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Cortex-A53_MSM8216、MSM8616、MSM8916数据手册_(高通).pdf
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Cortex-A53_MSM8216、MSM8616、MSM8916数据手册_(高通).pdf
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Qualcomm Technologies, Inc.
Confidential and Proprietary – Qualcomm Technologies, Inc.
© 2013, 2014, 2015 Qualcomm Technologies, Inc. All rights reserved.
NO PUBLIC DISCLOSURE PERMITTED: Please report postings of this document on public servers or websites to:
DocCtrlAgent@qualcomm.com.
Not to be used, copied, reproduced, or modified in whole or in part, nor its contents revealed in any manner to others without the express
written permission of Qualcomm Technologies, Inc.
MSM is a product of Qualcomm Technologies, Inc.
MSM8216/MSM8616/MSM8916
Device Specification
80-NK807-1 Rev. K
July 23, 2015
Restricted Distribution: Not to be distributed to anyone who is not an employee of either Qualcomm Technologies, Inc. or its affiliated
companies without the express approval of Qualcomm Configuration Management.
Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other countries. MSM is a trademark of Qualcomm
Incorporated, registered in the United States and other countries. All Qualcomm Incorporated trademarks are used with permission. Other
product and brand names may be trademarks or registered trademarks of their respective owners.
This technical data may be subject to U.S. and international export, re-export, or transfer (“export”) laws. Diversion contrary to U.S. and
international law is strictly prohibited.
Qualcomm Technologies, Inc.
5775 Morehouse Drive
San Diego, CA 92121
U.S.A.
Questions or comments: https://createpoint.qti.qualcomm.com/
80-NK807-1 Rev. K Confidential and Proprietary – Qualcomm Technologies, Inc. 3
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
Revision history
Bars appearing in the margin (as shown at left) indicate where technical changes have occurred for
this revision. The following table lists the technical content changes for all revisions.
Revision Date Description
A November 2013 Initial release
B December 2013
Global change: Updated package dimension
Updated the feature support information in Section 1.3.2 and Table 1-9
Updated pin map information in Chapter 2
Updated mechanical, part marking and identification details in Chapter 4
C March 2014
Global change:
Format changes throughout the doc
Added WTR4905 and WCN3660B support
Changed the clock frequencies of A53 CPU
Changed display resolution FPS rate to TBD
Updated Figure 1-1 with new block diagram, replaces QFE1101 with QFE2101
Format changes for Table 1-9
Updated Figure 2-2 with new pin map with correct color coding and sizing of
cells
Table 2-2 - Table 2-14: format changes and correct alignment of pad numbers
with pin names
Added PDN information in Chapter 3, Electrical Specification
Figure 4-1: Updated part making information; cleaned up figure and remove
some dimensions
D June 2014
Global change: Replaced MSM8916 with MSM8x16 across the document
Updated Table 1-1 with updated document titles
Updated Table 1-3 with QFE1520/1550/2550/2322
Updated Figure 1-1 with WCN3660B and QFE1520/1550/2550/2322
Updated Section 1.1, Table 1-2, Table 4-1 and Table 4-2 to include device
variant infomation
Updated Figure 2-2 with NC and DNC pins
Updated Table 2-3 with MIPI CSI pad numbers
Updated Table 2-4; Removed USB_HS_ID pin as it is an NC pin
Updated Table 2-6 on BLSP with appropriate UART and GPIO functionalities
Updated Table 2-7 with pad characteristics of JTAG signals
Updated Table 2-10 with WDOG_DISABLE for GPIO_80 and USB_HS_ID for
GPIO_110
Updated Table 2-12 with NC and DNC pins
Added Section 3.2 on operating conditions
Added Section 3.5 on power sequencing information
Added Section 3.6 on digital logic sequencing informtion
Added Section 4.4 on device moisture-sensitivity level
Added information in Chapter 5 and Chapter 6
80-NK807-1 Rev. K Confidential and Proprietary – Qualcomm Technologies, Inc. 4
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
MSM8216/MSM8616/MSM8916 Device Specification Revision history
E July 2014 Global: Updated TBDs in various tables across the document
Updated Section 1.3.3 on air interfaces
Updated Table 1-9 with RF operating band information
Updated the device variants in Table 4-2
Added Section 3.1, Section 3.2, Section 3.4, Section 3.7 to Section 3.12
Added information into Chapter 7
F August 13, 2014
Updated all MIPI CSI and DSI signal names in Figure 2-2 to match Table 2-3;
For example: MIPI_CSI0_LANE0_N has been renamed to MIPI_CSI0_LN0_N
Updated the display resolution for variant 3 and 4; and removed variant 2 in
Table 1-2 and Table 4-2
Updated clock frequency for A53 CPU in Table 3-2
Updated operating voltage values for the following in Table 3-3:
VDD_P1
VDD_MIPI
VDD_A1
VDD_WLAN
VDD_PLL1
VDD_HS_USB_CORE
VDD_PLL2
VDD_A2
VDD_USBPHY_1P8
Combined a few parameters that have same power supply sources and hence
left a few rows empty in Table 3-3.
