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CMT2210和17AW无线接收芯片(分别于2110和2117对应).pdf
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CMT2210和17AW无线接收芯片(分别于2110和2117对应).pdf
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CMT2210/17AW
Rev 1.3 | Page 1/28
www.hoperf.com
CMT2210/17AW
Low-Cost 300 – 960 MHz OOK Stand-Alone RF Receiver
Copyright © By CMOSTEK
Features
Embedded EEPROM
Very Easy Development with RFPDK
All Features Programmable
Frequency Range
300 to 480 MHz (CMT2210AW)
300 to 960 MHz (CMT2217AW)
Symbol Rate: 0.1 to 40 ksps
Sensitivity: -113 dBm at 1 ksps, 0.1% BER
Configurable Receiver Bandwidth: 50 to 500 kHz
3-wire SPI Interface for EEPROM Programming
Stand-Alone, No External MCU Control Required
Configurable Duty-Cycle Operation Mode
Supply Voltage: 1.8 to 3.6 V
Low Power Consumption: 3.8 mA
Low Sleep Current
60 nA when Sleep Timer Off
440 nA when Sleep Timer On
RoHS Compliant
16-pin QFN 3x3 and SOP16 Package Options
Applications
Low-Cost Consumer Electronics Applications
Home and Building Automation
Infrared Receiver Replacements
Industrial Monitoring and Controls
Remote Automated Meter Reading
Remote Lighting Control System
Wireless Alarm and Security Systems
Remote Keyless Entry (RKE)
Ordering Information
Part Number Frequency Package MOQ
CMT2210AW-EQR 433.920 MHz QFN16 5,000 pcs
CMT2210AW-ESR 433.920 MHz SOP16 2,500 pcs
CMT2217AW-EQR 868.350 MHz QFN16 5,000 pcs
More Ordering Info: See Page 21
Descriptions
The CMT2210/17AW devices are ultra low power, high
performance, low-cost OOK stand-alone RF receiver for
various 300 to 960 MHz wireless applications. The
CMT2210AW covers the frequency range from 300 to 480
MHz while the CMT2217AW covers the 300 to 960 MHz
frequency range. They are part of the CMOSTEK
NextGenRF
TM
family, which includes a complete line of
transmitters, receivers and transceivers. An embedded
EEPROM allows the frequency, symbol rate and other
features to be programmed into the device using the
CMOSTEK USB Programmer and RFPDK. Alternatively, in
stock products of 433.92/868.35 MHz are available for
immediate demands without the need of EEPROM
programming. When the CMT2210/17AW is always on, it
consumes only 3.8 mA current while achieving -113 dBm
receiving sensitivity. It consumes even less power when
working in duty-cycle operation mode via the built-in sleep
timer. The CMT2210/17AW receiver together with the
CMT211x transmitter enables an ultra low cost RF link.
