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首页瑞萨Renesas RH850/F1KH,F1KM UM 用户手册 r01uh0684ej0110 Rev.1.10 Dec, 2018
瑞萨Renesas RH850/F1KH,F1KM UM 用户手册 r01uh0684ej0110 Rev.1.10 Dec, ...
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瑞萨32位单片机 RH850/F1KH,F1KM用户手册 (r01uh0684ej0110) Rev.1.10 Dec, 2018 The RH850/F1KH is ideal for automotive electronics, such as BCM (body control module), gateway, HVAC, lighting modules, and many other applications.
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www.renesas.com
All information contained in these materials, including products and product specifications,
represents information on the product at the time of publication and is subject to change by
Renesas Elect
ronics Corp. without notice. Please review the latest information published by
Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.
website (http://www.renesas.com).
User’s Manual
Rev.1.10 Dec, 2018
RH850/F1KH,
RH850/F1KM
User’s Manual: Hardware
Renesas microcontroller
RH850 Family
Notice
1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operati
on of
semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits,
software, and information in the design of your product or system. Renesas Electronics disclaims any and all liability for any losses and
damages incurred by you or third parties arising from the use of these circuits, software, or information.
2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents,
copyrights, or other intellectual property rights of third parties, by or arising from the use of Renesas Electronics products or technical
information described in this document, including but not limited to, the product data, drawings, charts, programs, algorithms, and
application examples.
3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas
Electronics or others.
4. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics
disclaims any and all liability for any losses or damages incurred by you or third parties arising from such alteration, modification,
copying or reverse engineering.
5. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended
applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below.
“Standard”: Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment;
home electronic appliances; machine tools; personal electronic equipment; industrial robots; etc.
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication
equipment; key financial terminal systems; safety control equipment; etc.
Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other
Renesas Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems that may pose a
direct threat to human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause serious
property damage (space system; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military
equipment; etc.). Renesas Electronics disclaims any and all liability for any damages or losses incurred by you or any third parties arising
from the use of any Renesas Electronics product that is inconsistent with any Renesas Electronics data sheet, user’s manual or other
Renesas Electronics document.
6. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General
Notes for Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the
ranges specified by Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation
characteristics, installation, etc. Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of
the use of Renesas Electronics products outside of such specified ranges.
7. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products
have specific characteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless
designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
Electronics document, Renesas Electronics products are not subject to radiation resistance design. You are responsible for implementing
safety measures to guard against the possibility of bodily injury, injury or damage caused by fire, and/or danger to the public in the event
of a failure or malfunction of Renesas Electronics products, such as safety design for hardware and software, including but not limited to
redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures.
Because the evaluation of microcomputer software alone is very difficult and impractical, you are responsible for evaluating the safety of
the final products or systems manufactured by you.
8. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each
Renesas Electronics product. You are responsible for carefully and sufficiently investigating applicable laws and regulations that regulate
the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics
products in compliance with all these applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or
losses occurring as a result of your noncompliance with applicable laws and regulations.
9. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use,
or sale is prohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control
laws and regulations promulgated and administered by the governments of any countries asserting jurisdiction over the parties or
transactions.
10. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or
otherwise sells or transfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this
document.
11. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas
Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or
Renesas Electronics products.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly
controlled subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.4.0-1 November 2017)
Notes for CMOS devices
(1) Voltage
application
waveform at input
pin:
Waveform distortion due to input noise or a reflected wave may cause
malfunction. If the input of the CMOS device stays in the area between VIL
(MAX) and VIH (MIN) due to noise, etc., the device may malfunction. Take
care to prevent chattering noise from entering the device when the input level
is fixed, and also in the transition period when the input level passes through
the area between VIL (MAX) and VIH (MIN).
(2) Handling of
unused input pins:
Unconnected CMOS device inputs can be cause of malfunction. If an input pin
is unconnected, it is possible that an internal input level may be generated due
to noise, etc., causing malfunction. CMOS devices behave differently than
Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or
low by using pull-up or pull-down circuitry. Each unused pin should be
connected to power supply or GND via a resistor if there is a possibility that it
will be an output pin. All handling related to unused pins must be judged
separately for each device and according to related specifications governing
the device.
