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Property of RadiSys Corp. - For Internal Use Only – External Distribution Prohibited
PICMG
®
COM.0
COM Express
®
Module Base Specification
Revision 2.1
May 14, 2012
Property of RadiSys Corp. - For Internal Use Only – External Distribution Prohibited
© 2005, 2010, 2011, 2012 PCI Industrial Computer Manufacturers Group. The attention of
adopters is directed to the possibility that compliance with or adoption of PICMG®
specifications may require use of an invention covered by patent rights. PICMG® shall not
be responsible for identifying patents for which a license may be required by any PICMG®
specification or for conducting legal inquiries into the legal validity or scope of those patents
that are brought to its attention. PICMG® specifications are prospective and advisory only.
Prospective users are responsible for protecting themselves against liability for infringement
of patents.
NOTICE:
The information contained in this document is subject to change without notice. The material
in this document details a PICMG® specification in accordance with the license and notices
set forth on this page. This document does not represent a commitment to implement any
portion of this specification in any company's products.
WHILE THE INFORMATION IN THIS PUBLICATION IS BELIEVED TO BE ACCURATE,
PICMG® MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH
REGARD TO THIS MATERIAL INCLUDING, BUT NOT LIMITED TO, ANY WARRANTY OF
TITLE OR OWNERSHIP, IMPLIED WARRANTY OF MERCHANTABILITY OR WARRANTY
OF FITNESS FOR PARTICULAR PURPOSE OR USE.
In no event shall PICMG® be liable for errors contained herein or for indirect, incidental,
special, consequential, reliance or cover damages, including loss of profits, revenue, data or
use, incurred by any user or any third party. Compliance with this specification does not
absolve manufacturers of equipment from the requirements of safety and regulatory
agencies (UL, CSA, FCC, IEC, etc.).
IMPORTANT NOTICE:
This document includes references to specifications, standards or other material not created
by PICMG. Such referenced materials will typically have been created by organizations that
operate under IPR policies with terms that vary widely, and under process controls with
varying degrees of strictness and efficacy. PICMG has not made any enquiry into the nature
or effectiveness of any such policies, processes or controls, and therefore ANY USE OF
REFERENCED MATERIALS IS ENTIRELY AT THE RISK OF THE USER. Users should
therefore make such investigations regarding referenced materials, and the organizations
that have created them, as they deem appropriate.
PICMG®, CompactPCI®, AdvancedTCA®, AdvancedTCA® 300,ATCA®, ATCA® 300,
CompactPCI® Express, COM Express®, SHB Express®, and the PICMG, CompactPCI,
AdvancedTCA, µTCA and ATCA logos are registered trademarks, and MicroTCA™, xTCA™
and AdvancedMC™ are trademarks of the PCI Industrial Computer Manufacturers Group.
All other brand or product names may be trademarks or registered trademarks of their
respective holders.
Property of RadiSys Corp. - For Internal Use Only – External Distribution Prohibited
Contents
Contents
1 Introduction 1
1.1 Objective...................................................................................................................................... 2
1.2 COM.0R2.0 Changes from R1.0...................................................................................................3
Type 6
Type 10
All Types
1.3 COM.0 Revision 1.0 vs. 2.0 Compatibility Considerations............................................................5
AC97 / HDA
Carrier based BIOS devices
SDVO
TV Out
12V Pin Reclamation
1.4 COM.0 R2.1 Changes from R2.0..................................................................................................6
Mini form factor
I/Os
Power
Updates
1.5 Name and Logo Usage................................................................................................................. 7
1.6 Intellectual Property......................................................................................................................8
1.6.1 Necessary Claims (referring to mandatory or recommended features)...........................................8
1.6.2 Unnecessary Claims (referring to optional features or non-normative elements)...........................8
1.6.3 Third Party Disclosures....................................................................................................................9
1.7 Copyright Notice......................................................................................................................... 10
1.8 Special Word Usage...................................................................................................................10
1.9 Acronyms / Definitions................................................................................................................11
1.10 Applicable Documents and Standards......................................................................................13
1.11 Statement of Compliance......................................................................................................... 15
2 Module Overview 16
2.1 Module Configuration.................................................................................................................16
2.2 Feature Overview - Size.............................................................................................................17
2.2.1 Mini Module....................................................................................................................................17
2.2.2 Compact Module............................................................................................................................17
2.2.3 Basic Module..................................................................................................................................17
2.2.4 Extended Module...........................................................................................................................17
2.3 Feature Overview - Pin-out Types..............................................................................................18
2.3.1 Pin-out Type 1................................................................................................................................18
2.3.2 Pin-out Type 10..............................................................................................................................18
2.3.3 Pin-out Type 2................................................................................................................................19
2.3.4 Pin-out Type 3................................................................................................................................19
2.3.5 Pin-out Type 4................................................................................................................................19
2.3.6 Pin-out Type 5................................................................................................................................19
PICMG® COM.0 Revision 2.1 COM Express® Base Specification, May 14, 2012 iii
Property of RadiSys Corp. - For Internal Use Only – External Distribution Prohibited
Contents
2.3.7 Pin-out Type 6................................................................................................................................19
3 Required and Optional Features 20
3.1 Module Pin-out Type Definitions.................................................................................................20
3.2 Module Pin-out Types 1-6 & 10 - Required and Optional Features.............................................21
3.3 Feature Fill Order.......................................................................................................................23
3.4 EAPI - Embedded Application Programming Interface...............................................................24
4 Signal Descriptions 25
4.1 Signal Naming Convention.........................................................................................................25
4.2 Pin and Signal Buffer Types.......................................................................................................25
4.2.1 Pin Types.......................................................................................................................................25
4.2.2 Buffer Types...................................................................................................................................25
4.2.3 Power Rails and Tolerances..........................................................................................................26
4.3 Signal List................................................................................................................................... 27
4.3.1 AC97 Audio / High Definition Audio...............................................................................................27
4.3.2 Ethernet..........................................................................................................................................28
4.3.3 IDE.................................................................................................................................................30
4.3.4 Serial ATA......................................................................................................................................31
4.3.5 General Purpose PCI Express Lanes............................................................................................32
