SSI_EEB_SPEC_ssieeb主板尺寸

需积分: 42 255 浏览量更新于2023-05-26 评论收藏 1.97MB PDF 举报

身份认证购VIP最低享 7 折!

领优惠券(最高得80元）

资源详情

资源评论

资源推荐

SSI

Enterprise Electronics Bay

Specification for 2011 Dual-Socket

Servers and Workstations

Version 1.0.1

SSI

Enterprise Electronics Bay Specification 2011, Version 1.0.1

LEGAL TERMS AND CONDITIONS

Your access and use of this Specification is subject to the following Legal Terms and Conditions. Please read these Legal

Terms and Conditions carefully. By accessing and using this Specification, you agree to comply with and be bound by these

Legal Terms and Conditions. If you do not agree to comply with and be bound by these Legal Terms and Conditions, DO NOT

access or use this Specification. The use of this Specification without agreement to these Legal Terms and Conditions may

constitute copyright infringement in violation of 17 U.S.C. § 101, et. seq., the violation of which may result in civil and criminal

liability.

1. Neither SSI Forum nor any member of SSI Forum makes any warranties or representations with regard to this

Specification, and in particular does not warrant or represent that this Specification or any products made in conformance

with this Specification will work in the intended manner. Neither SSI Forum nor any member of SSI Forum assumes any

responsibility for any errors that this Specification may contain or have any liabilities or obligations for damages, including

but not limited to special, incidental, indirect, punitive, or consequential damages, whether arising from or in connection

with the use of this Specification in any way.

2. No representations or warranties are made that any product based in whole or part on this Specification will be free from

defects or safe for use for its intended purpose. Any person making, using, or selling any such product does so at the

person’s own risk.

3. By accessing and using this Specification, you expressly acknowledge that this Specification is provided “AS IS,” and that

neither SSI Forum nor any member of SSI Forum is making any representations or extending any warranties of any kind,

either express or implied, oral or written, including any warranty of fitness for a particular purpose, or any warranty or

representation that this Specification or any product or technology utilizing this Specification or any subset of this

Specification will be free from any claims of infringement of intellectual property, including patents, copyrights, and trade

secrets, nor is SSI Forum or any member of SSI Forum assuming any other responsibilities whatsoever with respect to this

Specification or such products.

4. Subject to these Legal Terms and Conditions, SSI Forum hereby grants you a non-exclusive, non-transferable, non-

sublicensable copyright license to reproduce, distribute, and display this Specification as reasonably necessary to

implement this Specification. No other license, express or implied, by estoppel or otherwise, to any other intellectual

property right is granted to you by SSI Forum or by any member of SSI Forum under these Legal Terms and Conditions or

by your use of this Specification.

5. You may not revise, alter, modify, make any derivatives of, or otherwise amend this Specification in any way.

6. Your use or implementation of this Specification does not imply in any way that you or any of your products have

participated in any testing or certification programs or are in compliance with this Specification. Further, you acknowledge

that SSI Forum has no obligation to develop any testing or certification programs to demonstrate your compliance with this

Specification.

7. If you make any references or citations to this Specification, you must give SSI Forum full attribution and you must

acknowledge SSI Forum’s copyright in this Specification. You agree to include and retain SSI Forum’s copyright notice (©

8. You agree to include and retain these Legal Terms and Conditions (Paragraphs 1 - 9) on all copies of any part of this

Specification that you create or reproduce.

9. These Legal Terms and Conditions are governed by the laws of the State of Oregon, without giving effect to any conflict-of-

law principle that would result in the laws of any other jurisdiction governing this Agreement. Any action, suit, or

proceeding arising out of the subject matter of this Agreement will be litigated in courts located in Multnomah County,

Oregon. You consent and submit to the jurisdiction of any local, state, or federal court located in Multnomah County,

Oregon.

*Product names are trademarks, registered trademarks, or servicemarks of their respective owners.

SSI

Enterprise Electronics Bay Specification 2011, Version 1.0.1

Contents

1 Introduction ................................................................................................................................................... 6

1.1 Scope .......................................................................................................................................................... 6

1.2 New for 2011 ............................................................................................................................................... 6

1.3 Nomenclature .............................................................................................................................................. 7

1.4 Drawing Note .............................................................................................................................................. 7

1.5 Definitions / Terms / Acronyms ................................................................................................................... 8

1.6 Additional Information ................................................................................................................................. 8

2 Baseboard Requirements ............................................................................................................................ 9

2.1 Layout and Baseboard Mounting Locations ................................................................................................ 9

2.2 Component Height Constraints ................................................................................................................. 11

2.2.1 Rack Height Constraints .................................................................................................................... 13

2.3 Baseboard Connectors ............................................................................................................................. 14

2.3.1 Power Delivery ................................................................................................................................... 14

