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MT6580

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loginid=songconglin@hongyucom.com,time=2015-06-18 10:43:34,ip=27.38.97.38,doctitle=MT6580 WCDMA Smartphone SoC Application Processor Technical Brief v1.0.pdf,company=Hongyu_WCX

This document contains information that is proprietary to MediaTek Inc.

Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited.

Version: 1.0

Release date: 2015-04-15

Specifications are subject to change without notice.

MT6580 WCDMA Smartphone SoC

Application Processor Technical Brief

MEDIATEK CONFIDENTIAL

FOR songconglin@ hongyucom.com USE ONLY

loginid=songconglin@hongyucom.com,time=2015-06-18 10:43:34,ip=27.38.97.38,doctitle=MT6580 WCDMA Smartphone SoC Application Processor Technical Brief v1.0.pdf,company=Hongyu_WCX

MT6580

WCDMA Smartphone SoC Application Processor

Confidential A

MediaTek Confidential

Page 3 of 53

This document contains information that is proprietary to MediaTek Inc.

Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited.

Table of Contents

Document Revision History ............................................................................................. 2

Table of Contents .............................................................................................................. 3

Preface ............................................................................................................................. 6

1 System Overview ...................................................................................................... 7

1.1 Platform Features ...................................................................................................................... 8

1.2 MODEM Feature ....................................................................................................................... 9

1.3 Cellular RF Features ................................................................................................................ 10

1.4 Connectivity Features .............................................................................................................. 11

1.5 Multimedia Features ................................................................................................................ 13

1.6 General Description ................................................................................................................. 14

2 Product Description ............................................................................................... 15

2.1 Pin Description ......................................................................................................................... 15

2.1.1 Ball Map View ............................................................................................................... 15

2.1.2 Pin Coordinate .............................................................................................................. 15

2.1.3 Detailed Pin Description .............................................................................................. 19

2.2 Electrical Characteristic .......................................................................................................... 28

2.2.1 Absolute Maximum Ratings ....................................................................................... 28

2.2.2 Recommended Operating Conditions ........................................................................ 29

2.2.3 Storage Condition ........................................................................................................ 30

2.3 DRAM Timing Diagram ........................................................................................................... 31

2.3.1 Introduction .................................................................................................................. 31

2.3.2 DDRPHY Clock ............................................................................................................. 31

2.3.3 DRAM Read and Write Timing .................................................................................. 32

2.4 System Configuration ..............................................................................................................35

2.4.1 Mode Selection .............................................................................................................35

2.4.2 Constant Tie Pins..........................................................................................................35

2.5 Power-on Sequence ................................................................................................................. 36

2.6 Cellular RF Characteristic ....................................................................................................... 38

2.6.1 Recommended Operating Conditions ........................................................................ 38

2.6.2 Reference Clock ........................................................................................................... 39

2.6.3 Transmitter .................................................................................................................. 39

2.6.4 Receiver ......................................................................................................................... 41

2.7 Connectivity RF Characteristic ............................................................................................... 43

2.7.1 Wi-Fi RF Radio Characteristic .................................................................................... 43

2.7.2 Bluetooth RF Radio Characteristic ............................................................................. 45

2.7.3 GPS RF Radio characteristic ....................................................................................... 49

2.7.4 FM RF Radio Characteristic ....................................................................................... 49

2.8 Package Information ................................................................................................................ 51

2.8.1 Package Outlines .......................................................................................................... 51

2.8.2 Thermal Operating Specifications ............................................................................... 51

2.8.3 Lead-free Packaging .................................................................................................... 52

2.9 Ordering Information ..............................................................................................................53

MEDIATEK CONFIDENTIAL

FOR songconglin@ hongyucom.com USE ONLY

loginid=songconglin@hongyucom.com,time=2015-06-18 10:43:34,ip=27.38.97.38,doctitle=MT6580 WCDMA Smartphone SoC Application Processor Technical Brief v1.0.pdf,company=Hongyu_WCX

MT6580

WCDMA Smartphone SoC Application Processor

Confidential A

MediaTek Confidential

Page 4 of 53

This document contains information that is proprietary to MediaTek Inc.

Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited.

2.9.1 Top Marking Definition ...............................................................................................53

Lists of Tables and Figures

Table 2-1. Pin coordinate (use LPDDR2) ................................................................................................... 15

Table 2-2. Acronym for pin type ................................................................................................................. 19

Table 2-3. Detailed pin description (use LPDDR2) .................................................................................. 20

Table 2-4. Absolute maximum ratings for power supply ......................................................................... 28

Table 2-5. Recommended operating conditions for power supply .......................................................... 29

Table 2-6. DDRPHYclock timing parameters ............................................................................................ 31

Table 2-7. LPDDR2 1066 timing parameters ............................................................................................ 32

Table 2-8. LPDDR3 1066 timing parameters ........................................................................................... 33

Table 2-9. Mode selection .......................................................................................................................... 35

Table 2-10. Constant tied pins ................................................................................................................... 35

Table 2-11. Recommended operating conditions for cellular RF I/O ...................................................... 38

Table 2-12. Reference clock operation mode ............................................................................................ 39

Table 2-13. Reference output clock buffer specification .......................................................................... 39

Table 2-14. Cellular RF 3G transmitter chain performance ..................................................................... 39

Table 2-15. Cellular RF 2G transmitter chain performance ..................................................................... 40

Table 2-16. Cellular RF 2G receiver target specification ........................................................................... 41

Table 2-17. Cellular RF 3G WCDMA receiver target specification .......................................................... 42

Table 2-18. 2.4GHz receiver specification ................................................................................................. 43

Table 2-19. 2.4GHz transmitter specification ........................................................................................... 44

Table 2-20. Basic data rate receiver specification .................................................................................... 45

Table 2-21. Basic data rate transmitter specification ............................................................................... 46

Table 2-22. Enhanced data rate receiver specification ............................................................................. 46

Table 2-23. Enhanced data rate transmitter specification ........................................................................47

Table 2-24. Bluetooth LE receiver specification ........................................................................................47

Table 2-25. Bluetooth LE transmitter specification ................................................................................. 48

Table 2-26. GPS receiver performance ...................................................................................................... 49

Table 2-27. FM receiver specification........................................................................................................ 49

Table 2-28. Thermal operating specifications ........................................................................................... 51

Figure 1-1. Block diagram of MT6580 ........................................................................................................ 14

Figure 2-1. Ball map view for LPDDR2 ...................................................................................................... 15

Figure 2-2. DDRPHYclock EDCLKx and EDCLKx_B ............................................................................... 31

Figure 2-3. Differential signals of DDRPHY clock .................................................................................... 31

Figure 2-4. LPDDR2 write timing ............................................................................................................. 32

Figure 2-5. LPDDR2 read timing ............................................................................................................... 32

Figure 2-6. LPDDR3 write timing ............................................................................................................. 33

Figure 2-7. LPDDR3 read timing ............................................................................................................... 33

Figure 2-8. Power on/off sequence with XTAL ........................................................................................ 36

Figure 2-9. Power on/off sequence without XTAL .................................................................................... 37

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