没有合适的资源?快使用搜索试试~ 我知道了~
首页onfi4.2 协议文档英文版
THIS SPECIFICATION IS PROVIDED TO YOU “AS IS” WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NONINFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE. THE AUTHORS OF THIS SPECIFICATION DISCLAIM ALL LIABILITY, INCLUDING LIABILITY FOR INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RE
资源详情
资源评论
资源推荐
1
Open NAND Flash Interface Specification:
NAND Connector
Connector Revision 1.0
23-April-2008
Hynix Semiconductor
Intel Corporation
Micron Technology, Inc.
Phison Electronics Corp.
Sony Corporation
Spansion
STMicroelectronics
2
This 1.0 revision of the Open NAND Flash Interface NAND Connector specification ("Final
Specification") is available for download at www.onfi.org.
SPECIFICATION DISCLAIMER
THIS SPECIFICATION IS PROVIDED TO YOU “AS IS” WITH NO WARRANTIES
WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-
INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE. THE AUTHORS OF THIS
SPECIFICATION DISCLAIM ALL LIABILITY, INCLUDING LIABILITY FOR INFRINGEMENT OF
ANY PROPRIETARY RIGHTS, RELATING TO USE OR IMPLEMNETATION OF INFORMATION
IN THIS SPECIFICATION. THE AUTHORS DO NOT WARRANT OR REPRESENT THAT SUCH
USE WILL NOT INFRINGE SUCH RIGHTS. THE PROVISION OF THIS SPECIFICATION TO
YOU DOES NOT PROVIDE YOU WITH ANY LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS.
Copyright 2005-2008, Hynix Semiconductor, Intel Corporation, Micron Technology, Inc., Phison
Electronics Corp., Sony Corporation, Spansion, STMicroelectronics. All rights reserved.
For more information about ONFI, refer to the ONFI Workgroup website at www.onfi.org.
All product names are trademarks, registered trademarks, or servicemarks of their respective
owners.
ONFI Connector Workgroup Technical Editor:
Yun Ling
Intel Corp.
2111 NE 25
th
Ave, M/S JF2-54
Hillsboro, OR 97124
(503) 264-4977
yun.ling@intel.com
3
Table of Contents
1.
Introduction ........................................................................................................................... 4
1.1. Purpose and Scope........................................................................................................... 4
1.2. Connector Overview.......................................................................................................... 4
1.3. References........................................................................................................................ 4
1.4. Terms and Definitions ....................................................................................................... 5
2. Signal Description and Pin Assignment................................................................................ 6
2.1. Signal Description ............................................................................................................. 6
2.2. Pin Assignments ............................................................................................................... 6
3. Mechanical Interfaces...........................................................................................................9
3.1. Vertical NAND Module Connector .................................................................................... 9
3.2. Right-Angle NAND Module Connector............................................................................ 16
4. Electrical Specification........................................................................................................26
4.1. DC Requirements............................................................................................................ 26
4.2. Parasitic Requirements................................................................................................... 26
5. Mechanical and Environmental Specification..................................................................... 28
5.1. Mechanical Requirements............................................................................................... 28
5.2. Environmental Requirements.......................................................................................... 28
APPENDIX A - Measurement of Connector Parasitics ................................................................. 29
A.1 Reference Equipment.......................................................................................................... 29
A.2 Test Fixture and Samples....................................................................................................29
A.3 Sample Preparation............................................................................................................. 30
A.4 Network Analyzer Calibration .............................................................................................. 30
A.5 Measurement....................................................................................................................... 31
A.5.1 DUT Board Parasitics ................................................................................................... 31
A.5.2 Connector Capacitance and Inductance...................................................................... 31
A.6 Converting S-parameters to Parasitic.............................................................................. 32
A.7 Report.................................................................................................................................. 32
4
1. Introduction
1.1. Purpose and Scope
This specification defines the standard NAND flash module form factors, and the form, fit and
function of the standard NAND module connectors for the NAND flash modules. It contains the
connector pin assignments, mechanical, electrical and environmental requirements. The
intention of this document is to enable connector, system, and flash module designers and
manufacturers to build, qualify and use the NAND module connectors as the standard interfaces
to plug the NAND flash modules into PC’s and other systems.
1.2. Connector Overview
Driven by different form factor and cost requirements, two different connectors and module form
factors are defined in this specification to enable the applications of NAND module in desktop and
mobile platforms, as well as other systems.
A 78-pin, 1.0 mm pitch vertical through-hole connector, similar to the existing DDR2 connector, is
defined for applications where a module vertically enters the connector, perpendicular to the
system board such as in a desktop computer.
A 78- pin, 0.6 mm pitch right-angle surface-mount connector, similar to the existing SO-DDR2
connector, is defined for applications that require a right-angle entry of the module into the
connector, parallel to the system board such as in a mobile computer.
1.3. References
The following references provide normative requirements as specified in the body of this
specification:
• Open NAND Flash Interface Specification Rev 1.0. www.onfi.org
• Open NAND Flash Interface Specification Rev 2.0. www.onfi.org
• EIA-364-1000.01: Environmental Test Methodology for Assessing the Performance of
Electrical Connectors and Sockets used in Business Office Applications. www.eia.org
5
1.4. Terms and Definitions
Term Description
EIA Electronics Industry Alliance
DDR2 connector 240-pin, 1.0 mm pitch vertical connector; refer to customer drawings
from connector manufacturers
ONFI Open NAND Flash Interface
DUT Device under test
NAND module Module on which NAND memory packages are placed, used with the
NAND module connector
NAND module
connectors
Connectors defined in this specification, including both the vertical and
right-angle connectors
Right-angle
connector
A connector that accepts a module parallel to the system board
SO-DDR2
connector
Small-outline DDR2 connector with a right-angle entry of the module
into the connector; refer to customer drawings from connector
manufacturers
System board PCB on which the NAND module connector is mounted
Vertical connector A connector that accepts a module perpendicular to the system board
剩余32页未读,继续阅读
weixin_43887300
- 粉丝: 0
- 资源: 4
上传资源 快速赚钱
- 我的内容管理 收起
- 我的资源 快来上传第一个资源
- 我的收益 登录查看自己的收益
- 我的积分 登录查看自己的积分
- 我的C币 登录后查看C币余额
- 我的收藏
- 我的下载
- 下载帮助
会员权益专享
最新资源
- c++校园超市商品信息管理系统课程设计说明书(含源代码) (2).pdf
- 建筑供配电系统相关课件.pptx
- 企业管理规章制度及管理模式.doc
- vb打开摄像头.doc
- 云计算-可信计算中认证协议改进方案.pdf
- [详细完整版]单片机编程4.ppt
- c语言常用算法.pdf
- c++经典程序代码大全.pdf
- 单片机数字时钟资料.doc
- 11项目管理前沿1.0.pptx
- 基于ssm的“魅力”繁峙宣传网站的设计与实现论文.doc
- 智慧交通综合解决方案.pptx
- 建筑防潮设计-PowerPointPresentati.pptx
- SPC统计过程控制程序.pptx
- SPC统计方法基础知识.pptx
- MW全能培训汽轮机调节保安系统PPT教学课件.pptx
资源上传下载、课程学习等过程中有任何疑问或建议,欢迎提出宝贵意见哦~我们会及时处理!
点击此处反馈
安全验证
文档复制为VIP权益,开通VIP直接复制
信息提交成功
评论1