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PCI_Express_M.2_Specification_Rev1.1
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PCI_Express_M.2_Specification_Rev1.1 March 7, 2016
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PCI Express M.2
Specification
Revision 1.1
March 7, 2016
PCI-SIG
®
disclaims all warranties and liability for the use of this document and the information contained herein and assumes no
responsibility for any errors that may appear in this document, nor does PCI-SIG make a commitment to update the information
contained herein.
Contact the PCI-SIG office to obtain the latest revision of this specification.
Questions regarding this specification or membership in PCI-SIG may be forwarded to:
Membership Services
www.pcisig.com
E-mail: administration@pcisig.com
Phone: 503-619-0569
Fax: 503-644-6708
Technical Support
techsupp@pcisig.com
DISCLAIMER
This PCI Code and ID Assignment Specification is provided as is with no warranties whatsoever, including any warranty of
merchantability, non-infringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal,
specification, or sample. PCI-SIG disclaims all liability for infringement of proprietary rights, relating to use of information in this
specification. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein.
PCI Express is a trademark of PCI-SIG.
All other product names are trademarks, registered trademarks, or service marks of their respective owners.
© 2012, 2013, 2014, 2015, and 2016 PCI SIG. All rights reserved.
PCI Express M.2 Specification
PCI Express M.2 Specification | 3
Revision 1.1, March 7, 2016
Revision History
Rev
Version
History
Date
1.0
Initial Release
November 1, 2013
1.1
Incorporated the following ECNs:
Transition of NFC Signals from 3.3V to 1.8V ECN
M.2 COEX Signal Definition – UART ECN
M.2 2242 WWAN Module ECN
M.2 Signal Definition – Audio & ANTCTL Functions ECN
Tx Blanking and SYSCLK on Socket 1 Related Pinouts ECN
Power-up Requirements for PCIe Side Bands (PERST#, etc.) ECN
Power-up Requirements for PCIe Side Bands in a VBAT Powered System
ECN
MiniEx_M2_ECN_SMBus_for_SSD_Socket2_Socket3 - 1112_14
WWAN_Key_C_Definition_ECN_WW12.3
SMBus ECN, Clarification
BGA-SSD ECN
M.2 SSIC Eye Limits Definitions
Other changes:
Incorporated all changes from M2_10 Errata Table and Backup of
M 2 Rev1 0 Errata Table 04292015-6.8Added section 6.8, High Speed
Differential Pair AC Coupling Cap Values and Cap Location Examples
Changed all Mid-Line and Mid-plane to Mid-mount per WG decision
March 7, 2016
PCI Express M.2 Specification
PCI Express M.2 Specification | 4
Revision 1.1, March 7, 2016
Table of Contents
1. Introduction to M.2 Specification .................................................................... 19
1.1. Terms and Definitions ...........................................................................................20
1.2. Targeted Application .............................................................................................20
1.3. Specification References ......................................................................................22
2. Mechanical Specification ................................................................................. 23
2.1. Overview ...............................................................................................................23
2.2. Card Type Naming Convention .............................................................................25
2.3. Card Specifications ...............................................................................................28
2.3.1. Card Form Factors Intended for Connectivity Socket 1 ................................28
2.3.2. Card Form Factors Intended for WWAN Socket 2 ........................................33
2.3.3. Card Form Factor for SSD Socket 2 and 3 ...................................................35
2.3.4. Card PCB Details .........................................................................................40
2.3.5. Soldered-down Form Factors .......................................................................46
2.3.6. Soldered-Down Form Factors for BGA SSDs ...............................................54
2.3.7. RF Connectors .............................................................................................63
2.4. System Connector Specifications..........................................................................70
2.4.1. Connector Pin Count ....................................................................................71
2.4.2. Contact Pitch ................................................................................................71
PCI Express M.2 Specification
PCI Express M.2 Specification | 5
Revision 1.1, March 7, 2016
2.4.3. System Connector Parametric Specifications ...............................................71
2.4.4. Additional Environmental Requirements .......................................................73
2.4.5. Card Insertion ..............................................................................................73
2.4.6. Point of Contact Guideline ............................................................................74
2.4.7. Top-side Connection ....................................................................................74
2.4.8. Mid-mount Connection (Using M1.8 Connector) ...........................................82
2.4.9. Connector Key Dimension ............................................................................88
2.5. Module Stand-off ..................................................................................................91
2.5.1. Recommended Main Board Hole .................................................................91
2.5.2. Electrical Ground Path .................................................................................91
2.5.3. Thermal Ground Path ...................................................................................91
2.5.4. Stand-off Guidelines .....................................................................................94
2.5.5. Screw Selection Guideline ...........................................................................96
2.6. Thermal Guidelines for the M.2 .............................................................................98
2.6.1. Objective ......................................................................................................98
2.6.2. Introduction to Thermal Management ...........................................................99
2.6.3. System Skin Temperature—Fanless System ............................................. 100
2.6.4. Examples of Dissipation (TDP) Response of Modules................................ 101
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