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AMC.0_R2.0标准
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定义了AMC电路板的接口规范. PICMG® AMC.0 R2.0 Short Form Specification December 28, 2006 For General Information Only - Do Not Use This Short Form for Design
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PICMG® AMC.0 R2.0 Short Form Specification
Do not specify or claim compliance to this Short Form Specification
Page 1 of 56
For General Information Only - Do Not Use This Short Form for Design
PICMG® AMC.0 R2.0
Short Form Specification
December 28, 2006
For General Information Only - Do Not Use This Short Form for Design
PICMG® AMC.0 R2.0 Short Form Specification
Do not specify or claim compliance to this Short Form Specification
Page 2 of 56
For General Information Only - Do Not Use This Short Form for Design
©Copyright 2006, PCI Industrial Computer Manufacturers Group.
The attention of adopters is directed to the possibility that compliance with or adoption of PICMG® specifications may require use of an invention
covered by patent rights. PICMG® shall not be responsible for identifying patents for which a license may be required by any PICMG® specification or
for conducting legal inquiries into the legal validity or scope of those patents that are brought to its attention. PICMG® specifications are prospective
and advisory only. Prospective users are responsible for protecting themselves against liability for infringement of patents.
NOTICE:
The information contained in this document is subject to change without notice. The material in this document details a PICMG® specification in
accordance with the license and notices set forth on this page. This document does not represent a commitment to implement any portion of this
specification in any company's products.
WHILE THE INFORMATION IN THIS PUBLICATION IS BELIEVED TO BE ACCURATE, PICMG® MAKES NO WARRANTY OF ANY KIND,
EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL INCLUDING, BUT NOT LIMITED TO, ANY WARRANTY OF TITLE OR OWNERSHIP,
IMPLIED WARRANTY OF MERCHANTABILITY OR WARRANTY OF FITNESS FOR PARTICULAR PURPOSE OR USE.
In no event shall PICMG® be liable for errors contained herein or for indirect, incidental, special, consequential, reliance or cover damages, including
loss of profits, revenue, data or use, incurred by any user or any third party. Compliance with this specification does not absolve manufacturers of
CompactPCI® Express equipment from the requirements of safety and regulatory agencies (UL, CSA, FCC, IEC, etc.).
PICMG®, CompactPCI®, AdvancedTCA®, ATCA®, CompactPCI® Express and the PICMG, CompactPCI, AdvancedTCA and ATCA logos are
registered trademarks, and COM Express™, MicroTCA™, µTCA™, CompactTCA™, AdvancedMC™ and SHB Express™ are trademarks of the PCI
Industrial Computer Manufacturers Group. All other brand or product names may be trademarks or registered trademarks of their respective holders.
PICMG® AMC.0 R2.0 Short Form Specification
Do not specify or claim compliance to this Short Form Specification
Page 3 of 56
For General Information Only - Do Not Use This Short Form for Design
Introduction and objectives 1
1.1 Overview
¶ 1 The PICMG
®
Advanced Mezzanine Card™ (AdvancedMC or AMC) specification defines
the base-level requirements for a wide-range of high-speed mezzanine cards optimized for,
but not limited to, AdvancedTCA
®
Carriers and PICMG
®
Micro Telecommunications
Computing Architecture (MicroTCA
TM
) systems. This base specification defines the common
elements for Modules and Carriers including mechanical, management, power, thermal, and
the connector and signals that interconnect them. Subsidiary specifications will define the
usage requirements for mapping specific interconnect protocols between AdvancedMC
Modules and Carriers. Example interconnect protocols include PCI Express, Advanced
Switching, Serial RapidIO, and Gigabit Ethernet.
1.2 Introduction
¶ 2 AdvancedMC defines a modular add-on or “child” card that extends the functionality of a
Carrier Board (see Figure 1-1). Often referred to as mezzanines, these cards are called
“AdvancedMC Modules” or “Modules” throughout this document. AdvancedMC Modules
lie parallel to and are integrated onto the Carrier Board by plugging into an AdvancedMC
Connector. Carrier Boards can range from passive boards with minimal “intelligence” to
high performance single board computers. AdvancedMCs are also the core of PICMG's
MicroTCA specification. Instead of employing a Carrier Board, MicroTCA configures
AdvancedMCs directly on the backplane. Refer to the MicroTCA specification for more
details.
¶ 3 AdvancedMC enables a modular building block design for industry standard and proprietary
Carrier Boards and MicroTCA systems. This AMC.0 specification enables larger markets
with more unique functions and creates economies of scale that lower prices.
