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PCI Express
SFF-8639 Module
Specification
Revision 3.0, Version 0.9
February 22, 2018
PCI-SIG
®
disclaims all warranties and liability for the use of this document and the information contained herein and assumes no
responsibility for any errors that may appear in this document, nor does PCI-SIG make a commitment to update the information
contained herein.
Contact the PCI-SIG office to obtain the latest revision of this specification.
Questions regarding the PCI Express SFF-8639 Module Specification or membership in PCI-SIG may be forwarded to:
Membership Services
www.pcisig.com
E-mail: administration@pcisig.com
Phone: 503-619-0569
Fax: 503-644-6708
Technical Support
techsupp@pcisig.com
DISCLAIMER
This PCI Express SFF-8639 Module Specification is provided as is with no warranties whatsoever, including any warranty of
merchantability, non-infringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal,
specification, or sample. PCI-SIG disclaims all liability for infringement of proprietary rights, relating to use of information in this
specification. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein.
Trademarks
PCI, PCI Express, PCIe, ExpressModule, and PCI-SIG are trademarks or registered trademarks of PCI SIG. Other company and
product names may be trademarks of the respective companies with which they are associated.
Copyright
© 2014 – 2017 PCI SIG. All rights reserved.
1
PCI Express SFF-8639 Module
PCI Express SFF-8639 Module | 3
Revision History
2
Revision
Version
History
Date
3.0
Initial draft 0.3
June 26, 2013
3.0
Initial draft 0.5
September 10, 2013
3.0
0.3
Updated the following Figures:
• Figure 1-1. Vertical SFF-8639 Receptacle
• Figure 1-2
• Figure 2-3 through Figure 2-9
• Figure 4-1 through Figure 4-5. Jitter Budget
• Figure 5-1. Illustration of Adjacent Pairs
• Added Table 2-3
• Global changes:
- Replaced REFCLK with REFCLK(B)
- Replaced PERST# with PERST(B)#.
August 6, 2014
3.0
0.4
Due to the very large number of changes to the revision 0.9
specification the revision level was reverted to 0.7.
• Global changes:
- Replaced REFCLK(B) with REFCLK
- Replaced PERST# with PERST#.
• Updated Figure 2-1, Figure 2-10, Figure 2-11, and
Figure 2-13
• Replaced REFCLK(B)- to REFCLK-
• Replaced PERSTB(B)# with PERSTB#
• Replaced IFDET with IfDet
• Replaced +3.3 Vaux with +3.3 Vaux
• General clean-up
September 6, 2016
3.0
0.5
• Added PWRDIS (Optional) to Auxiliary Signals
• Added PWRDIS Electrical Characteristics
• Added Table 2-6, PWRDIS DC and AC Electrical Characteristics
Applied to the SFF-8639 Module
• Miscellaneous fixes
• Incorporated the MAY Integrated 0p705 Draft SFF Connector
Comment List Round 11
• Incorporated the Integrated0p706 Draft SFF Connector
Comment List Round12
• Incorporated the Integrated0p706 June30 DraftSFF Connector
Comment List Round14
July 20, 2017
3.0
0.6
• Added reference to +12 V power to section 2.8, PWRDIS
(Optional)
• Updated Table 2 4 and Table 2 6.
• Incorporated Oct 04 Comments, Round 16
• Incorporated Oct 04 Comments, Round 17
• Incorporated Nov 07 Comments, Round 18
December 19, 2017
3.0
0.9
• Fixed typo in Table A-1.