QFN16 (3X3) SOP16
GND
RFIN
GND
VDD
CSB
SDA
SCL
NC
XIN
XOUT
CLKO
DOUT
VCON
VCOP
nRSTO
NC
13
14
15
16
1 2 3 4
5
6
7
8
9101112
1
2
3
4
5
6
7
14
13
12
10
9
11
VCOP
VCON
GND
RFIN
GND
VDD
CSB
nRSTO
NC
XIN
XOUT
CLKO
DOUT
8
SDA
SCL
15
16
NC
CMT2210/17AW Top View
CMT2210/17AW
Rev 1.3 | Page 2/28
www.hoperf.com
Typical Application
U1
CMT2210/17AW
XIN
XOUT
CLKO
DOUT
NC
nRSTO
VCOP
VCON
GND
RFIN
GND
CSB
SDA
SCL
NC
VDD
L1
C1
C0
ANT
13
14
15
16
9
10
11
12
5
6
7
8
C2
X1
1
2
3
4
DOUT
CSB
SDA
SCL
VDD
J1
1
2
3
4
5
CSB
SDA
SCL
L2
C3
VDD
Figure 1. CMT2210/17AW Typical Application Schematic
Table 1. BOM of 433.92/868.35 MHz Typical Application
[1]
Designator Descriptions
Value (Match to 50Ω ANT)
Value (Common Used ANT)
Unit Manufacturer
433.92 MHz
868.35 MHz
433.92 MHz
868.35 MHz
U1
CMT2210/17AW, low-cost
300 – 960 MHz OOK
stand-alone RF receiver
- - - CMOSTEK
X1
±20 ppm, SMD32*25 mm,
crystal
26 26 MHz EPSON
L1
±5%, 0603 multi-layer chip
inductor
27 6.8 33 6.8 nH Murata LQG18
L2
[2]
±5%, 0603 multi-layer chip
inductor, for QFN16
22 3.9 22 3.9
nH Murata LQG18
±5%, 0603 multi-layer chip
inductor, for SOP16
15 -- 15 --
C1 ±0.25 pF, 0402 NP0, 50 V 3.3 2.7 2.7 2.7 pF Murata GRM15
C0 ±20%, 0402 X7R, 25 V 0.1 0.1 uF Murata GRM15
C2, C3 ±5%, 0402 NP0, 50 V 27 27 pF Murata GRM15
Note:
[1]. The 868.35 MHz application is for CMT2217AW only.
[2]. CMT2210AW devices in QFN16 and SOP16 packages share the same BOM except for the L2.
Table 2. Product Selection Table
Product
Modulation/
Frequency
Sensitivity Rx Current
Embedded
EEPROM
Package
CMT2210AW
OOK/
300-480 MHz
-113 dBm
(433.92 MHz, 1 ksps, 0.1% BER)
3.8 mA
(433.92 MHz)
√
QFN16(3x3)/
SOP16
CMT2217AW
OOK/
300-960 MHz
-110 dBm
(868.35 MHz, 1 ksps, 0.1% BER)
5.2 mA
(868.35 MHz)
√
QFN16(3x3)
Note: Connector J1 is for
EEPROM Programming
CMT2210/17AW
Rev 1.3 | Page 3/28
www.hoperf.com
Abbreviations
Abbreviations used in this data sheet are described below
AGC
Automatic Gain Control PC
Personal Computer
AN
Application Notes
PCB
Printed Circuit Board
BER
Bit Error Rate PLL
Phase Lock Loop
BOM
Bill of Materials
PN9
Pseudorandom Noise 9
BSC
Basic Spacing between Centers POR
Power On Reset
BW
DC
Bandwidth
Direct Current
PUP
Power Up
QFN
Quad Flat No-lead
EEPROM Electrically Erasable Programmable Read-Only
Memory
RF
Radio Frequency
RFPDK
RF Products Development Kit
ESD
Electro-Static Discharge
RoHS
Restriction of Hazardous Substances
ESR
Equivalent Series Resistance RSSI
Received Signal Strength Indicator
Ext
Extended
Rx
Receiving, Receiver
IF
Intermediate Frequency SAR
Successive Approximation Register
LNA Low Noise Amplifier SOP Small Outline Package
LO
Local Oscillator
SPI
Serial Port Interface
LPOSC
Low Power Oscillator TH
Threshold
Max
Maximum
Tx
Transmission, Transmitter
MCU
Microcontroller Unit Typ
Typical
Min
Minimum
USB
Universal Serial Bus
MOQ
Minimum Order Quantity VCO
Voltage Controlled Oscillator
NP0
Negative-Positive-Zero
WOR
Wake On Radio
NC
Not Connected XOSC
Crystal Oscillator
OOK
On-Off Keying
XTAL/Xtal
Crystal
CMT2210/17AW
Rev 1.3 | Page 4/28
www.hoperf.com
Table of Contents
1. Electrical Characteristics ............................................................................................................................................ 5
1.1 Recommended Operation Conditions ................................................................................................................... 5
1.2 Absolute Maximum Ratings................................................................................................................................... 5
1.3 Receiver Specifications ......................................................................................................................................... 6
1.4 Crystal Oscillator ................................................................................................................................................... 7
1.5 LPOSC .................................................................................................................................................................. 7
2. Pin Descriptions .......................................................................................................................................................... 8
3. Typical Performance Characteristics ....................................................................................................................... 10
4. Typical Application Schematic ................................................................................................................................. 11
5. Functional Descriptions ............................................................................................................................................ 12
5.1 Overview ............................................................................................................................................................. 12
5.2 Modulation, Frequency and Symbol Rate ........................................................................................................... 12
5.3 Embedded EEPROM and RFPDK ...................................................................................................................... 13
