80-NK807-1 Rev. K Confidential and Proprietary – Qualcomm Technologies, Inc. 3
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
Revision history
Bars appearing in the margin (as shown at left) indicate where technical changes have occurred for
this revision. The following table lists the technical content changes for all revisions.
Revision Date Description
A November 2013 Initial release
B December 2013
Global change: Updated package dimension
Updated the feature support information in Section 1.3.2 and Table 1-9
Updated pin map information in Chapter 2
Updated mechanical, part marking and identification details in Chapter 4
C March 2014
Global change:
Format changes throughout the doc
Added WTR4905 and WCN3660B support
Changed the clock frequencies of A53 CPU
Changed display resolution FPS rate to TBD
Updated Figure 1-1 with new block diagram, replaces QFE1101 with QFE2101
Format changes for Table 1-9
Updated Figure 2-2 with new pin map with correct color coding and sizing of
cells
Table 2-2 - Table 2-14: format changes and correct alignment of pad numbers
with pin names
Added PDN information in Chapter 3, Electrical Specification
Figure 4-1: Updated part making information; cleaned up figure and remove
some dimensions
D June 2014
Global change: Replaced MSM8916 with MSM8x16 across the document
Updated Table 1-1 with updated document titles
Updated Table 1-3 with QFE1520/1550/2550/2322
Updated Figure 1-1 with WCN3660B and QFE1520/1550/2550/2322
Updated Section 1.1, Table 1-2, Table 4-1 and Table 4-2 to include device
variant infomation
Updated Figure 2-2 with NC and DNC pins
Updated Table 2-3 with MIPI CSI pad numbers
Updated Table 2-4; Removed USB_HS_ID pin as it is an NC pin
Updated Table 2-6 on BLSP with appropriate UART and GPIO functionalities
Updated Table 2-7 with pad characteristics of JTAG signals
Updated Table 2-10 with WDOG_DISABLE for GPIO_80 and USB_HS_ID for
GPIO_110
Updated Table 2-12 with NC and DNC pins
Added Section 3.2 on operating conditions
Added Section 3.5 on power sequencing information
Added Section 3.6 on digital logic sequencing informtion
Added Section 4.4 on device moisture-sensitivity level
Added information in Chapter 5 and Chapter 6
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