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ualcomm Technologies, Inc.
Confidential and Proprietary – Qualcomm Technologies, Inc.
© 2015 Qualcomm Technologies, Inc. and/or its affiliated companies. All rights reserved.
NO PUBLIC DISCLOSURE PERMITTED: Please report postings of this document on public servers or websites to:
DocCtrlAgent@qualcomm.com.
Restricted Distribution: Not to be distributed to anyone who is not an employee of either Qualcomm Technologies, Inc. or its
affiliated companies without the express approval of Qualcomm Configuration Management.
Not to be used, copied, reproduced, or modified in whole or in part, nor its contents revealed in any manner to others without the
express written permission of Qualcomm Technologies, Inc.
Qualcomm ChipCode is a product of Qualcomm Technologies, Inc. Other Qualcomm products referenced herein are products of
Qualcomm Technologies, Inc. or its subsidiaries.
MDM9x07 LE Software User Manual
80-P2200-18 A
November 3, 2015
Qualcomm, Qualcomm ChipCode, and Hexagon are trademarks of Qualcomm Incorporated, registered in the United States and
other countries. All Qualcomm Incorporated trademarks are used with permission. Other product and brand names may be
trademarks or registered trademarks of their respective owners.
This technical data may be subject to U.S. and international export, re-export, or transfer (“export”) laws. Diversion contrary to U.S.
and international law is strictly prohibited.
Qualcomm Technologies, Inc.
5775 Morehouse Drive
San Diego, CA 92121
U.S.A.
80-P2200-18 A Confidential and Proprietary – Qualcomm Technologies, Inc. 3
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
Revision history
Revision Date Description
A November 2015 Initial release
80-P2200-18 A Confidential and Proprietary – Qualcomm Technologies, Inc. 4
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
Contents
1 Introduction ...................................................................................................... 7
1.1 Purpose.......................................................................................................................... 7
1.2 Conventions .................................................................................................................. 7
1.3 Technical assistance ...................................................................................................... 7
2 Software environment ..................................................................................... 8
2.1 Equipment and software ............................................................................................... 8
2.2 Installation and setup .................................................................................................... 9
2.2.1 Install Ubuntu .................................................................................................... 9
2.2.2 Install ARM RVCT.......................................................................................... 10
2.2.3 Install the Hexagon toolchain .......................................................................... 12
2.2.4 Install SCons .................................................................................................... 12
3 Software product information ...................................................................... 13
3.1 Component and metabuild overview .......................................................................... 13
3.1.1 Component build ............................................................................................. 13
3.1.2 Metabuild ......................................................................................................... 13
3.1.3 Relocatable image support ............................................................................... 15
3.1.4 Multi-Process Domain (PD) support in MPSS builds ..................................... 16
3.2 MDM9x07 LE software distribution .......................................................................... 17
3.2.1 Qualcomm ChipCode site ................................................................................ 18
3.3 APSS build system ...................................................................................................... 19
3.3.1 OpenEmbedded................................................................................................ 20
3.3.2 BitBake ............................................................................................................ 21
3.3.3 GNU Autotools ................................................................................................ 21
3.3.4 UBI and UBIFS ............................................................................................... 22
3.3.5 Fastmap support ............................................................................................... 26
3.4 Compilation and build procedures .............................................................................. 28
3.4.1 Set the build shell environment ....................................................................... 28
3.4.2 Build flavors .................................................................................................... 29
3.4.3 Compile APSS ................................................................................................. 29
3.4.4 Compile the boot loaders ................................................................................. 31
3.4.5 Compile MPSS ................................................................................................ 33
3.4.6 Compile RPM .................................................................................................. 36
3.4.7 Compile TZBSP............................................................................................... 37
3.4.8 Build WCNSS image ....................................................................................... 38
3.4.9 Build BTFM .................................................................................................... 38
3.4.10 Build non-HLOS images ............................................................................... 38
3.4.11 NAND page size change for non-HLOS and HLOS images ......................... 39
3.5 Build commands ......................................................................................................... 39
MDM9x07 LE Software User Guide Contents
80-P2200-18 A Confidential and Proprietary – Qualcomm Technologies, Inc. 5
MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION
4 Firmware programming ................................................................................ 41
4.1 Equipment and software ............................................................................................. 41
4.2 Installation and setup .................................................................................................. 42
4.2.1 Install and configure TRACE32 ...................................................................... 42
4.2.2 Install the Android adb, fastboot, and host USB driver ................................... 42
4.3 Running T32 ............................................................................................................... 45
4.4 Flash an LE build using QPST or JTAG..................................................................... 46
4.4.1 Map the build ................................................................................................... 46
4.4.2 Erase NAND .................................................................................................... 47
4.4.3 Flash the build.................................................................................................. 48
4.4.4 QPST build loading ......................................................................................... 49
4.4.5 Flash the device using fastboot ........................................................................ 56
A References ..................................................................................................... 58
A.1 Related documents ..................................................................................................... 58
A.2 Acronyms and terms .................................................................................................. 58
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