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MIPI_D-PHY_Datasheet_Rev-2-0-mipi协议
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更新于2023-03-16
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MIPI联盟定义了一套接口标准,把移动设备内部的接口如摄像头、显示屏、基带、射频接口等标准化,从而增加设计灵活性,同时降低成本、设计复杂度、功耗和EMI。 未来的产品都将朝着移动的方向发展,例如智能手机、数码相机、摄像机、平板电脑、媒体播放器、游戏机等,这些产品需要能执行多任务,包括处理多个不同的传感器如麦克风、图像传感器、磁罗盘、三轴加速度计和精细的触摸屏等,它们也要能够扑捉、处理及播放高清晰度的音频、视频和图像,能通过WiFi或者2G/3G/4G网络上网冲浪,以及能够支持GPS导航和移动定位服务(LBS)。
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1
Revision Number: 2.0 Copyright © 2012, Arasan Chip Systems, Inc
DISCLAIMER
This document is written in good faith with the intent to assist the readers in the use of the product.
Circuit diagrams and other information relating to Arasan Chip Systems’ products are included as a
means of illustrating typical applications. Although the information has been checked and is
believed to be accurate, no responsibility is assumed for inaccuracies. Information contained in this
document is subject to continuous improvements and developments.
Arasan Chip Systems’ products are not designed, intended, authorized or warranted for use in any
life support or other application where product failure could cause or contribute to personal injury
or severe property damage. Any and all such uses without prior written approval of an Officer of
Arasan Chip Systems Inc. will be fully at the risk of the customer.
Arasan Chip Systems Inc. disclaims and excludes any and all warranties, including without
limitation any and all implied warranties of merchantability, fitness for a particular purpose, title,
and infringement and the like, and any and all warranties arising from any course or dealing or
usage of trade.
This document may not be copied, reproduced, or transmitted to others in any manner. Nor may
any use of information in this document be made, except for the specific purposes for which it is
transmitted to the recipient, without the prior written consent of Arasan Chip Systems, Inc. This
specification is subject to change at anytime without notice. Arasan Chip Systems Inc. is not
responsible for any errors contained herein.
In no event shall Arasan Chip Systems Inc. be liable for any direct, indirect, incidental, special,
punitive, or consequential damages; or for lost of data, profits, savings or revenues of any kind;
regardless of the form of action, whether based on contract; tort; negligence of Arasan Chip
Systems or others; strict liability; breach of warranty; or otherwise; whether or not any remedy of
buyers is held to have failed of its essential purpose, and whether or not Arasan Chip Systems Inc.
has been advised of the possibility of such damages.
Restricted Rights
Use, duplication, or disclosure by the Government is subject to restrictions as set forth in
FAR52.227-14 and DFAR252.227-7013 et seq. or its successor.
Copyright Notice
No part of this specification may be reproduced in any form or means, without the prior written
consent of Arasan Chip Systems, Inc.
Questions or comments may be directed to:
Arasan Chip Systems, Inc.
2010 North First Street
Suite 510, San Jose, CA 95131.
Ph: 408-282-1600
Fx: 408-282-7800
Email: sales@arasan.com
http://www.arasan.com
Revision Number: 2.0 Copyright © 2012, Arasan Chip Systems, Inc
2
CONTENTS
1 INTRODUCTION ............................................................................................................................ 3
2 FEATURES ..................................................................................................................................... 4
3 ARCHITECTURE ............................................................................................................................. 5
3.1 D-PHY Based Interconnect Architecture ............................................................................... 5
3.2 D-PHY Lane Architecture ....................................................................................................... 6
3.3 Arasan D-PHY Architecture ................................................................................................... 7
4 D-PHY PAD TABLE ......................................................................................................................... 8
5 HARD MACRO DELIVERABLES .................................................................................................... 14
TABLES
Table 1: Function Description of D-PHY Pads for Clock Lane ......................................................... 8
Table 2: Function Description of D-PHY Pads for First Data Lane .................................................. 8
Table 3: Function Description of D-PHY Pads for Second Data Lane .............................................. 8
Table 4: Function Description of D-PHY Pads for Third Data Lane ................................................. 9
Table 5: Function Description of D-PHY Pads for Fourth Data Lane ............................................... 9
Table 6: Function Description of PLL Pads ...................................................................................... 9
Table 7: PPI Pad Table Pin Description ........................................................................................... 9
Table 8: Power Pads ...................................................................................................................... 13
Table 9: Ports for trim_bits ........................................................................................................... 13
FIGURES
Figure 1: MIPI Link Diagram for Four Data Lanes ........................................................................... 5
Figure 2: D-PHY Lane Architecture.................................................................................................. 6
Figure 3: Analog and Digital D-PHY Block Diagram ......................................................................... 7
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