5.4 All Configurable Options ..................................................................................................................................... 13
5.5 Internal Blocks Description .................................................................................................................................. 15
5.5.1 RF Front-end and AGC ............................................................................................................................ 15
5.5.2 IF Filter ..................................................................................................................................................... 15
5.5.3 RSSI ........................................................................................................................................................ 15
5.5.4 SAR ADC ................................................................................................................................................. 15
5.5.5 Crystal Oscillator ...................................................................................................................................... 16
5.5.6 Frequency Synthesizer ............................................................................................................................ 16
5.5.7 LPOSC ..................................................................................................................................................... 16
5.6 Operation Mode .................................................................................................................................................. 16
5.7 Always Receive Mode ......................................................................................................................................... 17
5.8 Duty-Cycle Receive Mode ................................................................................................................................... 18
5.9 Easy Duty-Cycle Configurations .......................................................................................................................... 19
5.10 The nRSTO ......................................................................................................................................................... 19
5.11 The CLKO ........................................................................................................................................................... 20
6. Ordering Information ................................................................................................................................................. 21
7. Package Outline ......................................................................................................................................................... 22
8. Top Marking ............................................................................................................................................................... 24
8.1 CMT2210/17A W Top Marking ............................................................................................................................. 24
9.
Other Documentations .............................................................................................................................................. 26
10. Document Change List.............................................................................................................................................. 27
11. Contact Information .................................................................................................................................................. 28
CMT2210/17AW
Rev 1.3 | Page 5/28
www.hoperf.com
1. Electrical Characteristics
VDD = 3.3 V, T
OP
= 25 ℃, F
RF
= 433.92 MHz, sensitivities are measured in receiving a PN9 sequence and matching to 50 Ω
impedance, with the BER of 0.1%. All measurements are performed using the board CMT2210/17AW-EM V1.0, unless otherwise
noted.
1.1 Recommended Operation Conditions
Table 3. Recommended Operation Conditions
Parameter Symbol Conditions Min Typ Max Unit
Operation Voltage Supply V
DD
1.8
3.6 V
Operation Temperature T
OP
-40
85 ℃
Supply Voltage Slew Rate
1
mV/us
1.2 Absolute Maximum Ratings
Table 4. Absolute Maximum Ratings
[1]
Parameter Symbol Conditions Min Max Unit
Supply Voltage V
DD
-0.3 3.6 V
Interface Voltage V
IN
-0.3 V
DD
+ 0.3 V
Junction Temperature T
J
-40 125 ℃
Storage Temperature T
STG
-50 150 ℃
Soldering Temperature T
SDR
Lasts at least 30 seconds
255 ℃
ESD Rating
[2]
Human Body Model (HBM) -2 2 kV
Latch-up Current
@ 85 ℃ -100 100 mA
Notes:
[1]. Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress
rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
[2]. The CMT2210/17AW is high-performance RF integrated circuits with VCON/P pins having an ESD rating < 2 kV HBM.
Handling and assembly of this device should only be done at ESD-protected workstations.
Caution! ESD sensitive device. Precaution should be used when handling the device in order
to prevent permanent damage.
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