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MT2625

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loginid=harryxu@southbase.cn,time=2018-02-01 10:01:58,ip=183.14.133.140,doctitle=MT2625_Datasheet.pdf,company=

MT2625 Datasheet

Version: 1.2

Release date: 31 January 2018

This document contains information that is proprietary to MediaTek Inc. (“MediaTek”) and/or its licensor(s). MediaTek cannot grant you

permission for any material that is owned by third parties. You may only use or reproduce this document if you have agreed to and been

bound by the applicable license agreement with MediaTek (“License Agreement”) and been granted explicit permission within the License

Agreement (“Permitted User”). If you are not a Permitted User, please cease any access or use of this document immediately. Any

unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited. THIS DOCUMENT IS PROVIDED ON AN

“AS-IS” BASIS ONLY. MEDIATEK EXPRESSLY DISCLAIMS ANY AND ALL WARRANTIES OF ANY KIND AND SHALL IN NO EVENT BE LIABLE FOR ANY

CLAIMS RELATING TO OR ARISING OUT OF THIS DOCUMENT OR ANY USE OR INABILITY TO USE THEREOF. Specifications contained herein are

subject to change without notice.

loginid=harryxu@southbase.cn,time=2018-02-01 10:01:58,ip=183.14.133.140,doctitle=MT2625_Datasheet.pdf,company=

MediaTek MT2625 Datasheet

Page 2 of 85

This document contains information that is proprietary to MediaTek Inc. (“MediaTek”) and/or its licensor(s).

Any unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited.

Features

NB-IoT transceiver

• Compliant with 3GPP R13/R14 NB-IoT standard

• Supports DL 200kHz bandwidth/UL single tone

and multi-tone

• Supported RF bands:

B1/B2/B3/B5/B8/B11/B12/B13/B17/B18/B19/B20

/B21/B25/B26/B28/B31/B66/B70/B71

•

Supports PSM and eDRX mode

Microcontroller subsystem

• ARM® Cortex®-M4 with FPU and MPU

• 14 DMA channels

• One RTC timer, one 64-bit and five 32-bit general

purpose timers

• Development support: SWD, JTAG

• Crypto engine

o AES 128, 192, 256 bits

o DES, 3DES

o MD5, SHA-1, 224, 256, 384, 512

• True random number generator

• JTAG password protection

Memory

• Up to 32KB SYSRAM, with zero-wait state

• Up to 32KB L1 cache, with high hit rate and zero-

wait state

• Embedded 32Mbits flash

o Sleep current 200nA

• Embedded 32Mbits pseudo SRAM

o Sleep current 10µA

Communication interfaces

• Two SDIO 2.0 masters and one SDIO 2.0 slave

• Three I2C (3.4Mbps) interfaces

• Four UART interfaces (3Mbps, UART1/2 with

hardware flow control)

• Two SPI masters and one SPI slave

• Two I2S interfaces

o One 16/24-bit, master/slave mode;

One 16-bit, master/slave mode with TDM

o Both support 16, 24, 48, 96, 192kHz and

11.025kHz, 22.05kHz, 44.1kHz, TX/RX, 2

channels

• Four PWM channels

• 37 GPIOs (5V-tolerant)

• Seven IOs for BPI and MIPI interfaces

• Three IOs for SIM

• 5 channel 10-bit AUXADC (PinMux with GPIO),

maximum input voltage 1.4V

• Embedded thermal sensor

Power management

• Three integrated high efficiency buck converters

with low quiescent current

• Four integrated LDO regulators for RTC, SIM, RF

frontend and GPIOs

• Operating temperature from -40°C to 85°C

Clock source

• 26MHz crystal oscillator

• 32kHz crystal oscillator or internal 32kHz

oscillator for RTC

Package

• 5.6-mm x 5.6-mm x 1.05-mm TFBGA with 0.5-mm

ball pitch

loginid=harryxu@southbase.cn,time=2018-02-01 10:01:58,ip=183.14.133.140,doctitle=MT2625_Datasheet.pdf,company=

MediaTek MT2625 Datasheet

Page 1 of 85

This document contains information that is proprietary to MediaTek Inc. (“MediaTek”) and/or its licensor(s).

Any unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited.

Table of Contents

Document Revision History .............................................................................................................................. 1

Features ........................................................................................................................................................... 1

Table of Contents ............................................................................................................................................. 1

Lists of Tables and Figures ................................................................................................................................ 2

System Overview ................................................................................................................................... 4

MT2625X product family .................................................................................................................... 4

System architecture ............................................................................................................................ 5

Platform features overview ................................................................................................................ 5

Modem features overview ................................................................................................................. 7

Power management unit (PMU) features overview ........................................................................... 7

Package ............................................................................................................................................... 7

Functional Description ........................................................................................................................... 8

Host processor subsystem .................................................................................................................. 8

Platform description ........................................................................................................................... 9

Peripheral description ...................................................................................................................... 11

Modem system ................................................................................................................................. 14

Analog baseband .............................................................................................................................. 17

RF Subsystem ........................................................................................................................................ 22

Radio characteristics ......................................................................................................................... 22

