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Cypress MCU触摸按键设计
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详细讲解Cypress MCU触摸按键的设计及在触摸按键设计中应该注意的事项
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Copyrights
2 Document No. 001-64846 Rev. *A Getting Started with CapSense®
Copyrights
© Cypress Semiconductor Corporation, 2010-2011. The information contained herein is subject to change without notice.
Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a
Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted
nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an
express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical
components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury
to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all
risk of such use and in doing so indemnifies Cypress against all charges.
Trademarks
PSoC Designer™, SmartSense™, and TrueTouch™ are trademarks and PSoC® and CapSense ® are registered
trademarks of Cypress Semiconductor Corp. All other trademarks or registered trademarks referenced herein are property
of the respective corporations.
Source Code
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected
by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international
treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use,
modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of
creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or
representation of this Source Code except as specified above is prohibited without the express written permission of
Cypress.
Disclaimer
CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A
PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described
herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein.
Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure
may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support
systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against
all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Getting Started with CapSense Document No. 001-64846 Rev. *A 3
Contents
1. Introduction .................................................................................................................................................................... 6
1.1
How to Use This Guide .......................................................................................................................................... 6
1.2
Cypress CapSense
Products ............................................................................................................................... 6
1.2.1
Cypress CapSense Differentiation ............................................................................................................ 6
1.3 Document Revision History ................................................................................................................................... 7
1.4
Document Conventions ......................................................................................................................................... 7
2. CapSense Technology .................................................................................................................................................. 8
2.1
Capacitive Sensing Methods ................................................................................................................................. 8
2.1.1 Self Capacitance ....................................................................................................................................... 8
2.1.2
Mutual Capacitance .................................................................................................................................. 9
2.2 Self-Capacitance Equivalent Model ....................................................................................................................... 9
2.3
CapSense Sensing Technology .......................................................................................................................... 10
2.3.1
Sensing Methods .................................................................................................................................... 10
2.3.2
Capacitance Conversion ......................................................................................................................... 10
2.3.3 CapSense with Sigma Delta Modulator (CSD) ....................................................................................... 11
2.3.4
CapSense Successive Approximation Electromagnetic Compatible (CSA_EMC) .................................. 12
2.4 CapSense Tuning ................................................................................................................................................ 13
2.4.1
Signal-to-Noise Ratio (SNR) ................................................................................................................... 14
2.4.2 SmartSense™ Auto-Tuning .................................................................................................................... 14
2.5
Sensor Types ...................................................................................................................................................... 15
2.5.1 Buttons (Zero-dimensional Sensors) ...................................................................................................... 15
2.5.2
Sliders (One-dimensional Sensors) ........................................................................................................ 16
2.5.3 Touchscreens and Trackpads (Two-Dimensional Sensors) ................................................................... 18
2.5.4
Proximity (Three-dimensional Sensors) .................................................................................................. 18
2.6 Sensor Construction ............................................................................................................................................ 19
2.6.1
Field Coupled via Copper Trace (PCB) .................................................................................................. 19
2.6.2 Field Coupled via Spring/Gasket/Foam .................................................................................................. 19
2.6.3 Field Coupled via Printed Ink .................................................................................................................. 20
2.6.4
Field Coupled via ITO Film on Glass ...................................................................................................... 20
2.7 CapSense Feedback ........................................................................................................................................... 20
2.7.1
Visual Feedback ..................................................................................................................................... 20
2.7.2 Haptic Feedback ..................................................................................................................................... 24
2.7.3
Audible Feedback ................................................................................................................................... 24
2.8 CapSense System Overview ............................................................................................................................... 27
2.8.1
Hardware Component ............................................................................................................................. 27
2.8.2 Firmware Component ............................................................................................................................. 27
4 Document No. 001-64846 Rev. *A Getting Started with CapSense®
3.