• Rolled Revision to .09
February 27, 2018
3
PCI Express SFF-8639 Module
PCI Express SFF-8639 Module | 4
Table of Contents
4
1. SFF-8639 Connector Interface ................................................................................ 9
5
1.1. Document Organization .................................................................................................. 9
6
1.2. Capitalizations ................................................................................................................ 9
7
1.3. Terms and Definitions ..................................................................................................... 9
8
1.4. Reference Documents ...................................................................................................10
9
1.5. Specification Contents ...................................................................................................11
10
1.6. Objectives .....................................................................................................................11
11
1.7. Electrical Overview ........................................................................................................12
12
1.8. Mechanical Overview ....................................................................................................13
13
2. Auxiliary Signals .................................................................................................... 14
14
2.1. Reference Clock ............................................................................................................16
15
2.1.1. Low Voltage Swing, Differential Clocks ................................................................................... 16
16
2.1.2. Spread Spectrum Clocking (SSC) ........................................................................................... 17
17
2.1.3. REFCLK AC Specifications ..................................................................................................... 17
18
2.1.4. REFCLK Phase Jitter Specification for 2.5 GT/s Signaling Support ....................................... 21
19
2.1.5. REFCLK Phase Jitter Specification for 5.0 GT/s Signaling Support ....................................... 22
20
2.1.6. REFCLK Phase Jitter Specification for 8.0 GT/s Signaling Support ....................................... 22
21
2.2. PERST# Signal .............................................................................................................23
22
2.2.1. Initial Power-Up (G3 to S0) ...................................................................................................... 23
23
2.2.2. Power Management States (S0 to S3/S4 to S0) ..................................................................... 24
24
2.2.3. Power Down ............................................................................................................................ 25
25
2.3. WAKE# Signal ...............................................................................................................27
26
2.4. ACTIVITY# (Required) ..................................................................................................30
27
2.5. DualPortEn# (Optional) .................................................................................................30
28
2.6. SMBus (Optional) ..........................................................................................................30
29
2.6.1. Capacitive Load of High-power SMBus Lines ......................................................................... 31
30
2.6.2. Minimum Current Sinking Requirements for SMBus Devices ................................................. 31
31
2.6.3. SMBus Back Powering Considerations ................................................................................... 31
32
2.6.4. Power-on Reset ....................................................................................................................... 31
33
2.7. CLKREQ# (Optional) .....................................................................................................32
34
2.8. PWRDIS (Optional) .......................................................................................................32
35
2.9. Auxiliary Signal Parametric Specifications .....................................................................33
36
2.9.1. DC Specifications .................................................................................................................... 33
37
2.9.2. AC Specifications .................................................................................................................... 34
38
2.9.3. PWRDIS Electrical Characteristics .......................................................................................... 35
39
PCI Express SFF-8639 Module
PCI Express SFF-8639 Module | 5
3. Hot Insertion and Removal ................................................................................... 36
40
3.1. Scope 36
41
3.2. Hot Removal Detection ..................................................................................................36
42
3.2.1. Hot Insertion Detection ............................................................................................................ 37
43
4. Electrical Requirements ........................................................................................ 38
44
4.1. Power Supply Requirements .........................................................................................38
45
4.2. Power Supply Sequencing .............................................................................................39
46
4.3. Power Supply Decoupling..............................................................................................40
47
4.4. Electrical Topologies and Link Definitions ......................................................................40
48
4.4.1. Topologies ............................................................................................................................... 40
49
4.4.2. Link Definition .......................................................................................................................... 42
50
4.5. Electrical Budgets ..........................................................................................................43
51
4.5.1. AC-Coupling Capacitors .......................................................................................................... 43
52
4.5.2. Insertion Loss Values (Voltage Transfer Function) ................................................................. 43
53
4.5.3. Jitter Values ............................................................................................................................. 44
54
4.5.4. Crosstalk .................................................................................................................................. 46
55
4.5.5. Lane-to-Lane Skew ................................................................................................................. 47
56
4.5.6. Transmitter Equalization .......................................................................................................... 47
57
4.5.7. Skew within the Differential Pair .............................................................................................. 47
58
4.5.8. Differential Data Trace Impedance .......................................................................................... 48
59
4.5.9. Differential Data Trace Propagation Delay .............................................................................. 48
60
4.6. Eye Diagrams at the SFF-8639 Interface .......................................................................48
61
4.6.1. SFF-8639 Module Transmitter Path Compliance Eye Diagram at 2.5 GT/s ........................... 49
62
4.6.2. SFF-8639 Module Transmitter Path Compliance Eye Diagrams at 5.0 GT/s ......................... 50
63
4.6.3. SFF-8639 Module Transmitter Path Compliance Eye Diagrams at 8.0 GT/s ......................... 52
64
4.6.4. SFF-8639 Module Minimum Receiver Path Sensitivity Requirements at 2.5 GT/s ................. 53
65
4.6.5. SFF-8639 Module Minimum Receiver Path Sensitivity Requirements at 5.0 GT/s ................. 54
66
4.6.6. SFF-8639 Module Minimum Receiver Path Sensitivity Requirements at 8.0 GT/s ................. 55
67
4.6.7. SFF-8639 System Transmitter Path Compliance Eye Diagram at 2.5 GT/s ........................... 58
68
4.6.8. SFF-8639 System Transmitter Path Compliance Eye Diagram at 5.0 GT/s ........................... 59
69
4.6.9. SFF-8639 System Transmitter Path Compliance Eye Diagram at 8.0 GT/s ........................... 62
70
4.6.10. SFF-8639 System Minimum Receiver Path Sensitivity Requirements at 2.5 GT/s ................ 65
71
4.6.11. SFF-8639 System Minimum Receiver Path Sensitivity Requirements at 5.0 GT/s ................ 66
72
4.6.12. SFF-8639 System Minimum Receiver Path Sensitivity Requirements at 8.0 GT/s ................ 68
73
5. SFF-8639 Connector Specification ....................................................................... 70
74
5.1. Connector Pinout ...........................................................................................................70
75
5.2. Signal Integrity Requirements and Test Procedures ......................................................74
76
5.2.1. Signal Integrity Requirements ................................................................................................. 74
77
5.2.2. Signal Integrity Requirements and Test Procedures for 8.0 GT/s Support ............................. 74
78
5.2.2.1. Test Fixture Requirements ................................................................................................ 76
79
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