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JEDEC
STANDARD
DDR4 SDRAM
JESD79-4B
(Revision of JESD79-4A, November 2013)
JUNE 2017
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
NOTICE
JEDEC standards and publications contain material that has been prepared, reviewed, and
approved through the JEDEC Board of Directors level and subsequently reviewed and approved
by the JEDEC legal counsel.
JEDEC standards and publications are designed to serve the public interest through eliminating
misunderstandings between manufacturers and purchasers, facilitating interchangeability and
improvement of products, and assisting the purchaser in selecting and obtaining with minimum
delay the proper product for use by those other than JEDEC members, whether the standard is to
be used either domestically or internationally.
JEDEC standards and publications are adopted without regard to whether or not their adoption
may involve patents or articles, materials, or processes. By such action JEDEC does not assume
any liability to any patent owner, nor does it assume any obligation whatever to parties adopting
the JEDEC standards or publications.
The information included in JEDEC standards and publications represents a sound approach to
product specification and application, principally from the solid state device manufacturer
viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or
publication may be further processed and ultimately become an ANSI standard.
No claims to be in conformance with this standard may be made unless all requirements stated in
the standard are met.
Inquiries, comments, and suggestions relative to the content of this JEDEC standard or
publication should be addressed to JEDEC at the address below, or refer to www.jedec.org under
Standards and Documents for alternative contact information.
Published by
©JEDEC Solid State Technology Association 2017
3103 North 10th Street
Suite 240 South
Arlington, VA 22201-2107
This document may be downloaded free of charge; however JEDEC retains the
copyright on this material. By downloading this file the individual agrees not to
charge for or resell the resulting material.
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This document is copyrighted by JEDEC and may not be
reproduced without permission.
For information, contact:
JEDEC Solid State Technology Association
3103 North 10th Street
Suite 240 South
Arlington, VA 22201-2107
or refer to www.jedec.org under Standards-Documents/Copyright Information.
JEDEC Standard No. 79-4B
-i-
1 Scope ............................................................................................................................................................................1
2 DDR4 SDRAM Package Pinout and Addressing ......................................................................................................2
2.1 DDR4 SDRAM Row for X4, X8 and X16..........................................
.............................................................................2
2.2 DDR4 SDRAM Ball Pitch ...............................................................
................................................................................2
2.3 DDR4 SDRAM Columns for X4,X8 and X16..........................................
........................................................................2
2.4 DDR4 SDRAM X4/8 Ballout using MO-207 ......................................
.......................................................................... 2
2.5 DDR4 SDRAM X16 Ballout using MO-207 .......................................
.............................................................................3
2.6 DDR4 SDRAM X32 Ballout using MO-XXX ..............................................
.....................................................................4
2.7 Pinout Description.................................................................
.........................................................................................6
2.8 DDR4 SDRAM Addressing................................................................
.............................................................................7
2.9 DDP Single Rank(SR) x16 from two x8 .................................................
........................................................................9
3 Functional Description .............................................................................................................................................11
3.1 Simplified State Diagram ......................................................
.................................................................................... 11
3.2 Basic Functionality ................................................................
.......................................................................................12
3.3 RESET and Initialization Procedure...............................................
..............................................................................12
3.3.1 Power-up Initialization Sequence .......................................
.......................................................................................12
3.3.2 VDD Slew rate at Power-up Initialization Sequence .................................................................................................13
3.3.3 Reset Initialization with Stable Power .......................................................................................................................14
3.4 Register Definition........................................................................................................................................................14
3.4.1 Programming the mode registers ..............................................................................................................................14
3.5 Mode Register.......................................................................
.......................................................................................17
4 DDR4 SDRAM Command Description and Operation ...........................................................................................28
4.1 Command Truth Table.................................................................
.................................................................................28
4.2 CKE Truth Table ....................................................................
.......................................................................................29
4.3 Burst Length, Type and Order........................................................
..............................................................................30
4.3.1 BL8 Burst order with CRC Enabled ................................................
...........................................................................30
4.4 DLL-off Mode & DLL on/off Switching procedure....................
....................................................................................31
4.4.1 DLL on/off switching procedure .................................................................................................................................31
4.4.2 DLL “on” to DLL “off” Procedure ................................................................................................................................31
4.4.3 DLL “off” to DLL “on” Procedure ................................................................................................................................32
4.5 DLL-off Mode ...............................................................................................................................................................33
4.6 Input Clock Frequency Change ........................................................
...........................................................................34
4.7 Write Leveling .....................................................................
.........................................................................................35
4.7.1 DRAM setting for write leveling & DRAM termination function in that mode .............................................................36
4.7.2 Procedure Description................................................................................................................................................36
4.7.3 Write Leveling Mode Exit............................................................................................................................................37
4.8 Temperature controlled Refresh modes.......................................................................................................................38
4.8.1 Normal temperature mode ( 0°C =< TCASE =< 85°C ) ............................................................................................38
4.8.2 Extended temperature mode ( 0°C =< TCASE =< 95°C ) .........................................................................................38
4.9 Fine Granularity Refresh Mode......................................................
..............................................................................39
4.9.1 Mode Register and Command Truth Table...........
.....................................................................................................39
4.9.2 tREFI and tRFC parameters.......................................................................................................................................40
4.9.3 Changing Refresh Rate..............................................................................................................................................40
4.9.4 Usage with Temperature Controlled Refresh mode...................................................................................................41
4.9.5 Self Refresh entry and exit.........................................................................................................................................41
4.10 Multi Purpose Register................................................................................................................................................41
4.10.1 DQ Training with MPR..............................................................................................................................................41
4.10.2 MR3 definition .........................................................................................................................................................41
4.10.3 MPR Reads .............................................................................................................................................................42
4.10.4 MPR Writes .............................................................................................................................................................44
4.10.5 MPR Read Data format ...........................................................................................................................................47
4.11 Data Mask(DM), Data Bus Inversion (DBI) and TDQS....
............................................................................................52
DDR4 SDRAM STANDARD
Contents
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