Design Considerations ............................................................................................................................................... 29
3.1 Overlay Selection ................................................................................................................................................ 29
3.1.1
Relationship to CapSense Signal Strength ............................................................................................. 29
3.1.2 Bonding Overlay to PCB ......................................................................................................................... 30
3.2
ESD Protection .................................................................................................................................................... 30
3.2.1 Preventing ESD Discharge ..................................................................................................................... 30
3.2.2
Redirect .................................................................................................................................................. 31
3.2.3 Clamp ..................................................................................................................................................... 31
3.3
Electromagnetic Compatibility (EMC) Considerations ......................................................................................... 32
3.3.1 Radiated Interference ............................................................................................................................. 32
3.3.2
Radiated Emissions ................................................................................................................................ 35
3.3.3 Conducted Immunity and Emissions ....................................................................................................... 36
3.4
Software Filtering ................................................................................................................................................. 37
3.4.1 Average Filter ......................................................................................................................................... 37
3.4.2
IIR Filter .................................................................................................................................................. 39
3.4.3 Median Filter ........................................................................................................................................... 40
3.4.4
Jitter Filter ............................................................................................................................................... 42
3.4.5 Event Based Filter .................................................................................................................................. 44
3.4.6
Rule Based Filter .................................................................................................................................... 44
3.5 Power Consumption ............................................................................................................................................ 44
3.5.1
Active and Sleep Current ........................................................................................................................ 44
3.5.2 Average Current ..................................................................................................................................... 44
3.5.3
Response Time vs. Power Consumption ................................................................................................ 45
3.6 Pin Assignments .................................................................................................................................................. 46
3.7
PCB Layout Guidelines ....................................................................................................................................... 48
3.7.1 Parasitic Capacitance, C
P
...................................................................................................................... 48
3.7.2
Board Layers .......................................................................................................................................... 48
3.7.3 Board Thickness ..................................................................................................................................... 48
3.7.4
Button Design ......................................................................................................................................... 49
3.7.5 Slider Design .......................................................................................................................................... 49
3.7.6
Sensor and Device Placement ............................................................................................................... 50
3.7.7 Trace Length and Width ......................................................................................................................... 50
3.7.8
Trace Routing ......................................................................................................................................... 50
3.7.9 Crosstalk Solutions ................................................................................................................................. 51
3.7.10
Vias ......................................................................................................................................................... 52
3.7.11 Ground Plane ......................................................................................................................................... 52
3.7.12 Shield Electrode and Water Tolerance ................................................................................................... 53
4.
CapSense Product Portfolio ....................................................................................................................................... 55
4.1 Cypress’s CapSense Controller Solutions ........................................................................................................... 55
4.1.1
CapSense Express Controllers (Configurable Solutions) ....................................................................... 55
4.1.2 CapSense Controllers (Programmable Solutions) .................................................................................. 55
4.1.3
CapSense Plus (Programmable Solutions) ............................................................................................ 56
5. CapSense Selector Guide ........................................................................................................................................... 57
5.1
Selecting the Right CapSense Device ................................................................................................................. 57
6. CapSense Migration Paths ......................................................................................................................................... 60
6.1
CY8C20x34 to CY8C20xx6A/H ........................................................................................................................... 60
Getting Started with CapSense Document No. 001-64846 Rev. *A 5
6.2
CY8C21x34/B / CY8C24x94 to CY8C20xx6A/H .................................................................................................. 60
6.3 CY8C20xx6A/H to CY8C21x34/B / CY8C24x94 .................................................................................................. 60
6.4
Pin-to-Pin Compatibility ....................................................................................................................................... 61
7. Resources .................................................................................................................................................................... 62
7.1
Website ............................................................................................................................................................... 62
7.2 Device Specific Design Guides ............................................................................................................................ 62
7.3
Technical Reference Manuals ............................................................................................................................. 62
7.4 Development Kits ................................................................................................................................................ 62
7.4.1
Universal CapSense Controller Kits ........................................................................................................ 62
7.4.2 Universal CapSense Module Boards ...................................................................................................... 63
7.4.3
CapSense Express Evaluation Kits for CY8C201xx ............................................................................... 63
7.4.4 CapSense Express Evaluation Kits for CY8CMBR2044 ......................................................................... 63
7.4.5
Evaluation Pods ...................................................................................................................................... 63
7.4.6 In-Circuit Emulation (ICE) Kits ................................................................................................................ 64
7.5
Demonstration Kit ................................................................................................................................................ 64
7.6 I
2
C-to-USB Bridge Kit .......................................................................................................................................... 64
7.7
PSoC Programmer .............................................................................................................................................. 65
7.8 Multi-Chart ........................................................................................................................................................... 65
7.9
PSoC Designer .................................................................................................................................................... 66
7.10 Design Support .................................................................................................................................................... 66
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