IMX335LQN-C_TechnicalDatasheet_Rev0.2.pdf_IMX335

IMX335

Datasheet

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Diagonal 6.52 mm (Type 1/2.8) CMOS Solid-state Image Sensor with Square Pixel for

Color Cameras

Tentative

IMX335LQN-C

Description

The IMX335LQN-C is a diagonal 6.52 mm (Type 1/2.8) CMOS active pixel type solid-state image sensor with a

square pixel array and 5.14 M effective pixels. This chip operates with analog 2.9 V, digital 1.2 V, and interface 1.8 V

triple power supply, and has low power consumption. High sensitivity, low dark current and no smear are achieved

through the adoption of R, G and B primary color mosaic filters. This chip features an electronic shutter with variable

charge-integration time.

(Applications: Surveillance cameras, FA cameras, Industrial cameras)

Features

◆ CMOS active pixel type dots

◆ Built-in timing adjustment circuit, H/V driver and serial communication circuit

◆ Input frequency: 6 to 27 MHz / 37.125 MHz / 74.25 MHz

◆ Number of recommended recording pixels: 2592 (H) × 1944 (V) approx. 5.04M pixel

◆ Readout mode

All-pixel scan mode

Horizontal/Vertical 2/2-line binning mode

Window cropping mode

Vertical / Horizontal direction-normal / inverted readout mode

◆ Readout rate

Maximum frame rate in All-pixel scan mode 2592(H)×1944(V) AD10bit: 60 frame / s

◆ Wide dynamic range (WDR) function

Multiple exposure WDR

Digital overlap WDR

◆ Variable-speed shutter function (resolution 1H units)

◆ 10-bit / 12-bit A/D converter

◆ CDS / PGA function

0 dB to TBDdB (step pitch 0.3 dB)

Supports I/O

CSI-2 serial data output ( 2 Lane / 4 Lane, RAW10 / RAW12 output)

◆ Recommended exit pupil distance: –30 mm to –∞

Sony Semiconductor Solutions Corporation reserves the right to change products and specifications without prior notice.

This information does not convey any license by any implication or otherwise under any patents or other right.

Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony Semiconductor Solutions

Corporation cannot assume responsibility for any problems arising out of the use of these circuits.

Rev0.2

IMX335LQN-C

USE RESTRICTION NOTICE

This USE RESTRICTION NOTICE ("Notice") is for customers who are considering or currently using the

image sensor products ("Products") set forth in this specifications book.

Sony Semiconductor Solutions

Corporation ("SSS") may,

at any time, modify this Notice which will be available to you in the latest

specifications book for the Products. You should abide by the latest version of this Notice. If a SSS

subsidiary or distri

butor has its own use restriction notice on the Products, such a use restriction notice will

additionally apply between you and the subsidiary or distributor. You should consult a sales representative of

the subsidiary or distributor of SSS on such a use restriction notice when you consider using the Products.

Use Restrictions



The Products are intended for incorporation into such general electronic equipment as office products,

communication products, measurement products, and home electronics products in accordance with

the terms and conditions set forth in this specifications book and otherwise notified by SSS from time

to time.



You should not use the Products for critical applications which may pose a life- or injury-threatening

risk or are highly likely to cause significant property damage in the event of failure of the Products. You

should consult your sales representative beforehand when you consider using the Products for such

critical applications. In addition, you should not use the Products in weapon or military equipment.



SSS disclaims and does not assume any liability and damages arising out of misuse, improper use,

modification, use of the Products for the above-mentioned critical applications, weapon and military

equipment, or any deviation from the requirements set forth in this specifications book.

Design for Safety



SSS is making continuous efforts to further improve the quality and reliability of the Products; however,

failure of a certain percentage of the Products is inevitable. Therefore, you should take sufficient care

to ensure the safe design of your products such as component redundancy, anti-conflagration features,

and features to prevent mis

-operation in order to avoid accidents resulting in injury or death, fire or

other social damage as a result of such failure.

Export Control



If the Products are controlled items under the export control laws or regulations of various countries,

approval may be required for the export of the Products under the said laws or regulations.

You should be responsible for compliance with the said laws or regulations.

No License Implied



The technical information shown in this specifications book is for your reference purposes only. The

availability of this specifications book shall not be construed as giving any indication that SSS and its

licensors will license any intellectual property rights in such information by any implication or otherwise.

