qcc3024_vfbga_data_sheet.pdf

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Device description

■

High-performance programmable Bluetooth

stereo audio

SoC

■

Fully qualified single-chip dual-mode Bluetooth v5.0

system

■

Tri-core processor architecture with low power for

extended battery life

Applications

■

Wired/wireless stereo headsets/headphones

■

Qualcomm TrueWireless

™

stereo earbuds

Features

■

Qualified

to Bluetooth

v5.0

specification

■

120 MHz Qualcomm

Kalimba

™

audio DSP

■

32 MHz Developer

Processor for applications

■

Firmware Processor for

system

■

Flexible QSPI flash

programmable platform

■

Advanced audio algorithms

■

High-performance 24‑bit

stereo audio interface

■

Digital and analog

microphone interfaces

■

Flexible PIO controller and

LED pins with PWM support

■

1 or 2-mic Qualcomm

cVc

™

headset noise

reduction and echo

cancellation technology

■

SBC and AAC audio codecs

support

■

Serial interfaces: UART, Bit

Serializer (I²C/SPI),

USB 2.0

■

Integrated PMU: Dual

SMPS for system/digital

circuits, Integrated Li-ion

battery charger

■

90-ball 5.5 x 5.5 x 1.0 mm,

0.5 mm pitch VFBGA

System architecture

XTAL

Ext Memory

Bluetooth

Radio

Digital

Audio

Interface

I/O

and

USB

Qualcomm

Kalimba™

DSP

Apps

Developer

Processor

Apps

Firmware

Processor

UART/USB

PIO

I²C/SPI

Stereo HQ

ADC

Stereo

Class-D or

Class-AB

Headphones

Line Out

LED Driver

with PWM

SMPS

LDOs

Li-Ion

Charger

Line In / Dual

Analog Mic In

Headphones

Line Out

I²S/PCM

Battery

LED

DigMic

Confidential and Proprietary – Qualcomm Technologies International, Ltd.

NO PUBLIC DISCLOSURE PERMITTED: Please report postings of this document on public servers or websites to DocCtrlAgent@qualcomm.com.

Restricted Distribution: Not to be distributed to anyone who is not an employee of either Qualcomm T

echnologies International, Ltd. or its affiliated companies

without the express approval of Qualcomm Configuration Management.

Not to be used, copied, reproduced, or modified in whole or in part, nor its contents revealed in any manner to others without the express written permission of

Qualcomm Technologies International, Ltd.

All Qualcomm products mentioned herein are products of Qualcomm Technologies, Inc. and/or its subsidiaries. All Qualcomm products mentioned herein are

products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Qualcomm and Qualcomm TrueWireless are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kalimba and Kymera are

trademarks of Qualcomm Technologies International, Ltd. cVc is a trademark of Qualcomm Technologies International, Ltd., registered in the United States and

other countries. Other product and brand names may be trademarks or registered trademarks of their respective owners.

This technical data may be subject to U.S. and international export, re-export, or transfer ("export") laws. Diversion contrary to U.S. and international law is strictly

prohibited.

Qualcomm Technologies International, Ltd. (formerly known as Cambridge Silicon Radio Limited) is a company registered in England and Wales with a registered

office at: Churchill House, Cambridge Business Park, Cowley Road, Cambridge, CB4 0WZ, United Kingdom.

Registered Number: 3665875 | VAT number: GB787433096

QCC3024 VFBGA

Production Information

Data Sheet

80-CG232-1 Rev. AA

June 19, 2018

Device details

Audio subsystem

■

32‑bit

Kalimba audio digital signal processor (DSP) core

with flexible clocking from 2 MHz to 120 MHz to allow

optimization and trade-off performance vs. power

consumption

■

DSP runs from ROM

■

80 KB program random access memory (RAM)

■

256 KB data RAM

■

5 Mb ROM

Application subsystem

■

Dual core application subsystem 32 MHz operation

■

32‑bit Firmware Processor:

