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RH850/F1L datasheet

瑞萨的数据手册,The RH850/F1L is a product line in Renesas' RH850/F1x series of single chip microcontrollers designed for automotive body applications. The embedded flash memory will range from 256 KB to 2 MB and packages will be covered from small package 48 pin to 176 pin.
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User’s Manual
www.renesas.com
RH850/F1L Group
User’s Manual: Hardware
Renesas microcontroller
RH850 Family
Apr, 2016Rev.1.33
All information contained in these materials, including products and product specifications,
represents information on the product at the time of publication and is subject to change by
Renesas Electronics Corp. without notice. Please review the latest information published by
Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.
website (http://www.renesas.com).
32
Cover

Notice
Notice
1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
semiconductor p
roducts and application examples. You are fully responsible for the incorporation
of these circuits, software,
and inform
ation in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by y
ou
or third
parties arising from the use of these circuits, software, or inform
ation.
2.
Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics
does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any dama
ges
incurred
by you resulting from errors in or omissions from the information in
cluded herein.
3.
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of
third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No
license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of
Renesas Electronic
s or others.
4.
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from such alteration,
modification, co
py or otherwise misappropriation of Ren
esas Electronics product.
5.
Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The
recommended applications for each Renesas Electronics product depends on the product’s quality grade, as
indicated below.
“Standard”:
Computers; office equipment; communications equipment; test and measurement equipment; audio and vi
sual
equipment; home electronic
appliances; machine tools; personal electronic equipment; and industrial robots etc.
“High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-
crime systems; and safety equipment etc.
Renesas Electronics products are neither intended nor authorized for use in products or systems that may pose a direct threat to
human life or bodily injury (artificial life support devices or systems, surgical implantations etc.), or may cause serious property
damages (nuclear reactor control systems, military equipment etc.). You must check the quality grade of each Renesas
Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any
application for which it is not intended. Renesas Electronics shall not be in any way liable for any damages or losses incurred
by you or third parties arising from the use of any Renesas Electronics product for which the product is not intended by Renesas
Electronics.
6. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, h
eat radiation
chara
cteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or
damages arising out of the use of Renesas Electronics products beyond such specified ra
nges.
7.
Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have
specific
characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Furth
er,
Renesas Electro
nics products are not subject to radiation resistance design. Please be sure to implement safety me
asures to
guard th
em against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas
Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control
and
malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation
of microcomputer software alone is very difficult, please evaluate the safety of the final products or systems manufactured by
you.
8.
Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility
of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and
regulations th
at regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Dir
ective.
Renesas Electronics assumes no
liability for damages or losses occurring as a result of your noncompliance with applicable laws
and regu
lations.
9.
Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose
manufacture, us
e, or sale is prohibited under any applicable domestic or foreign laws or regulations. You should no
t use
Renesas Electro
nics products or technology described in this document for any purpose relating to military applicat
ions or use
b
y the military, including but not limited to the development of weapons of mass destruction. When exporting the
Renesas
Electronics prod
ucts or technology described in this document, you should comply with the applicable export contr
ol laws and
regulations and follow the procedures required by such laws and regulations.
10. It is the responsibility of the buyer or distributor of Renesas Electronics products, who distributes, disposes of, or otherwise
places the product with a third party, to notify such third party in advance of the contents and conditions set forth in
this
document, Renesas Electronics assumes no responsibility
for any losses incurred by you or third parties as a result o
f
unauthorized use of Renesas Electronics products.
11. This document may not be reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas
Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document
or Renesas Electronics products, or if you have any other
inquiries.
(Note 1)
“Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-
owned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(2012.4)