SSS will not assume responsibility for any problems in connection with your use of such information or

for any infringement of third-party rights due to the same. It is therefore your sole legal and financial

responsibility to resolve any such problems and infringement.

Governing Law



This Notice shall be governed by and construed in accordance with the laws of Japan, without reference

to principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relating

to this Notice shall be submitted to the exclusive j

urisdiction of the Tokyo District Court in Japan as the

court of first instance.

Other Applicable Terms and Conditions



The terms and conditions in the SSS additional specifications, which will be made available to you when

you order the Products, shall also be applicable to your use of the Products as well as to this

specifications book. You should review those terms and conditions when you consider purchasing

and/or using the Products.

General-0.0.9

IMX335LQN-C

Contents

Description ............................................................................................................................................................................. 1

Features ................................................................................................................................................................................. 1

Device Structure ..................................................................................................................................................................... 2

Absolute Maximum Ratings .................................................................................................................................................... 3

Application Conditions ............................................................................................................................................................ 3

USE RESTRICTION NOTICE ................................................................................................................................................ 4

Optical Center ........................................................................................................................................................................ 7

Pixel Arrangement .................................................................................................................................................................. 8

Block Diagram and Pin Configuration ..................................................................................................................................... 9

Pin Description ...................................................................................................................................................................... 11

Electrical Characteristics ...................................................................................................................................................... 14

DC Characteristics ............................................................................................................................................................ 14

Current Consumption ........................................................................................................................................................ 15

AC Characteristics ............................................................................................................................................................ 16

Master Clock Waveform (INCK) .................................................................................................................................... 16

XVS / XHS Input Characteristics In Slave Mode (XMASTER pin = High) ..................................................................... 17

XVS / XHS Input Characteristics In Master Mode (XMASTER pin = Low) .................................................................... 17

Serial Communication ................................................................................................................................................... 18

I/O Equivalent Circuit Diagram ............................................................................................................................................. 19

Spectral Sensitivity Characteristics ...................................................................................................................................... 20

Image Sensor Characteristics .............................................................................................................................................. 21

Zone Definition .................................................................................................................................................................. 21

Image Sensor Characteristics Measurement Method........................................................................................................... 22

Measurement Conditions .................................................................................................................................................. 22

Color Coding of Physical Pixel Array ................................................................................................................................ 22

Definition of standard imaging conditions ......................................................................................................................... 22

Measurement Method ....................................................................................................................................................... 23

Setting Registers Using Serial Communication .................................................................................................................... 24

Description of Setting Registers (I

C) ............................................................................................................................... 24

C) ............................................................................................................................... 25

Communication Protocol ................................................................................................................................................... 26

C) .......................................................................................................................................... 27

Single Read from Random Location ............................................................................................................................. 27

Single Read from Current Location ............................................................................................................................... 27

Sequential Read Starting from Random Location ......................................................................................................... 28

Sequential Read Starting from Current Location ........................................................................................................... 28

Single Write to Random Location .................................................................................................................................. 29

Sequential Write Starting from Random Location ......................................................................................................... 29

Register Map ........................................................................................................................................................................ 30

Readout Drive mode ............................................................................................................................................................ 45

Image Data Output Format (CSI-2 output) ........................................................................................................................ 46

Frame Format ............................................................................................................................................................... 46

Frame Structure ............................................................................................................................................................ 46

Embedded Data Line .................................................................................................................................................... 47

Image Data Output Format ............................................................................................................................................... 49

All-pixel scan mode ....................................................................................................................................................... 49

Horizontal/Vertical 2/2-line binning scan mode .............................................................................................................. 52

Window Cropping Mode ................................................................................................................................................ 55

Description of Various Function ............................................................................................................................................ 59

Standby Mode................................................................................................................................................................... 59

Slave Mode and Master Mode .......................................................................................................................................... 60

Gain Adjustment Function ................................................................................................................................................. 62

Black Level Adjustment Function ...................................................................................................................................... 63

Normal Operation and Inverted Operation ........................................................................................................................ 64

Shutter and Integration Time Settings ............................................................................................................................... 65

Example of Integration Time Setting ............................................................................................................................. 65

Normal Exposure Operation (Controlling the Integration Time in 1H Units) ...................................................................... 66

Long Exposure Operation (Control by Expanding the Number of Lines per Frame) ......................................................... 67