2.3.2 Rear Panel I/O ................................................................................................................................... 17

2.3.3 Front Panel I/O ................................................................................................................................... 18

2.3.4 Front Panel USB ................................................................................................................................ 19

2.3.5 Cooling Fan Pin-out ........................................................................................................................... 19

2.3.6 Chassis Intrusion Connector .............................................................................................................. 21

2.3.7 Connector Placement ........................................................................................................................ 21

2.4 Riser Card Mechanicals ............................................................................................................................ 22

3 Chassis Requirements ............................................................................................................................... 23

3.1 Baseboard Mounting Locations ................................................................................................................ 23

3.1.1 Riser Mounting Locations .................................................................................................................. 23

3.2 Board Volumetric Keep-Out ...................................................................................................................... 24

3.3 Rear Panel I/O Aperture ............................................................................................................................ 25

3.3.1 1U Rear Panel I/O Aperture ............................................................................................................... 26

3.4 Rear Panel Card Apertures ....................................................................................................................... 27

3.5 Front Panel ................................................................................................................................................ 28

3.6 Electronics Bay Cooling ............................................................................................................................ 29

3.6.1 Thermal Design Philosophy ............................................................................................................... 29

3.6.2 Pedestal Fan Sizing and Placement .................................................................................................. 30

3.6.3 Rack Fan Sizing and Placement ........................................................................................................ 30

3.6.4 Fan Acoustics .................................................................................................................................... 31

3.6.5 Bezel .................................................................................................................................................. 31

3.6.6 Cabling ............................................................................................................................................... 31

3.7 Electromagnetic Interference Considerations, EMI .................................................................................. 31

4 PSU Reference ............................................................................................................................................ 32

5 Reference Configurations .......................................................................................................................... 33

5.1 Reference EEB Configuration for EN Processors ..................................................................................... 33

5.2 Reference EEB Configuration for EP Processors ..................................................................................... 34

5.3 Reference TEB Configuration for EN Processors ..................................................................................... 35

5.4 Reference TEB Configuration for EP Processors ..................................................................................... 36

5.5 Reference CEB Configuration for EN Processors .................................................................................... 37

SSI

Enterprise Electronics Bay Specification 2011, Version 1.0.1

Figures

Figure 1: Board Orientation and Nomenclature .................................................................................................... 7

Figure 2: Available Baseboard Mounting Locations ........................................................................................... 10

Figure 3: Baseboard Maximum Component Height ............................................................................................ 12

Figure 4: Rack Board-Set Component Height .................................................................................................... 13

Figure 5: P1 Baseboard Power Connector ......................................................................................................... 14

Figure 6: Processor Power Connectors .............................................................................................................. 15

Figure 7: Server Signal Connector ...................................................................................................................... 15

Figure 8: +12V Baseboard Power Connector ..................................................................................................... 15

Figure 9: Baseboard I/O Connector Area ........................................................................................................... 17

Figure 10: Standard Front Panel Connector ....................................................................................................... 18

Figure 11: Front Panel USB Connector .............................................................................................................. 19

Figure 12: Cooling Fan Connector ...................................................................................................................... 19

Figure 13: 6-Pin Cooling Fan Connector ............................................................................................................ 20

Figure 14: Chassis Intrusion Connector ............................................................................................................. 21

Figure 15: Riser Card Design (1U and 2U) ......................................................................................................... 22

Figure 16: Board (-set) Keep-Out Volume .......................................................................................................... 24

Figure 17: Rear Panel I/O Aperture .................................................................................................................... 25

Figure 18: 1U Rear Panel I/O Aperture .............................................................................................................. 26

Figure 19: Example 1U I/O Shield ...................................................................................................................... 27

Figure 20: Rear Panel Card Apertures ............................................................................................................... 27

Figure 21: Thermal Zone Definitions................................................................................................................... 29

Figure 22: Reference EN EEB Configuration ..................................................................................................... 33

Figure 23: Reference EP EEB Configuration ...................................................................................................... 34

Figure 24: Reference EN TEB Configuration ...................................................................................................... 35

Figure 25: Reference EP TEB Configuration ...................................................................................................... 36

Figure 26: Reference EN CEB Configuration ..................................................................................................... 37

Tables

Table 1: Definitions, Terms, and Acronyms .......................................................................................................... 8

Table 2: Baseboard Maximum Component Height Restrictions ......................................................................... 12

Table 3: Rack Board-set Maximum Component Height Restrictions ................................................................. 13

Table 4: Connector Locations ............................................................................................................................. 21

Table 5: Chassis Minimum Keep-out Height ...................................................................................................... 24

Table 6: Front Panel Features ............................................................................................................................ 28

Table 7: Pedestal Fan Sizing Summary ............................................................................................................. 30

Table 8: Power Supply Cross-Reference ........................................................................................................... 32

剩余36页未读，继续阅读