Notes for CMOS devices
(1) Voltage
application
waveform at input
pin:
Waveform distortion due to input noise or a reflected wave may cause
malfunction. If the input of the CMOS device stays in the area between VIL
(MAX) and VIH (MIN) due to noise, etc., the device may malfunction. Take
care to prevent chattering noise from entering the device when the input level
is fixed, and also in the transition period when the input level passes through
the area between VIL (MAX) and VIH (MIN).
(2) Handling of
unused input pins:
Unconnected CMOS device inputs can be cause of malfunction. If an input pin
is unconnected, it is possible that an internal input level may be generated due
to noise, etc., causing malfunction. CMOS devices behave differently than
Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or
low by using pull-up or pull-down circuitry. Each unused pin should be
connected to power supply or GND via a resistor if there is a possibility that it
will be an output pin. All handling related to unused pins must be judged
separately for each device and according to related specifications governing
the device.
(3) Precaution
against ESD:
A strong electric field, when exposed to a MOS device, can cause destruction
of the gate oxide and ultimately degrade the device operation. Steps must be
taken to stop generation of static electricity as much as possible, and quickly
dissipate it when it has occurred. Environmental control must be adequate.
When it is dry, a humidifier should be used. It is recommended to avoid using
insulators that easily build up static electricity. Semiconductor devices must be
stored and transported in an anti-static container, static shielding bag or
conductive material. All test and measurement tools including work benches
and floors should be grounded. The operator should be grounded using a
wrist strap. Semiconductor devices must not be touched with bare hands.
Similar precautions need to be taken for PW boards with mounted
semiconductor devices.
(4) Status before
initialization:
Power-on does not necessarily define the initial status of a MOS device.
Immediately after the power source is turned ON, devices with reset functions
have not yet been initialized. Hence, power-on does not guarantee output pin
levels, I/O settings or contents of registers. A device is not initialized until the
reset signal is received. A reset operation must be executed immediately after
power-on for devices with reset functions.
(5) Power ON/OFF
sequence:
In the case of a device that uses different power supplies for the internal
operation and external interface, as a rule, switch on the external power supply
after switching on the internal power supply. When switching the power supply
off, as a rule, switch off the external power supply and then the internal power
supply. Use of the reverse power on/off sequences may result in the
application of an overvoltage to the internal elements of the device, causing
malfunction and degradation of internal elements due to the passage of an
abnormal current. The correct power on/off sequence must be judged
separately for each device and according to related specifications governing
the device.
(6) Input of signal
during power off
state:
Do not input signals or an I/O pull-up power supply while the device is not
powered. The current injection that results from input of such a signal or I/O
pull-up power supply may cause malfunction and the abnormal current that
passes in the device at this time may cause degradation of internal elements.
Input of signals during the power off state must be judged separately for each
device and according to related specifications governing the device.

How to Use This Manual
Readers This manual is intended for users who wish to understand the functions of the
RH850/F1L and design application systems using the RH850/F1L
microcontrollers.
Purpose This manual is intended to give users an understanding of the hardware
functions of the RH850/F1L shown in the Organization below.
Organization This manual is divided into two parts: Hardware (this manual) and software
(RH850G3K User’s Manual: Software).
How to read this
manual
It is assumed that the readers of this manual have general knowledge in the fields of
electrical engineering, logic circuits, and microcontrollers.
To understand the overall functions of the RH850/F1L.
Read this manual according to the Contents.
To understand the details of an instruction function
See RH850G3K User’s Manual: Software available separately.
The “yyy bit of the xxx register” is described as the “xxx.yyy bit” in this manual.
Note with caution that if “xxx.yyy” is described as is in a program, however, the
compiler/assembler cannot recognize it correctly.
Hardware Software
Pin functions
CPU function
On-chip peripheral functions
Flash memory programming
Overview
Processor Model
Register Reference
Exceptions and Interrupts
Memory Management
Instruction Reference
Reset
Appendix

Conventions Data significance: Higher digits on the left and lower digits on the right
Active low representation: xxx (overscore over pin or signal name)
Memory map address: Higher addresses on the top and lower addresses on the bottom
Note: Footnote for item marked with Note in the text
Caution: Information requiring particular attention
Remark: Supplementary information
Numeric representation: Binary ... xxxx or xxxx
B
Decimal ... xxxx
Hexadecimal ... xxxx
H
Prefix indicating power of 2 (address space, memory capacity):
K (kilo): 2
10
= 1,024
M (mega): 2
20
= 1,024
2
G (giga): 2
30
= 1,024
3
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