sonyimx274sensordatasheet

imx274

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Diagonal 7.20 mm (Type 1/2.5) CMOS Image Sensor with Square Pixel for Color

Cameras

TENTATIVE

IMX274LQC-C

Description

The IMX274LQC-C is a diagonal 7.20 mm (Type 1/2.5) CMOS image sensor with a color square pixel array and

approximately 8.51 M effective pixels. 12-bit digital output makes it possible to output the signals of approximately

8.51 M effective pixels with high definition for shooting still pictures.

It also operates with three power supply voltages: analog 2.8 V, digital 1.2 V, and 1.8 V for I/O interface and achieves

low power consumption.

Furthermore, it realizes 12-bit digital output for shooting high-speed and high-definition moving pictures by horizontal

and vertical addition and subsampling. Realizing high-sensitivity, low dark current, this sensor also has an electronic

shutter function with variable storage time.

(Application: Surveillance, FA cameras, Industrial cameras)

Features

◆ CMOS active pixel type pixels

◆ Input clock frequency 6 to 27 MHz (CSI-2), 12/24/36/72 MHz (Sub-LVDS)

◆ Both MIPI Specifications (CSI-2 high-speed serial interface) and Sub-LVDS supported

◆ All-pixel scan mode 12-bit, 10-bit

Horizontal/vertical 2/2-line binning mode 12-bit, 10-bit

Vertical 2/3 subsampling binning horizontal 3 binning mode

Vertical 2/8 subsampling horizontal 3 binning mode

◆ High-sensitivity, low dark current, no smear, excellent anti-blooming characteristics

◆ Vertical and horizontal arbitrary cropping function

◆ Variable-speed shutter function (minimum unit: 1 horizontal period)

◆ Low power consumption

◆ High dynamic range (HDR) function: Digital overlap HDR

◆ H driver, V driver and serial communication circuit on chip

◆ CDS/PGA on chip: Gain +27 dB (step pitch 0.1 dB)

◆ 10-bit/12-bit A/D conversion on chip

◆ R, G, B primary color mosaic filters on chip

◆ All-pixel simultaneous reset supported

◆ 92-pin high-precision ceramic package

Sony reserves the right to change products and specifications without prior notice.

This information does not convey any license by any implication or otherwise under any patents or other right.

Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for

any problems arising out of the use of these circuits.

IMX274LQC-C

USE RESTRICTION NOTICE

This USE RESTRICTION NOTICE ("Notice") is for customers who are considering or currently using the

image sensor products ("Products") set forth in this specifications book. Sony Corporation ("Sony") may,

at any time, modify this Notice which will be available to you in the latest specifications book for the

Products. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has its

own use restriction notice on the Products, such a use restriction notice will additionally apply between

you and the subsidiary or distributor. You should consult a sales representative of the subsidiary or

distributor of Sony on such a use restriction notice when you consider using the Products.

Use Restrictions

 The Products are intended for incorporation into such general electronic equipment as office products,

communication products, measurement products, and home electronics products in accordance with

the terms and conditions set forth in this specifications book and otherwise notified by Sony from time

to time.

 You should not use the Products for critical applications which may pose a life- or injury-threatening

risk or are highly likely to cause significant property damage in the event of failure of the Products. You

should consult your sales representative beforehand when you consider using the Products for such

critical applications. In addition, you should not use the Products in weapon or military equipment.

 Sony disclaims and does not assume any liability and damages arising out of misuse, improper use,

modification, use of the Products for the above-mentioned critical applications, weapon and military

equipment, or any deviation from the requirements set forth in this specifications book.

Design for Safety

 Sony is making continuous efforts to further improve the quality and reliability of the Products; however,

failure of a certain percentage of the Products is inevitable. Therefore, you should take sufficient care

to ensure the safe design of your products such as component redundancy, anti-conflagration features,

and features to prevent mis-operation in order to avoid accidents resulting in injury or death, fire or

other social damage as a result of such failure.

Export Control

 If the Products are controlled items under the export control laws or regulations of various countries,

approval may be required for the export of the Products under the said laws or regulations.

You should be responsible for compliance with the said laws or regulations.

No License Implied

 The technical information shown in this specifications book is for your reference purposes only. The

availability of this specifications book shall not be construed as giving any indication that Sony and its

licensors will license any intellectual property rights in such information by any implication or otherwise.

Sony will not assume responsibility for any problems in connection with your use of such information or

for any infringement of third-party rights due to the same. It is therefore your sole legal and financial

responsibility to resolve any such problems and infringement.

Governing Law

 This Notice shall be governed by and construed in accordance with the laws of Japan, without reference

to principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relating

to this Notice shall be submitted to the exclusive jurisdiction of the Tokyo District Court in Japan as the

court of first instance.

