E-Sim卡ETSI_TS_102671V12.0.1使用手册

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ETSI TS 102 671

V12.0.1 (2018-07)

Smart Cards;

Machine to Machine UICC;

Physical and logical characteristics

(Release 12)

TECHNICAL SPECIFICATION

ETSI

ETSI TS 102 671 V12.0.1 (2018

07)

Release 12

Reference

RTS/SCP-T090071vc01

Keywords

M2M, MFF

ETSI

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Important notice

The present document can be downloaded from:

http://www.etsi.org/standards-search

The present document may be made available in electronic versions and/or in print. The content of any

electronic and/or

print versions of the present document shall not be modified without the prior written authorization of ETSI. In case of any

existing or perceived difference in contents between such versions and/or in print, the only prevailing document is the

print of the Portable Document Format (PDF) version kept on a specific network drive within ETSI Secretariat.

Users of the present document should be aware that the document may be subject to revision or change of status.

Information on the current status of this and other ETSI documents is available at

https://portal.etsi.org/TB/ETSIDeliverableStatus.aspx

If you find errors in the present document, please send your comment to one of the following services:

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No part may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying

and microfilm except as authorized by written permission of ETSI.

The content of the PDF version shall not be modified without the written authorization of ETSI.

The copyright and the foregoing restriction extend to reproduction in all media.

DECT

, PLUGTESTS

, UMTS

and the ETSI logo are trademarks of ETSI registered for the benefit of its Members.

3GPP

and LTE

are trademarks of ETSI registered for the benefit of its Members and

of the 3GPP Organizational Partners.

oneM2M logo is protected for the benefit of its Members.

GSM

and the GSM logo are trademarks registered and owned by the GSM Association.

ETSI

ETSI TS 102 671 V12.0.1 (2

018

07)

Release 12

Contents

Intellectual Property Rights ................................................................................................................................ 5

Foreword ............................................................................................................................................................. 5

Modal verbs terminology .................................................................................................................................... 5

1 Scope ........................................................................................................................................................ 6

2 References ................................................................................................................................................ 6

2.1 Normative references ......................................................................................................................................... 6

2.2 Informative references ........................................................................................................................................ 7

3 Definitions and abbreviations ................................................................................................................... 7

3.1 Definitions .......................................................................................................................................................... 7

3.2 Abbreviations ..................................................................................................................................................... 7

4 Overview .................................................................................................................................................. 8

5 Definition of Environmental Classes........................................................................................................ 8

5.1 Environmental condition classification system .................................................................................................. 8

5.1.0 Environmental property indicators ............................................................................................................... 8

5.1.1 Storage of environmental properties ............................................................................................................. 8

5.1.2 EF

ENV-CLASSES

................................................................................................................................................ 9

5.2 Operational and Storage Temperature (TX) ....................................................................................................... 9

5.2.0 Overview ...................................................................................................................................................... 9

5.2.1 Temperature (TS) -25 °C to +85 °C .............................................................................................................. 9

5.2.2 Temperature (TA) -40 °C to +85 °C ............................................................................................................. 9

5.2.3 Temperature (TB) -40 °C to +105 °C ........................................................................................................... 9

5.2.4 Temperature (TC) -40 °C to +125 °C ........................................................................................................... 9

5.3 Moisture/Reflow conditions (MX) ................................................................................................................... 10

5.3.0 Overview .................................................................................................................................................... 10

5.3.1 Moisture/Reflow conditions (MA) ............................................................................................................. 10

5.4 Humidity (HX) ................................................................................................................................................. 10

5.4.0 Overview .................................................................................................................................................... 10

5.4.1 Humidity (class HA) - High humidity ........................................................................................................ 10

5.5 Corrosion (CX) ................................................................................................................................................. 10

5.5.0 Overview .................................................................................................................................................... 10

5.5.1 Corrosion (CA to CD) - Salt atmosphere .................................................................................................... 10

5.6 Vibration (VX) ................................................................................................................................................. 11

5.6.0 Overview .................................................................................................................................................... 11

5.6.1 Vibration (VA) - Automotive vibration ...................................................................................................... 11

5.7 Void .................................................................................................................................................................. 11

5.8 Shock (SX) ....................................................................................................................................................... 11

5.8.0 Overview .................................................................................................................................................... 11

5.8.1 Shock (SA) - Automotive shock ................................................................................................................. 11

5.9 Data Retention Time (RX) ............................................................................................................................... 11

5.9.0 Overview .................................................................................................................................................... 11

5.9.1 Data Retention Time (RA) - 10 years ......................................................................................................... 11

