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应用文档:
泰凌 TLSR5316 BLE SDK
开发指南
AN-19071701-C1
Ver1.0.0
2019/7/17
TELINK SEMICONDUCTOR
简介:
本文档为泰凌微电子 TLSR5316 BLE SDK 1.2.0 的开发
指南。
泰凌 TLSR5316 BLE SDK 开发指南
AN-17092701-C3 1 Ver1.2.0
Published by
Telink Semiconductor
Bldg 3, 1500 Zuchongzhi Rd,
Zhangjiang Hi-Tech Park, Shanghai, China
© Telink Semiconductor
All Right Reserved
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Telink Semiconductor reserves the right to make changes without further notice to
any products herein to improve reliability, function or design. Telink Semiconductor
disclaims any and allliability for any errors, inaccuracies or incompleteness contained
hereinor in any other disclosure relating to any product.
Telink Semiconductor does not assume any liability arising out of the application or
use of any product or circuit described herein; neither does it convey any license
under its patent rights, nor the rights of others
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Information:
For further information on the technology, product and business term, please
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泰凌 TLSR5316 BLE SDK 开发指南
AN-17092701-C3 2 Ver1.2.0
版本历史
版本
主要改动
日期
作者 & 标准化
1.0.0
初始版本
2019/7
Wangsihui,
Tuyafei,Chenqiuwei
泰凌 TLSR5316 BLE SDK 开发指南
AN-17092701-C3 3 Ver1.2.0
目录
目录 ............................................................................................................................... 3
1 SDK 介绍 ............................................................................................................... 14
1.1 软件组织架构................................................................................................ 14
1.1.1 main.c ...................................................................................................... 15
1.1.2 app_config.h ........................................................................................... 15
1.1.3 application file......................................................................................... 15
1.1.4 BLE stack entry ........................................................................................ 16
1.2 适用 IC 介绍 .................................................................................................. 16
1.3 library 介绍 .................................................................................................... 17
1.4 Demo 介绍 ..................................................................................................... 18
1.4.1 BLE slave demo ....................................................................................... 18
1.4.2 feature demo and driver demo .............................................................. 18
2 MCU 基础模块 ..................................................................................................... 20
2.1 MCU 地址空间 .............................................................................................. 20
2.1.1 MCU 地址空间分配 ............................................................................... 20
2.1.2 Sram 空间分配 ....................................................................................... 21
2.1.2.1 Sram 和 Firmware 空间 .......................................................................... 21
2.1.2.2 list 文件分析 demo ................................................................................. 25
2.1.3 MCU 地址空间访问 ............................................................................... 29
2.1.3.1 外设空间的读写操作 ..................................................................... 29
2.1.3.2 flash 空间的操作 .................................................................................... 30
2.1.4 SDK FLASH 空间的分配 .......................................................................... 33
2.1.4.1 512K Flash 的地址分配 .......................................................................... 34
2.1.4.2 128K Flash 的地址分配 .......................................................................... 36
2.2 时钟模块........................................................................................................ 38
2.2.1 System clock & System timer .................................................................. 38
2.2.2 System Timer 的使用 ............................................................................. 40
泰凌 TLSR5316 BLE SDK 开发指南
AN-17092701-C3 4 Ver1.2.0
2.3 GPIO 模块 ...................................................................................................... 42
2.3.1 GPIO 定义 ............................................................................................... 42
2.3.2 GPIO 状态控制 ....................................................................................... 42
2.3.3 GPIO 的初始化 ....................................................................................... 44
2.3.4 配置 SWS 上拉防止死机 ....................................................................... 45
3 BLE 模块 ............................................................................................................... 47
3.1 BLE SDK 软件架构 ......................................................................................... 47
3.1.1 标准 BLE SDK 软件架构 ......................................................................... 47
3.1.2 Telink BLE SDK 软件架构 ........................................................................ 48
3.1.2.1 Telink BLE controller ................................................................................ 48
3.1.2.2 5316 BLE slave ......................................................................................... 49
3.2 BLE controller ................................................................................................. 51
3.2.1 BLE controller 介绍 ................................................................................. 51
3.2.2 Link Layer 状态机 ................................................................................... 51
3.2.3 Link Layer 状态机组合应用 ................................................................... 53
3.2.3.1 Link Layer 状态机初始化 ........................................................................ 53
3.2.3.2 Idle + Advtersing ...................................................................................... 53
3.2.3.3 Idle + Advtersing + ConnSlaveRole .......................................................... 54
3.2.4 Link Layer 时序 ...................................................................................... 55
3.2.4.1 Idle state 时序 ........................................................................................ 56
3.2.4.2 Advertising state 时序 ............................................................................. 56
3.2.4.3 Conn state Slave role 时序 ...................................................................... 57
3.2.4.4 Conn state Slave role 时序保护 .............................................................. 58
3.2.5 Link Layer TX fifo & RX fifo ...................................................................... 59
3.2.6 Controller HCI Event ............................................................................... 62
3.2.6.1 HCI event ................................................................................................. 63
3.2.6.2 HCI LE event ............................................................................................. 65
3.2.7 Telink defined event ............................................................................... 67
3.2.7.1 BLT_EV_FLAG_ADV .................................................................................. 71
剩余214页未读,继续阅读
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