¶ 4 Envisioned AdvancedMC Modules cover a wide range in terms of their functionality and
include the following examples:
• Telecom connectivity (ATM/POS [OC-3/12/48], T1/E1, VoIP, GbE, etc.)
• Processors (CPUs, DSPs, and FPGAs)
• Network communication processors (NPUs)
• Network communications co-processors (Classification, Security or Intrusion Detection)
• Mass storage
PICMG® AMC.0 R2.0 Short Form Specification
Do not specify or claim compliance to this Short Form Specification
Page 4 of 56
For General Information Only - Do Not Use This Short Form for Design
Figure 1-1 Four AdvancedMC Modules on an AMC Carrier AdvancedTCA Board
1.2.1 Scope
¶ 5 This AMC.0 specification defines the framework or base requirements for a family of
anticipated subsidiary specifications. The objective of this document is to define the
requirements for mechanical, thermal, power, interconnect (including I/O), system
management (including Hot Swap), and regulatory guidelines for AdvancedMC Modules
and Carriers. It includes the definitions and requirements for Face Plates with ejectors,
defined component spaces, complete mechanical dimensions, thermal definitions, mounting,
guides, and a connector necessary to interface between the Module and the Carrier Board.
Carrier Board examples in this specification focus on single Slot AdvancedTCA Board
implementations but the features and requirements can be applied to other Carrier form
factors.
¶ 6 Some of the changes incorporated into AMC.0 Release 2.0 include:
• New AMC Connector options for connecting to a Carrier Board. Press fit, surface
mount, and through-hole style connectors are allowed along with the original
compression fit style AMC Connector.
• New naming convention for Module sizes. Modules formally called “Half-height, Full-
height and Extended Full-height” are now called “Compact, Mid-size and Full-size”
Modules.
• Mid-size Module defined with new Face Plate dimensions optimized for ATCA
conventional Carrier usage.
PICMG® AMC.0 R2.0 Short Form Specification
Do not specify or claim compliance to this Short Form Specification
Page 5 of 56
For General Information Only - Do Not Use This Short Form for Design
• Port 16 allocated for telecom clock usage. In total there are now four pairs dedicated for
telecom clock usage and one dedicated for fabric clock usage.
• A new Electronic Keying capability used for managing /configuring clocks.
• Improved Module Face Plate LED placement guidelines in keeping with Central Office
practices.
• Allowance for new varieties of AMC ejector handles.
• The amount of maximum Module power was increased from 60W to 80W for payload
and increased from 100mA to 150mA for Management Power.
¶ 7 This AMC.0 specification does not define specific interconnect usage, although it is
optimized for current and emerging LVDS interconnect standards, such as PCI Express,
Advanced Switching, Serial RapidIO, and Gigabit Ethernet. The Port mapping definitions
for these and other interconnect protocols will be provided through AMC.x subsidiary
specifications.
1.2.2 Design goals
¶ 8 This AMC.0 specification was written with the following design goals in mind:
• PICMG 3.0 optimized: All elements must work within the bounds of the PICMG 3.0
base specification and build upon its strengths of Reliability, Availability, and
Serviceability (RAS). The AdvancedMC Module is not limited by other chassis
standards.
• Building block for MicroTCA: After the initial release of this specification, PICMG
developed the MicroTCA specification, PICMG MicroTCA.0, which uses AMC
Modules plugged directly into a backplane.
• System management: System management is an extension of the PICMG 3.0 Shelf
management scheme.
• Hot Swap support: Hot Swap of AdvancedMC Modules is enabled in support of
Availability and Serviceability objectives. The focus is on front loadable Hot Swap
Modules with non Hot Swap being an optional implementation.
• Low Voltage Differential Signaling (LVDS) interconn3ect: AdvancedMC is
optimized for LVDS interconnects.
• Low pin count: The interconnect is conservative in its total pin count, thereby reducing
the amount of space required on both the Module and the Carrier Board, yet provide
sufficient real estate for intended interconnects and usage models.
• Support for a rich mix of processors: This includes compute processors (CPUs),
network processors (NPUs), and digital signal processors (DSPs).
Table 1-1 AMC.x subsidiary specifications
Specification Title
AMC.1 PCI Express and Advanced Switching on AdvancedMC
AMC.2 AMC Gigabit Ethernet/ 10 Gigabit XAUI Ethernet
AMC.3 Advanced Mezzanine Card Specification for Storage
AMC.4 Serial RapidIO
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