1 Pad Definition and Description ...................................................................................... 2
2.2.2 Pin per byte ................................................................................................................ 3
2.2.3 LPDDR5 Bank Architecture ........................................................................................... 4
2.2.3.1 Block diagram of bank configuration and Read operation outline ....................................... 5
2.2.3.1.1 4 Bank / 4 Bank Groups Configuration ............................................................................ 5
2.2.3.1.2 8 Bank Mode Configuration ........................................................................................... 6
2.2.3.1.3 16 Bank Mode Configuration ......................................................................................... 7
2.2.3.2 Address mapping ......................................................................................................... 7
2.2.3.3 Bank architecture transition ........................................................................................... 7
2.2.3.4 Burst Operation ........................................................................................................... 7
2.2.4 LPDDR5 SDRAM Addressing .......................................................................................13
2.2.5 Speed Grades ............................................................................................................19
2.2.6 Burst Sequence ..........................................................................................................20
3 WCK Clocking...........................................................................................................21
4 Initialization and Training ..........................................................................................24
4.1 Power-up, Initialization and Power-off Procedure ............................................................24
4.1.1 Voltage Ramp and Device Initialization ..........................................................................24
4.1.2 Reset Initialization with Stable Power ............................................................................28
4.1.3 Power-off Sequence ....................................................................................................28
4.1.4 Uncontrolled Power-off Sequence .................................................................................28
4.2 Training .....................................................................................................................29
4.2.1 ZQ Calibration ............................................................................................................29
4.2.1.1 Calibration .................................................................................................................29
4.2.1.1.1 Calibration During Powerup and Initialization..................................................................29
4.2.1.1.2 Background Calibration ...............................................................................................29
4.2.1.1.3 Latching ZQ Calibration Results in Background Calibration Mode .....................................30
4.2.1.1.4 Command-Based Calibration .......................................................................................31
4.2.1.1.5 Latching ZQ Calibration Results in Command-Based Calibration Mode .............................31
4.2.1.1.6 Maintaining Accurate Calibration - Background Calibration Mode ......................................32
4.2.1.1.7 Maintaining Accurate Calibration - Command-Based Calibration Mode ..............................32
4.2.1.1.8 Changing between Calibration Modes ...........................................................................33
4.2.1.1.8.1 Changing between Calibration Modes when DVFSQ is not active .....................................33
4.2.1.1.8.2 Changing between Calibration Modes when DVFSQ is active ..........................................34
4.2.1.2 ZQ Stop Functionality ..................................................................................................35
4.2.1.2.1 ZQ Resistor Sharing by Another Device(s) .....................................................................35
4.2.1.2.1.1 ZQ Resistor Sharing in Background Calibration Mode .....................................................35
4.2.1.2.1.2 ZQ Resistor Sharing in Command-Based Calibration Mode .............................................35
4.2.1.2.2 Stopping Background Calibration when DVFSQ is active .................................................35
4.2.1.2.3 Stopping Background Calibration when VDDQ is Powered Off .........................................36
4.2.1.3 ZQ Reset ...................................................................................................................37
4.2.1.4 Multi-die Package Considerations .................................................................................38
4.2.1.4.1 Other Considerations in Background Calibration Mode ....................................................38
4.2.1.5 Other Considerations in Command-Based Calibration Mode ............................................38
4.2.1.6 ZQ External Resistor, Tolerance, and Capacitive Loading ................................................38
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