□

Reserved for system use

□

Runs Bluetooth upper stack, profiles, house-keeping

code

■

32‑bit Developer Processor:

□

Runs developer applications

■

Both cores execute code from external flash memory using

QSPI clocked at 32 MHz

■

On-chip caches per core allow for optimized performance

and power consumption

Bluetooth subsystem

■

Qualified to Bluetooth v5.0 specification including 2 Mbps

Bluetooth low energy (Production parts)

■

Single ended antenna connection with on-chip balun and

Tx/Rx switch

■

Bluetooth, Bluetooth low energy, and mixed topologies

supported

■

Class 1 support

Li-ion battery charger

■

Integrated

battery charger supporting internal mode (up to

200 mA) and external mode (up to 1.8 A)

■

Variable float (or termination) voltage adjustable in 50 mV

steps from 3.65 V to 4.4 V

■

Thermal monitoring and management are implementable

in application software

■

Pre-charge to fast charge transition configurable at 2.5 V,

2.9 V, 3.0 V, and 3.1 V

Power management

■

Integrated power management unit (PMU) to minimize

external components

■

QCC3024 VFBGA runs directly from a Li-ion, USB, or

external supply (2.8 V to 6.5 V)

■

Auto-switching between battery and USB (or other)

charging source

■

Power islands employed to optimize power consumption

for variety of use-cases

■

Dual switch-mode power supply (SMPS):

□

Automatic mode selection to minimize power

consumption

□

1.8 V SMPS generates power for both the device and

off-chip circuits

□

Dedicated digital SMPS (output voltage changes

automatically to minimize device power consumption)

80-CG232-1 Rev. AA Confidential and Proprietary – Qualcomm Technologies International, Ltd.

Y CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION

Audio engine and digital audio interfaces

■

x bidirectional 24‑bit I²S interface

■

Programmable audio master clock (MCLK)

■

Stereo analog outputs configurable as differential Class-

AB headphone outputs or differential high efficiency Class-

D outputs:

□

Class-D signal-to-noise ratio (SNR): 98.3 dBA typ.

□

Class-D total harmonic distortion plus noise (THD

+N): -87.5 dB typ.

□

Class-AB SNR: 101 dBA typ.

□

Class-AB THD+N: -90.5 dB typ.

■

Dual analog inputs configurable as single ended line inputs

or, unbalanced or balanced analog microphone inputs:

□

SNR single-ended: 101 dBA typ.

□

THD+N single-ended: -85 dB typ.

■

1 microphone bias (single bias shared by the two

channels):

□

Crosstalk attenuation between two inputs using

recommended application circuit: 65 dB

■

Digital microphone inputs with capability to interface up to

6 digital microphones

■

Both analog-to-digital converter (ADC)s and digital-to-

analog converter (DAC)s support sample rates of 8, 16,

32, 44.1, 48, 96 kHz. DACs also support 192 kHz.

Peripherals and physical interfaces

■

UART interface

■

2 x Bit Serializers (programmable serial peripheral

interface (SPI) and I²C hardware accelerator)

■

1 x USB interface:

□

A full speed USB (USB-FS) Device (12 Mbps)

– USB interface includes ESD protection to

IEC-61000-4-2 (device level)

■

QSPI NOR flash interface

□

QSPI encryption to protect developer code and data

□

Encryption programmable with a 128‑bit security key of

original equipment manufacturer (OEM) choice stored in

on-chip one-time programmable (OTP) memory

■

Up to 20 PIO and 5 open drain/digital input LED pads with

pulse width modulation (PWM)

Package and compliance

■

90-ball 5.5 x 5.5 x 1.0 mm, 0.5 mm pitch VFBGA

■

Green (restriction of hazardous substances (RoHS)

compliant and no antimony or halogenated flame

retardants)

QCC3024 VFBGA Data Sheet Device details

80-CG232-1 Rev. AA Confidential and Proprietary – Qualcomm Technologies International, Ltd.

Y CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION

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