G August 14, 2014
Updated the following signal names in Figure 2-2:
Changed pin T1 from MIPI_CSI0_LN2_P to MIPI_CSI0_LN1_P
Changed pin U2 from MIPI_CSI0_LN2_N to MIPI_CSI0_LN1_N
Changed pin V1 from MIPI_CSI0_LN3_P to MIPI_CSI0_LN2_P
Changed pin V5 from MIPI_CSI0_LN1_P to MIPI_CSI0_CLK_P
Changed pin W2 from MIPI_CSI0_LN3_N to MIPI_CSI0_LN2_N
Changed pin W6 from MIPI_CSI0_LN1_N to MIPI_CSI0_CLK_N
Changed pin Y5 from MIPI_CSI0_LN4_P to MIPI_CSI0_LN3_P
Changed pin AA6 from MIPI_CSI0_LN4_N to MIPI_CSI0_LN3_N
Changed pin AB1 from MIPI_CSI1_LN2_P to MIPI_CSI1_LN1_P
Changed pin AB3 from MIPI_CSI1_LN1_P to MIPI_CSI1_CLK_P
Changed pin AB5 from MIPI_CSI1_LN1_N to MIPI_CSI1_CLK_N
Changed pin AB7 from MIPI_DSI_DCDC to MIPI_DSI_LDO
Changed pin AC2 from MIPI_CSI1_LN2_N to MIPI_CSI1_LN1_N
Changed pin BD11 from GNSS_BB_IP2 to GNSS_BB_IM
Updated VDD_HS_USB_CORE to VDD_USB_HS in Table 3-3
Revision Date Description
80-NK807-1 Rev. K Confidential and Proprietary – Qualcomm Technologies, Inc. 5
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
MSM8216/MSM8616/MSM8916 Device Specification Revision history
H September 2014 Table 3-1, Absolute maximum ratings:
Updated absolute voltage values for the following:
– VDD_A1
– VDD_A2
– VDD_APC
– VDD_CORE
– VDD_MEM
– VDD_PLL1
Added VDD_USB_HS
Updated sample sizes for the following in Table 7-1, Silicon reliability results
and Table 7-3, Silicon reliability results:
DPPM rate (ELFR) and average failure rate (AFR) in FIT (l) failure in billion
device-hours
Mean time to failure (MTTF) t = 1/l in million hours
Updated sample sizes for the biased highly accelerated stress test in
Table 7-2, Package reliability results and Table 7-4, Package reliability results
Updated Section 7.1.3, MSM8916 reliability evaluation report for device from
Samsung with Table 7-5, Section A: Silicon reliability results and Table 7-6,
Section B: Package reliability results
Removed countries from fab sites in Section 7.2, Qualification sample
description
These letters are not used to designate document revisions as per Qualcomm documentation standards: I, O, Q,
S, X, and Z.
J October 2014
Table 2-4 Pin descriptions – connectivity functions:
Moved audio MI2S interface #1 under a new sub-heading audio clock
Updated the functional descriptions of audio MI2S interface #2
Table 2-8 MSM8x16 wakeup pins for modem power management (MPM) and
Table 2-10 Pin descriptions – general-purpose input/output ports: Updated
C40 pad type to B-PU:nppukp
Table 3-1 Absolute maximum ratings and Table 3-3 Operating conditions:
Changed VDD_MIPI_DSI_1P8 to VDD_MIPI_DSI_PLL and updated the
description
Section 3.5 Power sequencing: Removed VDD_PLL2
Section 3.10.2 UIM interface: Added a new section
Section 4.1 Device physical dimensions: Corrected the DnD links for the 760
NSP outline diagram (NT90-NK468-1)
Section 6.2.1 Land pad and stencil design: Corrected the DnD link for 760
NSP land/stencil drawing (LS90-NG134-1)
Section 6.5 High-temperature warpage: Corrected the DnD link for 760 NSP
high-temperature warpage data (WR80-NK468-1)
Revision Date Description
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