Power Management Unit and Low Power Control System .................................................................... 23

Overview ........................................................................................................................................... 23

Low-power operating mode ............................................................................................................. 23

Power performance summary .......................................................................................................... 24

PMU architecture for low power system ......................................................................................... 25

PMU functional description .............................................................................................................. 27

Pin Description ..................................................................................................................................... 30

MT2625D series ball diagram ........................................................................................................... 30

MT2625A series ball diagram ........................................................................................................... 32

Pin differences between MT2625D series and MT2625A series ...................................................... 34

MT2625 family pin functions ............................................................................................................ 34

MT2625 family pin multiplexing ....................................................................................................... 41

Electrical Characteristics ....................................................................................................................... 45

Absolute maximum ratings ............................................................................................................... 45

Operating conditions ........................................................................................................................ 46

Peripheral interfaces ........................................................................................................................ 64

Package Information ............................................................................................................................. 81

MT2625 mechanical data of the package ......................................................................................... 81

MT2625 thermal operating specifications ........................................................................................ 83

MT2625 lead-free packaging ............................................................................................................ 83

Ordering Information ............................................................................................................................ 84

MT2625 top marking definition ........................................................................................................ 84

loginid=harryxu@southbase.cn,time=2018-02-01 10:01:58,ip=183.14.133.140,doctitle=MT2625_Datasheet.pdf,company=

MediaTek MT2625 Datasheet

Page 2 of 85

This document contains information that is proprietary to MediaTek Inc. (“MediaTek”) and/or its licensor(s).

Any unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited.

Lists of Tables and Figures

Table 1.1-1. Difference between all product series chipsets .................................................................................. 4

Table 1.3-1. MT2625 series peripherals .................................................................................................................. 6

Table 2.5-1. Auxiliary ADC input channels ............................................................................................................ 17

Table 2.5-2. Auxiliary ADC Specifications .............................................................................................................. 18

Table 2.5-3. MPLL specifications ........................................................................................................................... 20

Table 2.5-4. UPLL specifications ............................................................................................................................ 20

Table 2.5-5. XPLL specifications ............................................................................................................................ 21

Table 4.3-1. Current consumption in different power modes .............................................................................. 24

Table 4.4-1. BUCK / LDO characteristic ................................................................................................................. 26

Table 5.1-1. MT2625D series pin coordinates ...................................................................................................... 30

Table 5.2-1. MT2625A series pin coordinates ....................................................................................................... 32

Table 5.4-1. Acronym for pin types and I/O structure .......................................................................................... 34

Table 5.4-2. MT2625D series pin function description and power domain (group1) .......................................... 35

Table 5.5-1. Peripheral functions and signals ....................................................................................................... 41

Table 6.1-1. Absolute maximum ratings for power supply ................................................................................... 45

Table 6.1-2. Absolute maximum ratings for I/O power supply ............................................................................. 45

Table 6.1-3. Absolute maximum ratings for voltage input ................................................................................... 45

Table 6.1-4. Absolute maximum ratings for storage temperature ....................................................................... 45

Table 6.2-1. MT2625DA/AA general operating conditions ................................................................................... 46

Table 6.2-2. MT2625DPA/APA general operating conditions ............................................................................... 46

Table 6.2-3. Recommended operating conditions for power supply.................................................................... 46

Table 6.2-4. Recommended operating conditions for voltage input .................................................................... 46

Table 6.2-5. Recommended operating conditions for operating temperature .................................................... 47

Table 6.2-6. Electrical characteristics .................................................................................................................... 47

Table 6.2-7. DCXO Characteristics (TA = 250C, VDD = 1.8V unless otherwise stated)(1) ...................................... 63

Table 6.2-8. Functional specifications of XOSC32 ................................................................................................. 63

Table 6.2-9. Recommended parameters for 32kHz crystal ................................................................................... 63

Table 6.3-1. SPI master interface characteristics .................................................................................................. 65

Table 6.3-2. SPI slave interface characteristics ..................................................................................................... 66

Table 6.3-3. I2S master and I2S slave interface characteristics ............................................................................ 67

Table 6.3-4. Bus Timing – Parameters Values (Default Speed) ............................................................................ 68

Table 6.3-5. Bus Timing – Parameters Values (High Speed) ................................................................................. 70

Table 6.3-6. Bus Timing – Parameters Values (Default Speed) ............................................................................ 72

Table 6.3-7. Bus Timing – Parameters Values (High Speed) ................................................................................. 74

Table 6.3-8. USB11 interface characteristics ........................................................................................................ 77

Table 6.3-9. eMMC interface push-pull signal level----2.7V – 3.6V V

CCQ

range (high voltage eMMC) .................. 78

Table 6.3-10. eMMC interface push-pull signal level----1.70V – 1.95V V

CCQ

voltage range .................................. 78

Table 6.3-11. eMMC interface characteristics (backward-compatible device) .................................................... 79

Table 6.3-12. eMMC interface characteristics (high-speed device) ...................................................................... 80

Table 7.2-1. MT2625 thermal operating specifications ........................................................................................ 83

Table 8.1-1. Ordering information ........................................................................................................................ 85