MIL-STD-883H2010微电子器件测试方法_MIL-STD-883

MIL-STD-883H

2010

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MIL-STD-883H

26 February 2010

SUPERSEDING

MIL-STD-883G

28 February 2006

DEPARTMENT OF DEFENSE

TEST METHOD STANDARD

MICROCIRCUITS

AMSC N/A FSC 5962

The documentation and process

conversion measures necessary to

comply with this revision shall be

completed by 30 September 2010.

INCH - POUND

MIL-STD-883H

iii

CONTENTS

PARAGRAPH Page

1. SCOPE ......................................................................................................................................... 1

1.1 Purpose ....................................................................................................................................... 1

1.2 Intended use of or reference to MIL-STD-883 ............................................................................ 1

2. APPLICABLE DOCUMENTS ....................................................................................................... 3

2.1 General ....................................................................................................................................... 3

2.2 Government documents ............................................................................................................. 3

2.3 Non-Government publications .................................................................................................... 4

2.4 Order of precedence ................................................................................................................... 5

3. ABBREVIATIONS, SYMBOLS, AND DEFINITIONS ................................................................... 6

3.1 Abbreviations, symbols, and definitions ..................................................................................... 6

4. GENERAL REQUIREMENTS ...................................................................................................... 8

4.1 Numbering system ...................................................................................................................... 8

4.2 Test results ................................................................................................................................. 9

4.3 Test sample disposition .............................................................................................................. 9

4.4 Orientation .................................................................................................................................. 9

4.5 Test conditions ............................................................................................................................ 12

4.6 General precautions ................................................................................................................... 14

4.7 Recycled, recovered, and environmentally preferable materials 14

5. DETAIL REQUIREMENTS ........................................................................................................... 15

6. NOTES .......................................................................................................................................... 16

FIGURES

FIGURE

1. Orientation of noncylindrical microelectronic devices to

direction of applied force .............................................................................................................. 10

2. Orientation of cylindrical microelectronic device to

direction of applied force .............................................................................................................. 11

MIL-STD-883H

TEST METHODS

METHOD NO. MECHANICAL TESTS

2021.3 Glassivation layer integrity

2022.2 Wetting balance solderability

2023.6 Nondestructive bond pull

2024.2 Lid torque for glass-frit-sealed packages

2025.4 Adhesion of lead finish

2026 Random vibration

2027.2 Substrate attach strength

2028.4 Pin grid package destructive lead pull test

2029 Ceramic chip carrier bond strength

2030.1 Ultrasonic inspection of die attach

2031.1 Flip chip pull-off test

2032.2 Visual inspection of passive elements

2035 Ultrasonic inspection of TAB bonds

2036 Resistance to soldering heat

ELECTRICAL TESTS (DIGITAL)

3001.1 Drive source, dynamic

3002.1 Load conditions

3003.1 Delay measurements

3004.1 Transition time measurements

3005.1 Power supply current

3006.1 High level output voltage

3007.1 Low level output voltage

3008.1 Breakdown voltage, input or output

3009.1 Input current, low level

3010.1 Input current, high level

3011.1 Output short circuit current

3012.1 Terminal capacitance

3013.1 Noise margin measurements for digital microelectronic devices

3014 Functional testing

3015.8 Electrostatic discharge sensitivity classification

3016 Activation time verification

3017 Microelectronics package digital signal transmission

3018 Crosstalk measurements for digital microelectronic device packages

3019.1 Ground and power supply impedance measurements for digital microelectronics device packages

3020 High impedance (off-state) low-level output leakage current

3021 High impedance (off-state) high-level output leakage current

3022 Input clamp voltage

3023.1 Static latch-up measurements for digital CMOS microelectronic devices

3024 Simultaneous switching noise measurements for digital microelectronic devices

ELECTRICAL TESTS (LINEAR)

4001.1 Input offset voltage and current and bias current

4002.1 Phase margin and slew rate measurements

4003.1 Common mode input voltage range

Common mode rejection ratio

Supply voltage rejection ratio

4004.2 Open loop performance

4005.1 Output performance

4006.1 Power gain and noise figure

4007 Automatic gain control range

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