STM32F303RE数据手册.pdf

数据手册

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This is information on a product in full production.

October 2016 DocID026415 Rev 5 1/173

STM32F303xD STM32F303xE

ARM

Cortex

-M4 32b MCU+FPU, up to 512KB Flash, 80KB SRAM,

FSMC, 4 ADCs, 2 DAC ch., 7 comp, 4 Op-Amp, 2.0-3.6 V

Datasheet - production data

Features

• Core: ARM

Cortex

-M4 32-bit CPU with

72 MHz FPU, single-cycle multiplication and

HW division, 90 DMIPS (from CCM), DSP

instruction and MPU (memory protection unit)

• Operating conditions:

–V

, V

DDA

voltage range: 2.0 V to 3.6 V

• Memories

– Up to 512 Kbytes of Flash memory

– 64 Kbytes of SRAM, with HW parity check

implemented on the first 32 Kbytes.

– Routine booster: 16 Kbytes of SRAM on

instruction and data bus, with HW parity

check (CCM)

– Flexible memory controller (FSMC) for

static memories, with four Chip Select

• CRC calculation unit

• Reset and supply management

– Power-on/Power-down reset (POR/PDR)

– Programmable voltage detector (PVD)

– Low-power modes: Sleep, Stop and

Standby

–V

BAT

supply for RTC and backup registers

• Clock management

–4

to 32 MHz crystal oscillator

– 32 kHz oscillator for RTC with calibration

– Internal 8 MHz RC with x 16 PLL option

–

Internal 40 kHz oscillator

• Up to 115 fast I/Os

– All mappable on external interrupt vectors

– Several 5 V-tolerant

• Interconnect matrix

• 12-channel DMA controller

• Four ADCs 0.20 µs (up to 40 channels)

with

selectable resolution of 12/10/8/6 bits, 0 to

3.6 V conversion range, separate analog

supply from 2.0 to 3.6 V

• Two 12-bit DAC channels with analog supply

from 2.4 to 3.6 V

• Seven ultra-fast rail-to-rail analog comparators

with analog supply from 2.0 to 3.6 V

• Four operational amplifiers that can be used

PGA mode, all terminals accessible with

analog supply from 2.4 to 3.6 V

•

Up to 24 capacitive sensing channels supporting

touchkey, linear and rotary touch sensor

• Up to 14 timers:

– One 32-bit timer and two 16-bit timers with

up to four IC/OC/PWM or pulse counter

and quadrature (incremental) encoder input

– Three 16-bit 6-channel advanced-contro

timers, with up to six PWM channels,

deadtime generation and emergency stop

– One 16-bit timer with two IC/OCs, one

OCN/PWM, deadtime generation an

emergency stop

– Two 16-bit timers with IC/OC/OCN/PWM,

deadtime generation and emergency stop

– Two watchdog timers (independent,

window)

– One SysTick timer: 24-bit downcounter

– Two 16-bit basic timers to drive the DAC

• Calendar RTC with Alarm, periodic wakeup

from Stop/Standby

• Communication interfaces

– CAN interface (2.0B Active)

LQFP64

LQF

P100

LQFP144

UFBGA100

(10 × 10 mm)

(14 × 14 mm)

(20 x 20 mm)

(7 x 7 mm)

WLCSP100

(

4.775 x 5.041 mm

)

www.st.com

DocID026415 Rev 5 3/173

STM32F303xD STM32F303xE Contents

Contents

1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

3 Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

3.1 ARM

Cortex

-M4 core with FPU with embedded Flash and SRAM . . . 16

3.2 Memory protection unit (MPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

3.3 Embedded Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

3.4 Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.5 Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.6 Cyclic redundancy check (CRC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.7 Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.7.1 Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.7.2 Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.7.3 Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.7.4 Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

3.8 Interconnect matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

3.9 Clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

3.10 General-purpose input/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . . . 22

3.11 Direct memory access (DMA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

3.12 Flexible static memory controller (FSMC) . . . . . . . . . . . . . . . . . . . . . . . . 22

3.13 Interrupts and events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3.13.1 Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . 23

3.14 Fast analog-to-digital converter (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3.14.1 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

3.14.2 Internal voltage reference (V

REFINT

) . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

3.14.3 V

BAT

battery voltage monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

3.14.4 OPAMP reference voltage (VREFOPAMP) . . . . . . . . . . . . . . . . . . . . . . 24

3.15 Digital-to-analog converter (DAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

3.16 Operational amplifier (OPAMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

3.17 Ultra-fast comparators (COMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

3.18 Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Contents STM32F303xD STM32F303xE

4/173 DocID026415 Rev 5

3.18.1 Advanced timers (TIM1, TIM8, TIM20) . . . . . . . . . . . . . . . . . . . . . . . . . 26

3.18.2 General-purpose timers (TIM2, TIM3, TIM4, TIM15, TIM16, TIM17) . . 26

3.18.3 Basic timers (TIM6, TIM7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

3.18.4 Independent watchdog (IWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

3.18.5 Window watchdog (WWDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

3.18.6 SysTick timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

3.19 Real-time clock (RTC) and backup registers . . . . . . . . . . . . . . . . . . . . . . 28

3.20 Inter-integrated circuit interface (I

C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

3.21 Universal synchronous/asynchronous receiver transmitter (USART) . . . 29

3.22 Universal asynchronous receiver transmitter (UART) . . . . . . . . . . . . . . . 30

3.23 Serial peripheral interface (SPI)/Inter-integrated sound interfaces (I

S) . 30

3.24 Controller area network (CAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

3.25 Universal serial bus (USB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

3.26 Infrared transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

3.27 Touch sensing controller (TSC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

3.28 Development support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

3.28.1 Serial wire JTAG debug port (SWJ-DP) . . . . . . . . . . . . . . . . . . . . . . . . . 33

3.28.2 Embedded Trace Macrocell . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

4 Pinout and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

5 Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

6 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

6.1 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

6.1.1 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

6.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

6.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

6.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

6.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

6.1.6 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

6.1.7 Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

6.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

6.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

6.3.1 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

6.3.2 Operating conditions at power-up / power-down . . . . . . . . . . . . . . . . . . 73

DocID026415 Rev 5 5/173

STM32F303xD STM32F303xE Contents

6.3.3 Embedded reset and power control block characteristics . . . . . . . . . . . 73

6.3.4 Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

6.3.5 Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

6.3.6 Wakeup time from low-power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

6.3.7 External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

6.3.8 Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 92

6.3.9 PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

6.3.10 Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94

6.3.11 FSMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94

6.3.12 EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

6.3.13 Electrical sensitivity characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

6.3.14 I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 117

6.3.15 I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

6.3.16 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123

6.3.17 Timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124

6.3.18 Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125

6.3.19 ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132

6.3.20 DAC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144

6.3.21 Comparator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 146

6.3.22 Operational amplifier characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 148

6.3.23 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 150

6.3.24 V

BAT

monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151

7 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152

7.1 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152

7.2 LQFP144 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152

7.3 UFBGA100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156

7.4 LQFP100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159

7.5 WLCSP100 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162

7.6 LQFP64 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165

7.7 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168

7.7.1 Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168

7.7.2 Selecting the product temperature range . . . . . . . . . . . . . . . . . . . . . . 168

8 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171

9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172

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