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PCIe_M.2(NGFF)_Electromechanical_Spec_Rev1.0_Final
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PCIe_M.2(NGFF)_Electromechanical_Spec_Rev1.0_Final
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PCI Express M.2
Specification
Revision 1.0
November 1, 2013
PCI-SIG
®
disclaims all warranties and liability for the use of this document and the information contained herein and assumes no
responsibility for any errors that may appear in this document, nor does PCI-SIG make a commitment to update the information
contained herein.
Contact the PCI-SIG office to obtain the latest revision of this specification.
Questions regarding this specification or membership in PCI-SIG may be forwarded to:
Membership Services
www.pcisig.com
E-mail: administration@pcisig.com
Phone: 503-619-0569
Fax: 503-644-6708
Technical Support
techsupp@pcisig.com
DISCLAIMER
This PCI Code and ID Assignment Specification is provided as is with no warranties whatsoever, including any warranty of
merchantability, non-infringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal,
specification, or sample. PCI-SIG disclaims all liability for infringement of proprietary rights, relating to use of information in this
specification. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein.
PCI Express is a trademark of PCI-SIG.
All other product names are trademarks, registered trademarks, or service marks of their respective owners.
© 2012, 2013 PCI SIG. All rights reserved.
PCI Express M.2 Specification
PCI Express M.2 Specification | 3
Revision 1.0, November 1, 2013
Revision History
Rev
Version
History
Date
1.0
Initial Release
November 1, 2013
PCI Express M.2 Specification
PCI Express M.2 Specification | 4
Revision 1.0, November 1, 2013
Table of Contents
1. Introduction to M.2 Electro-Mechanical Specifications ................................ 16
1.1. Terms and Definitions ....................................................................................................17
1.2. Targeted Application ......................................................................................................17
1.3. Specification References ...............................................................................................18
2. Mechanical Specification ................................................................................. 20
2.1. Overview .......................................................................................................................20
2.2. Card Type Naming Convention .....................................................................................22
2.3. Card Specifications........................................................................................................25
2.3.1. Card Form Factors Intended for Connectivity Socket 1 ............................................26
2.3.1.1. Type 2230 Specification .....................................................................................26
2.3.1.2. Type 1630 Specification .....................................................................................29
2.3.1.3. Type 3030 Specification .....................................................................................31
2.3.2. Card Form Factor Intended for WWAN Socket 2 .....................................................32
2.3.2.1. Type 3042 Specification .....................................................................................32
2.3.3. Card Form Factor for SSD Socket 2 ........................................................................33
2.3.3.1. Type 2230 Specification .....................................................................................33
2.3.4. Card Form Factors for SSD Socket 2 and 3 .............................................................34
2.3.4.1. Type 2242 Specification .....................................................................................34
2.3.4.2. Type 2260 Specification .....................................................................................35
2.3.4.3. Type 2280 Specification .....................................................................................36
2.3.4.4. Type 22110 Specification ...................................................................................37
2.3.5. Card PCB Details.....................................................................................................38
2.3.5.1. Mechanical Outline of Card-Edge ......................................................................38
2.3.5.2. Module Keying ...................................................................................................40
2.3.6. Soldered-down Form Factors ..................................................................................44
2.3.6.1. Type 2226 Specification .....................................................................................44
2.3.6.2. Type 1216 Specification .....................................................................................47
2.3.6.3. Type 3026 Specification .....................................................................................50
2.3.7. RF Connectors ........................................................................................................53
2.3.7.1. Socket 1 & 2 RF Connector Pin-Out...................................................................57
2.4. System Connector Specifications ..................................................................................59
2.4.1. Connector Pin Count ...............................................................................................60
2.4.2. Contact Pitch ...........................................................................................................60
2.4.3. System Connector Parametric Specifications ..........................................................60
2.4.4. Additional Environmental Requirements ..................................................................62
2.4.5. Card Insertion ..........................................................................................................62
2.4.6. Point of Contact Guideline .......................................................................................62
PCI Express M.2 Specification
PCI Express M.2 Specification | 5
Revision 1.0, November 1, 2013
2.4.7. Top Side Connection ...............................................................................................63
2.4.7.1. Top Side Connector Physical Dimensions .........................................................63
2.4.7.2. Top Side Connection Total System Length ........................................................65
2.4.7.3. Top Side Connection Stack-up ...........................................................................66
2.4.7.3.1. Single Sided Module (Using H2.3 Connector) ...........................................66
2.4.7.3.2. Single Sided Module (Using H2.5 Connector) ...........................................67
2.4.7.3.3. Double Sided Module (Using H2.8, H3.2 and H4.2 Connector) .................68
2.4.7.4. Top Side Connector Layout Pattern ...................................................................70
2.4.8. Mid Line Connection (Using M1.8 Connector) ..........................................................71
2.4.8.1. Mid Line Connector Physical Dimensions ..........................................................71
2.4.8.2. Mid Line Connection Total System Length .........................................................72
2.4.8.3. Mid Line Connection Stack-up ...........................................................................73
2.4.8.3.1. Single-sided Module ..................................................................................73
2.4.8.3.2. Double-sided Module ................................................................................74
2.4.8.4. Mid Line Connector Layout Pattern ....................................................................76
2.4.9. Connector Key Dimension .......................................................................................78
2.4.9.1. Host Connector Keying ......................................................................................78
2.5. Module Stand-off ...........................................................................................................81
2.5.1. Recommended Main Board Hole .............................................................................81
2.5.2. Electrical Ground Path .............................................................................................81
2.5.3. Thermal Ground Path ..............................................................................................81
2.5.4. Stand-Off Guidelines ...............................................................................................84
2.5.4.1. Stand-Off Guidelines Option 1 ...........................................................................84
2.5.4.2. Stand-Off Guidelines Option 2 ...........................................................................85
2.5.5. Screw Selection Guideline .......................................................................................86
2.5.5.1. Option 1, Wafer-Head Style M3 Screw ...............................................................86
2.5.5.2. Option 2, M3 Screw with Tapered Shaft .............................................................87
2.5.5.3. Option 3, Wafer-Head Style M2 Screw ...............................................................87
2.5.5.4. Option 4, Flat-Head Style M3 Screw ..................................................................88
2.6. Thermal Guidelines for the M.2......................................................................................89
2.6.1. Objective .................................................................................................................89
2.6.2. Introduction to Thermal Management ......................................................................89
2.6.2.1. Thermal Design Power Definition .......................................................................89
2.6.2.2. Skin Temperature Definition ...............................................................................90
2.6.2.3. Unpowered M.2 Module Temperature ................................................................90
2.6.2.4. System Skin Temperature—Fan-based System ................................................90
2.6.3. System Skin Temperature—Fanless System ...........................................................91
2.6.4. Examples of Dissipation (TDP) Response of Modules .............................................91
3. Electrical Specifications .................................................................................. 92
3.1. Connectivity Socket 1 Module Interface Signals ............................................................92
3.1.1. Power Sources and Grounds ...................................................................................95
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