4.3.6 PEG PCI Express Lanes................................................................................................................33
4.3.7 ExpressCard..................................................................................................................................34
4.3.8 PCI Bus..........................................................................................................................................35
4.3.9 USB................................................................................................................................................36
4.3.10 LVDS Flat Panel...........................................................................................................................37
4.3.11 LPC Interface...............................................................................................................................38
4.3.12 SPI Interface................................................................................................................................39
SPI Power
Module Vs Carrier Board Pull-ups
4.3.13 Analog VGA.................................................................................................................................41
4.3.14 PEG Multiplexed SDVO...............................................................................................................42
4.3.15 Digital Display Interfaces (DDI) - Module Type 6 and 10.............................................................43
4.3.16 DDI Signals: DisplayPort..............................................................................................................48
4.3.17 DDI Signals: SDVO......................................................................................................................49
4.3.18 DDI Signals: HDMI / DVI.............................................................................................................50
4.3.19 General Purpose Serial Interface.................................................................................................51
4.3.20 I2C Bus.........................................................................................................................................52
4.3.21 Miscellaneous..............................................................................................................................53
4.3.22 Power and System Management.................................................................................................54
4.3.23 Thermal Protection.......................................................................................................................56
4.3.24 SM Bus.........................................................................................................................................57
4.3.25 General Purpose Input Output.....................................................................................................58
4.3.26 SDIO.............................................................................................................................................59
4.3.27 Module Type Definition................................................................................................................60
4.3.28 Power and Ground.......................................................................................................................61
iv PICMG® COM.0 Revision 2.1 COM Express® Base Specification, May 14, 2012
Property of RadiSys Corp. - For Internal Use Only – External Distribution Prohibited
Contents
4.3.29 eDP - Embedded DisplayPort......................................................................................................62
4.3.30 CAN Bus......................................................................................................................................64
4.4 Signals Requiring Carrier Board Termination.............................................................................65
4.4.1 Ethernet..........................................................................................................................................65
4.4.2 Analog VGA...................................................................................................................................65
4.4.3 LVDS..............................................................................................................................................65
4.4.4 USB................................................................................................................................................65
4.4.5 SDVO (Types 2-5)..........................................................................................................................65
4.4.6 Digital Display Interfaces (DDI)......................................................................................................66
4.4.7 VCC_RTC......................................................................................................................................66
4.5 Signals Requiring Module Termination.......................................................................................68
4.5.1 AC coupled on the Module.............................................................................................................68
4.5.2 Misc................................................................................................................................................68
4.6 Pin-out Tables............................................................................................................................70
4.6.1 Type 1............................................................................................................................................70
4.6.2 Type 10..........................................................................................................................................73
4.6.3 Type 2............................................................................................................................................76
4.6.4 Type 3............................................................................................................................................79
4.6.5 Type 4............................................................................................................................................82
4.6.6 Type 5............................................................................................................................................85
4.6.7 Type 6............................................................................................................................................88
5 Module and Carrier Board Implementation Specifications 91
5.1 PCI Express Link Configuration Definitions................................................................................91
5.2 PCI Express Link Configuration Guidelines................................................................................92
5.3 COM Express EEPROMs.........................................................................................................100
5.3.1 EEPROM Device Information......................................................................................................100
5.3.2 COM Express Module EEPROM.................................................................................................100
5.3.3 COM Express Carrier Board EEPROM.......................................................................................100
5.4 Loss Budgets for High Speed Differential Interfaces.................................................................101
5.4.1 PCI Express Insertion Loss Budget with Slot Card......................................................................103
5.4.2 PCI Express Insertion Loss Budget with Carrier Board PCIE Device..........................................105
5.4.3 SATA Insertion Loss Budget........................................................................................................107
5.4.4 USB 2.0 Insertion Loss Budget....................................................................................................108
5.4.5 SuperSpeed USB Insertion Loss Budget.....................................................................................109
5.4.6 10/100/1000 Ethernet Insertion Loss Budget...............................................................................110
5.4.7 DDI Loss Budget..........................................................................................................................111
5.5 PCI Bus Implementation...........................................................................................................113
5.5.1 Carrier Board PCI Resource Allocation.......................................................................................113
5.5.2 PCI Clocks...................................................................................................................................114
5.6 Carrier Board LPC Devices...................................................................................................... 116
5.7 SPI Devices.............................................................................................................................. 117
5.8 10 Gigabit Ethernet Option.......................................................................................................118
PICMG® COM.0 Revision 2.1 COM Express® Base Specification, May 14, 2012 v
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