5.9.2 Data Retention Time (RB) - 12 years ......................................................................................................... 11

5.9.3 Data Retention Time (RC) - 15 years ......................................................................................................... 11

5.10 Minimum Updates (UX) .................................................................................................................................. 12

5.10.0 Overview .................................................................................................................................................... 12

5.10.1 Minimum Updates (UA) - 100 000 ............................................................................................................. 12

5.10.2 Minimum Updates (UB) - 500 000 ............................................................................................................. 12

5.10.3 Minimum Updates (UC) - 1 000 000 .......................................................................................................... 12

6 M2M UICC - Physical Characteristics ................................................................................................... 12

6.0 Basic requirements ........................................................................................................................................... 12

6.1 General M2M UICC physical characteristics ................................................................................................... 12

6.1.0 Introduction................................................................................................................................................. 12

6.1.1 Contacts ...................................................................................................................................................... 12

ETSI

ETSI TS 102 671 V12.0.1 (2018

07)

Release 12

6.2 Specific MFF physical characteristics .............................................................................................................. 12

6.2.0 Introduction................................................................................................................................................. 12

6.2.1 MFF1 .......................................................................................................................................................... 13

6.2.1.0 Dimensions............................................................................................................................................ 13

6.2.1.1 Orientation mark for the bottom of the package ................................................................................... 14

6.2.1.2 Orientation mark for top of package ..................................................................................................... 14

6.2.2 MFF2 .......................................................................................................................................................... 15

6.2.2.1 Dimensions............................................................................................................................................ 15

6.2.2.2 Orientation mark for the bottom of the package ................................................................................... 16

6.2.2.3 Orientation mark for top of package ..................................................................................................... 16

7 Electrical and Logical specifications of the MFF UICC - Terminal interface ....................................... 16

7.0 Requirements .................................................................................................................................................... 16

7.1 Voltage Class support ....................................................................................................................................... 16

8 Device Pairing Mechanism .................................................................................................................... 16

8.0 Introduction ...................................................................................................................................................... 16

8.1 Secure Channel Pairing .................................................................................................................................... 16

8.2 CAT application pairing ................................................................................................................................... 17

Annex A (informative): PCB layout for the MFF ................................................................................ 18

Annex B (informative): Change history ............................................................................................... 20

History .............................................................................................................................................................. 21

ETSI

ETSI TS 102 671 V12.0.1 (2018

07)

Release 12

Intellectual Property Rights

Essential patents

IPRs essential or potentially essential to normative deliverables may have been declared to ETSI. The information

pertaining to these essential IPRs, if any, is publicly available for ETSI members and non-members, and can be found

in ETSI SR 000 314: "Intellectual Property Rights (IPRs); Essential, or potentially Essential, IPRs notified to ETSI in

respect of ETSI standards", which is available from the ETSI Secretariat. Latest updates are available on the ETSI Web

server (https://ipr.etsi.org/).

Pursuant to the ETSI IPR Policy, no investigation, including IPR searches, has been carried out by ETSI. No guarantee

can be given as to the existence of other IPRs not referenced in ETSI SR 000 314 (or the updates on the ETSI Web

server) which are, or may be, or may become, essential to the present document.

Trademarks

The present document may include trademarks and/or tradenames which are asserted and/or registered by their owners.

ETSI claims no ownership of these except for any which are indicated as being the property of ETSI, and conveys no

right to use or reproduce any trademark and/or tradename. Mention of those trademarks in the present document does

not constitute an endorsement by ETSI of products, services or organizations associated with those trademarks.

Foreword

This Technical Specification (TS) has been produced by ETSI Technical Committee Smart Card Platform (SCP).

The contents of the present document are subject to continuing work within TC SCP and may change following formal

TC SCP approval. If TC SCP modifies the contents of the present document, it will then be republished by ETSI with

an identifying change of release date and an increase in version number as follows:

Version x.y.z

where:

x the first digit:

0 early working draft;

1 presented to TC SCP for information;

2 presented to TC SCP for approval;

3 or greater indicates TC SCP approved document under change control.

y the second digit is incremented for all changes of substance, i.e. technical enhancements, corrections,

updates, etc.

z the third digit is incremented when editorial only changes have been incorporated in the document.

Modal verbs terminology

In the present document "shall", "shall not", "should", "should not", "may", "need not", "will", "will not", "can" and

"cannot" are to be interpreted as described in clause 3.2 of the ETSI Drafting Rules (Verbal forms for the expression of

provisions).

"must" and "must not" are NOT allowed in ETSI deliverables except when used in direct citation.

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