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Hi3559V100/Hi3556V100 HD Mobile Camera SoC 用户指南
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更新于2023-03-16
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本文档为 Hi3559V100/Hi3556V100 芯片手册,介绍了 Hi3559V100/Hi3556V100 芯片的特性、逻辑结构,详细描述各个模块的功能、工作方式、相关寄存器定义,用图表的方式给出了接口时序关系和相关参数,并详细描述了芯片的管脚定义和用途以及芯片的性能参数和封装尺寸。
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Hi3559 V100/Hi3556 V100 SDK
User Guide
Issue 00B02
Date 2017-02-20
Copyright © HiSilicon Technologies Co., Ltd. 2016-2017. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior
written consent of HiSilicon Technologies Co., Ltd.
Trademarks and Permissions
, , and other HiSilicon icons are trademarks of HiSilicon Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.
Notice
The purchased products, services and features are stipulated by the contract made between HiSilicon and
the customer. All or part of the products, services and features described in this document may not be
within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,
information, and recommendations in this document are provided "AS IS" without warranties, guarantees
or representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.
HiSilicon Technologies Co., Ltd.
Address: Huawei Industrial Base
Bantian, Longgang
Shenzhen 518129
People's Republic of China
Website: http://www.hisilicon.com
Email: support@hisilicon.com
Hi3559 V100/Hi3556 V100 SDK
User Guide About This Document
Issue 00B02 (2017-02-20)
HiSilicon Proprietary and Confidential
Copyright © HiSilicon Technologies Co., Ltd.
i
About This Document
Purpose
This document describes the structure and contents of the software development kit (SDK).
Related Version
The following table lists the product version related to this document.
Product Name Version
Hi3559 V100R003
Hi3556 V100R003
Intended Audience
This document is intended for:
Technical support engineers
Software development engineers
Change History
Changes between document issues are cumulative. Therefore, the latest document issue
contains all changes made in previous issue.
Issue 00B02 (2017-02-20)
This issue is the second draft release, which incorporates the following changes:
The description of the Hi3556V 100 is added.
Issue 00B01 (2016-11-22)
This issue is the first draft release.
Hi3559 V100/Hi3556 V100 SDK
User Guide Contents
Issue 00B02 (2017-02-20)
HiSilicon Proprietary and Confidential
Copyright © HiSilicon Technologies Co., Ltd.
ii
Contents
About This Document ...................................................................................................................... i
1 Introduction.................................................................................................................................... 1
1.1 Naming Conventions ........................................................................................................................................ 1
1.2 Directory Structure ........................................................................................................................................... 2
1.3 Content Description ......................................................................................................................................... 2
1.3.1 Hardware ................................................................................................................................................. 2
1.3.2 Software .................................................................................................................................................. 2
1.3.3 Only for Reference .................................................................................................................................. 3
1.3.4 Deliverable List ....................................................................................................................................... 3
1.3.5 Release Notes .......................................................................................................................................... 3
1.4 Usage Procedure ............................................................................................................................................... 3
2 Document Introduction ............................................................................................................... 4
2.1 Overview .......................................................................................................................................................... 4
2.2 Hardware Documents ....................................................................................................................................... 6
2.2.1 Chip-Related Documents ........................................................................................................................ 6
2.2.2 Board-Related Documents ...................................................................................................................... 6
2.3 Software Documents ........................................................................................................................................ 7
2.3.1 Board End ............................................................................................................................................... 7
2.3.2 PC End .................................................................................................................................................. 11
2.3.3 Mobile Phone ........................................................................................................................................ 12
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