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August 2019

Revision Number: 3.5

Order No. 333016-009

Intel® Ethernet Controller I210

Datasheet

Networking Division (ND)

Features:

• Small package: 9 x 9 mm

• PCIe v2.1 (2.5 GT/s) x1, with Switching Voltage Regulator (iSVR)

• Integrated Non-Volatile Memory (iNVM)

• Three single port SKUs: SerDes, Copper, Copper IT

• Value Part (Intel

Ethernet Controller I211)

• Platform Power Efficiency

— IEEE 802.3az Energy Efficient Ethernet (EEE)

— Proxy: ECMA-393 and Windows* logo for proxy offload

• Advanced Features:

— 0 to 70 °C commercial temperature or -40 to 85 °C industrial temperature

— Audio-video bridging

• IEEE 1588/802.1AS precision time synchronization

• IEEE 802.1Qav traffic shaper (with software extensions)

— Jumbo frames

— Interrupt moderation, VLAN support, IP checksum offload

— PCIe OBFF (Optimized Buffer Flush/Fill) for improved system power management

— Four transmit and four receive queues

— RSS and MSI-X to lower CPU utilization in multi-core systems

— Advanced cable diagnostics, auto MDI-X

— ECC – error correcting memory in packet buffers

— Four Software Definable Pins (SDPs)

• Manageability:

— NC-SI for greater bandwidth pass through

— SMBus low-speed serial bus to pass network traffic

— Flexible firmware architecture with secure Flash update

—MCTP over SMBus/PCIe

— OS2BMC/CEM (optionally enabled via external Flash)

—PXE and iSCSI boot

Revision History—Ethernet Controller I210

Revision History

Rev Date Notes

3.5 August 2019

Updated Section 11.3.1 (Power Supply Specification).

3.4 February 2019

Updated Section 11.8.1 (new validated Flash parts).

3.3 June 2018

Updated Section 7.2.2.2.3 [LaunchTime (25)].

3.2 January 2018

Updated Table 2-1 (Pull-Up/Pull-Down Resistors).

Added section 3.3.2.4 (iNVM Structure Version Information).

Updated section 5.5.6 (Timing Guarantees).

Updated section 6.8.2 (Port Identification LED Blinking; Word 0x04).

Updated section 11.8.1 (Flash Parts).

3.1 June 2017

Revised Section:

• 3.4.3 (iNVM Programming Flows).

3.0 March 2017

Revised Sections:

• 3.7.8.5.7 (Internal PHY Power-Down State).

• 11.6.2.7 (MDIO AC Specification).

• 12.4 (Oscillator Support).

• 12.11 (XOR Testing).

2.9 January 2016

• Revised Table 2-1 (changed JTAG_CLK to show a pull down resistor instead of a pull up).

• Updated intra-document cross references.

• Revised the description of Section 7.8.3.3.3 (Synchronized Output Clock on SDP Pins).

• Revised Section 8.15.13 (TimeSync Auxiliary Control Register - TSAUXC (0xB640; RW), bit 4

and bit 7 description).

2.8 September 2015

• Revised Section 6.8.7.2 (added image build information).

• Updated Table 11-11 (t

and t

descriptions).

• Updated Table 11-15 (c

load

value).

• Updated Figure 12.12 (changed pull-up value from 1.9 to 1.5).

• Updated Section 12.5.4 (Diff to CMR value).

• Added Section 12.5.6.5 (Maximum Trace Lengths Based on Trace Geometry).

• Fixed cross references in Section 12.6.

2.7 February 2015

• Removed all references to IEEE Std 1149.6-2003, IEEE Standard for Boundary-Scan Testing of

Advanced Digital Networks, IEEE, 2003.

• Updated section 8.27.3.37 (Misc Test - Page 6, Register 26).

• Removed sections 8.27.3.38 through 8.27.3.43.

• Updated section 12-4 (Oscillator Support).

• Added section 12.5.5 (Designing the I210 as a 10/100 Mb/s Only Device).

• Updated section 12.5.6.4 (Differential Pair Trace Routing for 10/100/1000 Designs).

2.6 June 2014

• Revised section 11.8.1 (replaced W25Q16DWSSIG with W25Q16DVSSIG).

2.5 February 2014

• Replaced figure 2-2.

• Revised section 3.4 (iNVM).

• Revised section 3.4.2 (iNVM Structures).

• Revised section 3.7.8.5.5.1 (Internal PHY Back-to-Back SPD).

• Revised table 8-6 (Register Summary; PQMPRC[0 - 3]).

• Revised table 11-11 (Flash I/F Timing Parameters).

• Revised table 11-17 (Specification for External Clock Oscillator).

2.4 July 2013

• Updated revision history.

Ethernet Controller I210 —Revision History

Rev Date Notes

2.3 June 2013

• Revised section 1.3.1 (Audio/Video Bridging Support).

• Revised section 6.7.1.2 (Common Firmware Parameters 1 - Offset 0x1; bit 15).

• Revised section 7.1.2.10 (Receive-Side Scaling (RSS).

• Revised section 7.8.3.1 (Capture Timestamp Mechanism).

• Revised section 8.21.18 (Flexible Host Filter Table Registers - FHFT (0x9000 + 4*n

[n=0...255]; RW); updated note.

• Revised section 8.27.3.23 (MAC Specific Control Register 1 - Page 2, Register 16; bits 9:8).

• Revised table 10-37 (Decision Filter Values).

2.2 April 2013

• Updated title page (Platform Power Efficiency description).

• Revised VPD Area Update Flow description (section 3.3.9.3.2).

• Revised iNVM description (section 3.4).

• Added line loopback information (section 3.7.6.6).

• Revised Acquiring Ownership Over a Shared Resource description (section 4.6.1).

• Revised Releasing Ownership Over a Shared Resource description (section 4.6.2).

• Revised Dr Disable Mode description (section 5.2.4.1).

• Revised Device Rev ID (section 6.2.19).

• Revised Common Firmware Parameters 1 - Offset 0x1 (section 6.7.1.2).

• Updated Compatibility (Word 0x03) bit 11 description (section 6.8.1).

• Updated Setup Options PCIe Function 0 (Word 0x30) bit 5 description (section 6.8.6.1).

• Added PXE VLAN Flash settings (Sections 6.8.6.5 through 6.8.6.9).

• Updated Software Semaphore - SWSM (0x5B50; R/W)

• Removed Firmware Status Register (0x8F0C) entry from Table 8-6.

• Revised note (changed . . . has both F and L flags off to on (section 10.5.7.1).

• Revised Specification for XTAL1 (In); table 11.16.

• Revised Third-Party Magnetics Manufacturers table (section 12.5.3).

• Added Power Delivery Solutions (section 12.7.1).

2.1 November 2012

• Revised table 11.1 - Absolute Maximum Ratings

• Revised section 12.5.3 - Third-Party Magnetics Manufacturers.

• Revised table 12.16 - Absolute Maximum Case Temperature.

• Revised table 12.17 - Thermal Simulation Results for Various Environmental Conditions.

2.0 November 2012

The following sections were revised:

• 1.0 Introduction.

• 3.0 Interconnects.

•6.0 Flash Map.

• 7.0 Inline Functions.

• 8.0 Programming Interface.

• 9.0 PCIe Programming Interface.

• 11.0 Electrical/Mechanical Specification.

• 12.0 Design Considerations.

• 14.0 Diagnostics

• Added new section 13.0 - Thermal Considerations.

1.9 October 2012

• Initial Release (Intel Public).

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