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DDR2 SDRAM
MT47H128M4 – 32 Meg x 4 x 4 banks
MT47H64M8 – 16 Meg x 8 x 4 banks
MT47H32M16 – 8 Meg x 16 x 4 banks
Features
•
V
DD
= +1.8V ±0.1V, V
DDQ
= +1.8V ±0.1V
•
JEDEC-standard 1.8V I/O (SSTL_18-compatible)
•
Differential data strobe (DQS, DQS#) option
•
4n-bit prefetch architecture
•
Duplicate output strobe (RDQS) option for x8
•
DLL to align DQ and DQS transitions with CK
•
4 internal banks for concurrent operation
•
Programmable CAS latency (CL)
•
Posted CAS additive latency (AL)
•
WRITE latency = READ latency - 1
t
CK
•
Selectable burst lengths: 4 or 8
•
Adjustable data-output drive strength
•
64ms, 8192-cycle refresh
•
On-die termination (ODT)
•
Industrial temperature (IT) option
•
Automotive temperature (AT) option
•
RoHS-compliant
•
Supports JEDEC clock jitter specification
Options
1
Marking
•
Configuration
–
128 Meg x 4 (32 Meg x 4 x 4 banks) 128M4
–
64 Meg x 8 (16 Meg x 8 x 4 banks) 64M8
–
32 Meg x 16 (8 Meg x 16 x 4 banks) 32M16
•
FBGA package (Pb-free) – x16
–
84-ball FBGA (8mm x 12.5mm) Rev. F, G HR
•
FBGA package (Pb-free) – x4, x8
–
60-ball FBGA (8mm x 10mm) Rev. F, G CF
•
FBGA package (lead solder) – x16
–
84-ball FBGA (8mm x 12.5mm) Rev. F, G HW
•
FBGA package (lead solder) – x4, x8
–
60-ball FBGA (8mm x 10mm) Rev. F, G JN
•
Timing – cycle time
–
1.875ns @ CL = 7 (DDR2-1066) -187E
–
2.5ns @ CL = 5 (DDR2-800) -25E
–
2.5ns @ CL = 6 (DDR2-800) -25
–
3.0ns @ CL = 4 (DDR2-667) -3E
–
3.0ns @ CL = 5 (DDR2-667) -3
–
3.75ns @ CL = 4 (DDR2-533) -37E
•
Self refresh
–
Standard None
–
Low-power L
•
Operating temperature
– Commercial (0°C ≤ T
C
≤ 85°C)
None
– Industrial (–40°C ≤ T
C
≤ 95°C;
–40°C ≤ T
A
≤ 85°C)
IT
– Automotive (–40°C ≤ T
C
, T
A
≤ 105°C)
AT
•
Revision :F/:G
Note:
1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on www.micron.com for
product offerings and availability.
512Mb: x4, x8, x16 DDR2 SDRAM
Features
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. R 12/10 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2004 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
Table 1: Key Timing Parameters
Speed Grade
Data Rate (MT/s)
t
RC (ns)CL = 3 CL = 4 CL = 5 CL = 6
-187E 400 533 800 1066 54
-25E 400 533 800 800 55
-25 400 533 667 800 55
-3E 400 667 667 n/a 54
-3 400 533 667 n/a 55
-37E 400 533 n/a n/a 55
Table 2: Addressing
Parameter 128 Meg x 4 64 Meg x 8 32 Meg x 16
Configuration 32 Meg x 4 x 4 banks 16 Meg x 8 x 4 banks 8 Meg x 16 x 4 banks
Refresh count 8K 8K 8K
Row address A[13:0] (16K) A[13:0] (16K) A[12:0] (8K)
Bank address BA[1:0] (4) BA[1:0] (4) BA[1:0] (4)
Column address A[11, 9:0] (2K) A[9:0] (1K) A[9:0] (1K)
Figure 1: 512Mb DDR2 Part Numbers
Example Part Number: MT47H128M4HR-25E :G
Configuration
128 Meg x 4
64 Meg x 8
32 Meg x 16
128M4
64M8
32M16
Speed Grade
t
CK = 3.75ns, CL = 4
t
CK = 3ns, CL = 5
t
CK = 3ns, CL = 4
t
CK = 2.5ns, CL = 6
t
CK = 2.5ns, CL = 5
-37E
-3
-3E
-25
-25E
-
ConfigurationMT47H Package Speed
Revision
:
{
Package
Pb-free
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 10mm FBGA
Lead Solder
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 10mm FBGA
HR
CF
HW
JN
Low power
Industrial temperature
Automotive temperature
L
IT
AT
Revision
:F/:G
t
CK = 1.875ns, CL = 7
-187E
Note:
1. Not all speeds and configurations are available in all packages.
512Mb: x4, x8, x16 DDR2 SDRAM
Features
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. R 12/10 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2004 Micron Technology, Inc. All rights reserved.
