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MPC5744P.pdf
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This document provides electrical specifications, pin assignments, and package diagram information for the MPC5744P series of microcontroller units (MCUs). For functional characteristics and the programming model, see the MPC5744P Reference Manual.
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MPC5744P
MPC5744P Data Sheet
32-bit MCU suitable for ISO26262 ASIL-
D chassis and safety applications
Features
• The MPC5744P microcontroller is based on the Power
Architecture® developed by NXP. It targets chassis
and safety applications and other applications requiring
a high Automotive Safety Integrity Level (ASIL). The
MPC5744P is a SafeAssure solution.
• This document provides electrical specifications, pin
assignments, and package diagram information for the
MPC5744P series of microcontroller units (MCUs).
For functional characteristics and the programming
model, see the MPC5744P Reference Manual.
• Junction temperature: The upper limit is 150°C or
165°C depending on the device marking.
NXP Semiconductors
Document Number MPC5744P
Data Sheet: Technical Data
Rev. 6.1, 11/2017
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
Table of Contents
1 Introduction.......................................................................................... 3
1.1 Features......................................................................................3
1.2 Block Diagram...........................................................................5
2 Pinouts..................................................................................................6
2.1 Package pinouts and ballmap.................................................... 6
2.2 Pin/ball descriptions ................................................................. 8
2.2.1 Pin/ball startup and reset states................................. 8
2.2.2 Power supply and reference voltage pins/balls.........9
2.2.3 System pins/balls.......................................................12
2.2.4 LVDS pins/balls........................................................13
2.2.5 Generic pins/balls......................................................14
2.2.6 Peripheral input muxing............................................43
3 Electrical characteristics.......................................................................55
3.1 Introduction............................................................................... 55
3.2 165°C junction temperature option........................................... 55
3.3 Absolute maximum ratings....................................................... 55
3.4 Recommended operating conditions......................................... 57
3.5 Thermal characteristics..............................................................58
3.5.1 General notes for specifications at maximum
junction temperature................................................. 59
3.6 Electromagnetic compatibility (EMC)...................................... 60
3.7 Electrostatic discharge (ESD) characteristics............................62
3.8 Voltage regulator electrical characteristics............................... 62
3.9 DC electrical characteristics......................................................65
3.10 Supply current characteristics....................................................67
3.11 Temperature sensor................................................................... 69
3.12 Main oscillator electrical characteristics................................... 69
3.13 PLLDIG electrical characteristics............................................. 72
3.14 16 MHz Internal RC Oscillator (IRCOSC) electrical
specifications.............................................................................73
3.15 ADC electrical characteristics................................................... 74
3.16 Flash memory specifications.....................................................77
3.16.1 Maximum junction temperature 150°C.....................77
3.16.2 Maximum junction temperature 165°C.....................80
3.16.3 Flash memory read wait-state and address-pipeline
control settings.......................................................... 84
3.17 SGEN electrical characteristics................................................. 85
3.18 RESET sequence duration.........................................................86
3.19 AC specifications.......................................................................86
3.19.1 Reset pad (EXT_POR, RESET) electrical
characteristics............................................................87
3.19.2 WKUP/NMI timing...................................................89
3.19.3 Debug/JTAG/Nexus/Aurora timing..........................89
3.19.4 External interrupt timing (IRQ pin).......................... 96
3.19.5 SPI timing................................................................. 97
3.19.6 LFAST...................................................................... 102
3.19.7 FlexRay..................................................................... 106
3.19.8 Ethernet switching specifications..............................109
4 Obtaining package dimensions.............................................................111
5 Ordering information............................................................................112
6 Document revision history................................................................... 113
MPC5744P Data Sheet, Rev. 6.1, 11/2017
2 NXP Semiconductors
Introduction
1.1 Features
The following table summarizes the features of the MPC5744P.
