PCI Express M.2 Specification
PCI Express M.2 Specification | 5
Revision 1.0, November 1, 2013
2.4.7. Top Side Connection ...............................................................................................63
2.4.7.1. Top Side Connector Physical Dimensions .........................................................63
2.4.7.2. Top Side Connection Total System Length ........................................................65
2.4.7.3. Top Side Connection Stack-up ...........................................................................66
2.4.7.3.1. Single Sided Module (Using H2.3 Connector) ...........................................66
2.4.7.3.2. Single Sided Module (Using H2.5 Connector) ...........................................67
2.4.7.3.3. Double Sided Module (Using H2.8, H3.2 and H4.2 Connector) .................68
2.4.7.4. Top Side Connector Layout Pattern ...................................................................70
2.4.8. Mid Line Connection (Using M1.8 Connector) ..........................................................71
2.4.8.1. Mid Line Connector Physical Dimensions ..........................................................71
2.4.8.2. Mid Line Connection Total System Length .........................................................72
2.4.8.3. Mid Line Connection Stack-up ...........................................................................73
2.4.8.3.1. Single-sided Module ..................................................................................73
2.4.8.3.2. Double-sided Module ................................................................................74
2.4.8.4. Mid Line Connector Layout Pattern ....................................................................76
2.4.9. Connector Key Dimension .......................................................................................78
2.4.9.1. Host Connector Keying ......................................................................................78
2.5. Module Stand-off ...........................................................................................................81
2.5.1. Recommended Main Board Hole .............................................................................81
2.5.2. Electrical Ground Path .............................................................................................81
2.5.3. Thermal Ground Path ..............................................................................................81
2.5.4. Stand-Off Guidelines ...............................................................................................84
2.5.4.1. Stand-Off Guidelines Option 1 ...........................................................................84
2.5.4.2. Stand-Off Guidelines Option 2 ...........................................................................85
2.5.5. Screw Selection Guideline .......................................................................................86
2.5.5.1. Option 1, Wafer-Head Style M3 Screw ...............................................................86
2.5.5.2. Option 2, M3 Screw with Tapered Shaft .............................................................87
2.5.5.3. Option 3, Wafer-Head Style M2 Screw ...............................................................87
2.5.5.4. Option 4, Flat-Head Style M3 Screw ..................................................................88
2.6. Thermal Guidelines for the M.2......................................................................................89
2.6.1. Objective .................................................................................................................89
2.6.2. Introduction to Thermal Management ......................................................................89
2.6.2.1. Thermal Design Power Definition .......................................................................89
2.6.2.2. Skin Temperature Definition ...............................................................................90
2.6.2.3. Unpowered M.2 Module Temperature ................................................................90
2.6.2.4. System Skin Temperature—Fan-based System ................................................90
2.6.3. System Skin Temperature—Fanless System ...........................................................91
2.6.4. Examples of Dissipation (TDP) Response of Modules .............................................91
3. Electrical Specifications .................................................................................. 92
3.1. Connectivity Socket 1 Module Interface Signals ............................................................92
3.1.1. Power Sources and Grounds ...................................................................................95
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