FBGA Part Number System
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:
http://www.micron.com.
512Mb: x4, x8, x16 DDR2 SDRAM
Features
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. R 12/10 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2004 Micron Technology, Inc. All rights reserved.
Contents
State Diagram .................................................................................................................................................. 9
Functional Description ................................................................................................................................... 10
Industrial Temperature .............................................................................................................................. 10
Automotive Temperature ........................................................................................................................... 11
General Notes ............................................................................................................................................ 11
Functional Block Diagrams ............................................................................................................................. 12
Ball Assignments and Descriptions ................................................................................................................. 14
Packaging ...................................................................................................................................................... 18
Package Dimensions .................................................................................................................................. 18
FBGA Package Capacitance ......................................................................................................................... 20
Electrical Specifications – Absolute Ratings ..................................................................................................... 21
Temperature and Thermal Impedance ........................................................................................................ 21
Electrical Specifications – I
DD
Parameters ........................................................................................................ 24
I
DD
Specifications and Conditions ............................................................................................................... 24
I
DD7
Conditions .......................................................................................................................................... 24
AC Timing Operating Specifications ................................................................................................................ 31
AC and DC Operating Conditions .................................................................................................................... 42
ODT DC Electrical Characteristics ................................................................................................................... 43
Input Electrical Characteristics and Operating Conditions ............................................................................... 44
Output Electrical Characteristics and Operating Conditions ............................................................................. 47
Output Driver Characteristics ......................................................................................................................... 49
Power and Ground Clamp Characteristics ....................................................................................................... 53
AC Overshoot/Undershoot Specification ......................................................................................................... 54
Input Slew Rate Derating ................................................................................................................................ 56
Commands .................................................................................................................................................... 69
Truth Tables ............................................................................................................................................... 69
DESELECT ................................................................................................................................................. 73
NO OPERATION (NOP) .............................................................................................................................. 74
LOAD MODE (LM) ..................................................................................................................................... 74
ACTIVATE .................................................................................................................................................. 74
READ ......................................................................................................................................................... 74
WRITE ....................................................................................................................................................... 74
PRECHARGE .............................................................................................................................................. 75
REFRESH ................................................................................................................................................... 75
SELF REFRESH ........................................................................................................................................... 75
Mode Register (MR) ........................................................................................................................................ 75
Burst Length .............................................................................................................................................. 76
Burst Type ................................................................................................................................................. 77
Operating Mode ......................................................................................................................................... 77
DLL RESET ................................................................................................................................................. 77
Write Recovery ........................................................................................................................................... 78
Power-Down Mode .................................................................................................................................... 78
CAS Latency (CL) ........................................................................................................................................ 79
Extended Mode Register (EMR) ....................................................................................................................... 80
DLL Enable/Disable ................................................................................................................................... 81
Output Drive Strength ................................................................................................................................ 81
DQS# Enable/Disable ................................................................................................................................. 81
RDQS Enable/Disable ................................................................................................................................. 81
Output Enable/Disable ............................................................................................................................... 81
On-Die Termination (ODT) ........................................................................................................................ 82
512Mb: x4, x8, x16 DDR2 SDRAM
Features
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. R 12/10 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2004 Micron Technology, Inc. All rights reserved.
Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 82
Posted CAS Additive Latency (AL) ............................................................................................................... 82
Extended Mode Register 2 (EMR2) .................................................................................................................. 84
Extended Mode Register 3 (EMR3) .................................................................................................................. 85
Initialization .................................................................................................................................................. 86
ACTIVATE ...................................................................................................................................................... 89
READ ............................................................................................................................................................. 91
READ with Precharge ................................................................................................................................. 95
READ with Auto Precharge .......................................................................................................................... 97
WRITE .......................................................................................................................................................... 102
PRECHARGE ................................................................................................................................................. 112
REFRESH ...................................................................................................................................................... 113
SELF REFRESH .............................................................................................................................................. 114
Power-Down Mode ....................................................................................................................................... 116
Precharge Power-Down Clock Frequency Change .......................................................................................... 123
Reset ............................................................................................................................................................. 124
CKE Low Anytime ...................................................................................................................................... 124
ODT Timing .................................................................................................................................................. 126
MRS Command to ODT Update Delay ........................................................................................................ 128
512Mb: x4, x8, x16 DDR2 SDRAM
Features
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. R 12/10 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2004 Micron Technology, Inc. All rights reserved.
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