Table 1. MPC5744P feature summary
Feature Details
CPU
Power Architecture 2 x e200z4 in delayed lock step
Architecture Harvard
Execution speed 0 MHz to 200 MHz (+2% FM)
Embedded FPU Yes
Core MPU 24 regions
Instruction Set PPC No
Instruction Set VLE Yes
Instruction cache 8 KB, EDC
Data cache 4 KB, EDC
Data local memory 64 KB, ECC
System MPU Yes (16 regions)
Buses
Core bus AHB, 32-bit address, 64-bit data, e2e ECC
Internal periphery bus 32-bit address, 32-bit data
Crossbar
Master x slave ports 4 x 5
Memory—see Table 2 for additional details
Code/data flash memory 2.5 MB, ECC, RWW
Data flash memory Supported with RWW
SRAM 384 KB, ECC
Overlay access to SRAM from Flash Memory Controller Yes
Modules
Interrupt controller 32 interrupt priority levels, 16 SW programmable interrupts
PIT 1 module with 4 channels
System Timer Module (STM) 1 module with 4 channels
Software Watchdog Timer (SWT) Yes
eDMA 32 channels, in delayed lock step
FlexRay 1 module with 64 message buffer, dual channel
FlexCAN 3 modules with 64 message buffer
LINFlexD (UART and LIN with DMA support) 2 modules
Table continues on the next page...
1
Introduction
MPC5744P Data Sheet, Rev. 6.1, 11/2017
NXP Semiconductors 3
Table 1. MPC5744P feature summary (continued)
Feature Details
Clockout Yes
Fault Control and Collection Unit (FCCU) Yes
Cross Triggering Unit (CTU) 2 modules
eTimer 3 modules with 6 channels
FlexPWM 2 modules with 4 x (2+1) channels
Analog-to-digital converter (ADC) 4 modules with 12-bit ADC, each with 16 channels (25
external channels including shared channels plus internal
channels)
Sine-wave generator (SGEN) 32 point
SPI 4 modules
As many as 8 chip selects
CRC Unit Yes
SENT 2 modules with 2 channels
Interprocessor serial link interface (SIPI) Yes
Junction temperature sensor Yes (replicated module)
Digital I/Os ≥ 16
Peripheral register protection Yes
Ethernet Yes
Error Injection Module (EIM) Yes
Supply
Device Power Supply 3.3 V with external ballast transistor
3.3 V with external 1.25 V low drop-out (LDO) regulator
ADC Analog Reference voltage 3.15 V to 5.5 V
Clocking
Phase Lock Loop (PLL) 1 x PLL and 1 coupled FMPLL
Internal RC Oscillator 16 MHz
External Crystal Oscillator 8 MHz to 40 MHz
Low power modes
HALT and STOP Yes
Debug
Nexus Level 3+, MDO and Aurora interface
Package
LQFP 144 pins, 0.5 mm pitch, 20 mm x 20 mm outline
MAPBGA 257 MAPBGA, 0.8 mm pitch, 14 mm x 14 mm outline
Temperature
Temperature range (junction) -40°C to +150°C, option for 165°C
Ambient temperature range (LQFP) -40°C to +125°C, 135°C option (with 165°C junction option)
Ambient temperature range (BGA) -40°C to +125°C, 135°C option (with 165°C junction option)
Introduction
MPC5744P Data Sheet, Rev. 6.1, 11/2017
4 NXP Semiconductors
Table 2. Flash memory and SRAM sizes of MPC5744P, MPC5743P, MPC5742P, and
MPC5741P
Part number Flash memory SRAM
MPC5744P 2.5 MB 384 KB
MPC5743P 2.0 MB 256 KB
MPC5742P 1.5 MB 192 KB
MPC5741P 1.0 MB 128 KB
1.2 Block Diagram
The following figure is a top-level diagram that shows the functional organization of the
system.
Figure 1. System Block Diagram
Introduction
MPC5744P Data Sheet, Rev. 6.1, 11/2017
NXP Semiconductors 5
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