(3) Precaution
against ESD:
A strong electric field, when exposed to a MOS device, can cause destruction
of the gate oxide and ultimately degrade the device operation. Steps must be
taken to stop generation of static electricity as much as possible, and quickly
dissipate it when it has occurred. Environmental control must be adequate.
When it is dry, a humidifier should be used. It is recommended to avoid using
insulators that easily build up static electricity. Semiconductor devices must be
stored and transported in an anti-static container, static shielding bag or
conductive material. All test and measurement tools including work benches
and floors should be grounded. The operator should be grounded using a
wrist strap. Semiconductor devices must not be touched with bare hands.
Similar precautions need to be taken for PW boards with mounted
semiconductor devices.
(4) Status before
initialization:
Power-on does not necessarily define the initial status of a MOS device.
Immediately after the power source is turned ON, devices with reset functions
have not yet been initialized. Hence, power-on does not guarantee output pin
levels, I/O settings or contents of registers. A device is not initialized until the
reset signal is received. A reset operation must be executed immediately after
power-on for devices with reset functions.
(5) Power ON/OFF
sequence:
In the case of a device that uses different power supplies for
the internal
op
eration and external interface, as a rule, switch on the external power supply
after switching on the internal power supply. When switching the power supply
off, as a rule, switch off the external power supply and then the internal power
supply. Use of the reverse power on/off sequences may result in the
application of an overvoltage to the internal elements of the device, causing
malfunction and degradation of internal elements due to the passage of an
abnormal current. The correct power on/off sequence must be judged
separately for each device and according to related specifications governing
the device.
(6) Input of signal
during power off
state:
Do not input signals or an I/O pull-up power supply while the device is not
powered. The current injection that results from input of such a signal or I/O
pull-up power supply may cause malfunction and the abnormal current that
passes in the device at this time may cause degradation of internal elements.
Input of signals during the power off state must be judged separately for each
device and according to related specifications governing the device.
How to Use This Manual
Readers This manual is intended for users who wish to understand the functions of the
RH850/F1KH, RH850/F1KM and design application systems using the following
RH850/F1KH, RH850/F1KM microcontrollers:
Purpose This manual is intended to give users an understanding of the hardware functions
of the RH850/F1KH, RH850/F1KM shown in the Organization below.
Organization This manual is divided into two parts: Hardware (this manual) and Architecture
(RH850G3KH User’s Manual: Software).
How to read this
manual
It is assumed that the readers of this manual have general knowledge in the fields of
electrical engineering, logic circuits, and microcontrollers.
To understand the overall functions of the RH850/F1KH, RH850/F1KM.
→ Read this manual according to the Contents.
To understand the details of an instruction function
→ See RH850G3KH User’s Manual: Software (R01US0165E) available separately.
This RH850/F1KH, RH850/F1KM Hardware User’s Manual corresponds to Rev.1.10.
The RH850/F1KH-D8 description relates to a revision level of Rev.1.00.
The xxA section describes the functionality of RH850/F1KH-D8.
The xxB section describes the functionality of RH850/F1KM-S4.
The xxC section describes the functionality of RH850/F1KM-S1.
The xxAB section describes the functionality of RH850/F1KH-D8 and RH850/F1KM-S4.
The xxBC section describes the functionality of RH850/F1KM-S4 and RH850/F1KM-S1.
The xxx section describes the functionality of all related products.
Hardware Software
Pin functions
CPU function
On-chip peripheral functions
Flash memory programming
Overview
Processor Model
Register Reference
Exceptions and Interrupts
Memory Management
Instruction Reference
Reset
Appendix
Conventions Data significance: Higher digits on the left and lower digits on the right
Active low representation: xxx (overscore over pin or signal name)
Memory map address: Higher addresses on the top and lower addresses on the bottom
Note: Footnote for item marked with Note in the text
Caution: Information requiring particular attention
Remark: Supplementary information
Numeric representation: Binary ... xxxx or xxxx
B
Decimal ... xxxx
Hexadecimal ... xxxx
H
Prefix indicating power of 2 (address space, memory capacity):
K (kilo): 2
10
= 1,024
M (mega): 2
20
= 1,024
2
G (giga): 2
30
= 1,024
3
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