Other Applicable Terms and Conditions

 The terms and conditions in the Sony additional specifications, which will be made available to you when

you order the Products, shall also be applicable to your use of the Products as well as to this

specifications book. You should review those terms and conditions when you consider purchasing

and/or using the Products.

General-0.0.8

IMX274LQC-C

Contents

Description -------------------------------------------------------------------------------------------------------------------------------------------- 1

Features ----------------------------------------------------------------------------------------------------------------------------------------------- 1

Device Structure ------------------------------------------------------------------------------------------------------------------------------------- 2

Optical Black Array and Readout Scan Direction --------------------------------------------------------------------------------------------- 2

Absolute Maximum Ratings ----------------------------------------------------------------------------------------------------------------------- 3

Recommended Operating Conditions ----------------------------------------------------------------------------------------------------------- 3

USE RESTRICTION NOTICE -------------------------------------------------------------------------------------------------------------------- 4

Contents ----------------------------------------------------------------------------------------------------------------------------------------------- 5

Optical Center ---------------------------------------------------------------------------------------------------------------------------------------- 8

Pin Configuration ------------------------------------------------------------------------------------------------------------------------------------ 8

Pin Description --------------------------------------------------------------------------------------------------------------------------------------- 9

When using CSI-2 ........................................................................................................................................................9

When using Sub-LVDS ............................................................................................................................................... 12

I/O Equivalent Circuit Diagram-------------------------------------------------------------------------------------------------------------------15

Peripheral Circuit -----------------------------------------------------------------------------------------------------------------------------------19

System Outline --------------------------------------------------------------------------------------------------------------------------------------20

When using CSI-2 ...................................................................................................................................................... 20

When using Sub-LVDS ............................................................................................................................................... 20

Electrical Characteristics when using CSI-2 --------------------------------------------------------------------------------------------------21

1. DC Characteristics (CSI-2) ...................................................................................................................................... 21

Current Consumption and Gain Variable Range (CSI-2) ........................................................................................... 21

Supply Voltage and I/O Voltage (CSI-2) ................................................................................................................... 21

2. AC Characteristics (CSI-2) ...................................................................................................................................... 22

INCK, XCLR (CSI-2) ............................................................................................................................................... 22

XHS, XVS (Output) (CSI-2) ..................................................................................................................................... 22

C Communication (CSI-2) ..................................................................................................................................... 23

DMCKP / DMCKN，DMO (CSI-2)............................................................................................................................ 23

Electrical Characteristics When Using Sub-LVDS -------------------------------------------------------------------------------------------24

1. DC Characteristics (Sub-LVDS) .............................................................................................................................. 24

Current Consumption and Gain Variable Range (Sub-LVDS) .................................................................................... 24

Supply Voltage and I/O Voltage (Sub-LVDS) ............................................................................................................ 24

LVDS Output DC Characteristics (Sub-LVDS) .......................................................................................................... 24

2. AC Characteristics (Sub-LVDS) ............................................................................................................................... 25

INCK, XCLR, XVS (input), XHS (input) (Sub-LVDS) ................................................................................................. 25

Serial Communication (Sub-LVDS) .......................................................................................................................... 25

Sub-LVDS Output (Sub-LVDS) ................................................................................................................................ 26

Spectral Sensitivity Characteristics (CSI-2 and Sub-LVDS) -------------------------------------------------------------------------------27

Image Sensor Characteristics (CSI-2 and Sub-LVDS)--------------------------------------------------------------------------------------28

1. Zone Definition of Image Sensor Characteristics...................................................................................................... 28

Image Sensor Characteristics Measurement Method (CSI-2 and Sub-LVDS) ---------------------------------------------------------29

1. Measurement Conditions ........................................................................................................................................ 29

2. Color Coding of this Image Sensor and Readout ..................................................................................................... 29

3. Definition of Standard Imaging Conditions ............................................................................................................... 29

Setting Registers Using I

C Communication (When Using CSI-2) -----------------------------------------------------------------------31

Description of Setting Registers When Using I

C Communication ................................................................................ 31

Pin Connection of Serial Communication Operation Specifications When Using I

C Communication ............................. 31

C Communication ................................................................................ 31

C Communication Protocol ....................................................................................................................................... 32

Register Write and Read ............................................................................................................................................ 33

Single Read from Random Location ........................................................................................................................ 33

Single Read from Current Location .......................................................................................................................... 33

Sequential Read Starting from Random Location ..................................................................................................... 34

Sequential Read Starting from Current Location ....................................................................................................... 34

Single Write to Random Location ............................................................................................................................. 35

Sequential Write Starting from Random Location ..................................................................................................... 35

Register Value Reflection Timing to Output Data (CSI-2) ............................................................................................. 36