80_CH155_1_AC_QCC3040_VFBGA_DATA_SHEET.pdf_qcc3040规格书

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Device description

■

Tri-core processor architecture

■

High-performance programmable Bluetooth

mono audio

SoC

■

Low power modes to extend battery life

Applications

■

Qualcomm TrueWireless

™

stereo earbuds

Features

■

Qualified

to Bluetooth v5.2

specification

■

120 MHz Qualcomm

Kalimba

™

audio DSP

■

32 MHz Developer Processor

for applications

■

Firmware Processor for system

■

Flexible QSPI flash

programmable platform

■

High-performance 24‑bit audio

interface

■

Digital and analog microphone

interfaces

■

Flexible PIO controller and LED

pins with PWM support

■

Serial interfaces: UART, Bit

Serializer (I²C/SPI), USB 2.0

■

Advanced audio algorithms

■

Active Noise Cancellation:

Hybrid, Feedforward, and

Feedback modes, using Digital

or Analog Mics, enabled using

license keys available from

Qualcomm

■

Qualcomm

aptX

™

and aptX

HD Audio

■

1 or 2 mic Qualcomm

cVc

™

headset speech processing

■

Integrated PMU: Dual SMPS

for system/digital circuits,

Integrated Li-ion battery

charger

■

90-ball 5.6 mm x 5.9 mm x 1.0

mm, 0.5 mm pitch VFBGA

System architecture

XTAL

Bluetooth

Radio

Digital

Audio

Interface

I/O

and

USB

Qualcomm

Kalimba

DSP

Apps

Developer

Processor

Apps

Firmware

Processor

UART/USB

PIO

I²C/SPI

Stereo HQ

ADC

Class-D or

Class-AB

EarPhone

Speaker

Output

LED Driver

with PWM

SMPS

LDOs

Li-Ion

Charger

Line In / Dual

Analog Mic In

Earphone

Battery

LED

DigMic

I²S/PCM

ANC

Flash Memory

For additional information or to submit technical questions, go to https://createpoint.qti.qualcomm.com

Confidential – Qualcomm T

echnologies, Inc. and/or its affiliated companies – May Contain Trade Secrets

NO PUBLIC DISCLOSURE PERMITTED: Please report postings of this document on public servers or websites to DocCtrlAgent@qualcomm.com.

Restricted Distribution: Not to be distributed to anyone who is not an employee of either Qualcomm Technologies International, Ltd. or its affiliated companies

without the express approval of Qualcomm Configuration Management. Distribution to anyone who is not an employee of either Qualcomm Incorporated or its

affiliated companies is subject to applicable confidentiality agreements.

Not to be used, copied, reproduced, or modified in whole or in part, nor its contents revealed in any manner to others without the express written permission of

Qualcomm Technologies International, Ltd.

All Qualcomm products mentioned herein are products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other countries. Kalimba, aptX , and cVc are trademarks of Qualcomm

Technologies International, Ltd., registered in the United States and other countries. Kymera is a trademark of Qualcomm Technologies International, Ltd. Other

product and brand names may be trademarks or registered trademarks of their respective owners.

This technical data may be subject to U.S. and international export, re-export, or transfer ("export") laws. Diversion contrary to U.S. and international law is strictly

prohibited.

Qualcomm Technologies International, Ltd. is a company registered in England and Wales with a registered office at:

Churchill House, Cambridge Business Park, Cowley Road, Cambridge, CB4 0WZ, United Kingdom.

Registered Number: 3665875 | VAT number: GB787433096

QCC3040 VFBGA

Production Information

Data Sheet

80-CH155-1 Rev. AC

March 18, 2020

QCC3040 VFBGA device details

Audio subsystem

■

32‑bit

Kalimba audio digital signal processor (DSP) core

with flexible clocking from 2 MHz to 120 MHz to enable

optimization of performance vs. power consumption

■

DSP executes code from ROM

■

112 KB program random access memory (RAM)

■

448 KB data RAM

■

6 Mb ROM

Application subsystem

■

Dual-core application subsystem 32 MHz operation

■

32‑bit Firmware Processor (reserved for system use)

executes:

□

Bluetooth upper stack

□

Profiles

□

House-keeping code

■

32‑bit Developer Processor executes:

□

Developer applications

■

32 Mb flash memory

■

On-chip caches per core enable optimized performance

and power consumption

Bluetooth subsystem

■

Qualified to Bluetooth v5.2 specification including 2 Mbps

Bluetooth Low Energy

■

Single ended antenna connection with on-chip balun and

Tx/Rx switch

■

Bluetooth, Bluetooth Low Energy, and mixed topologies

supported

■

Class 1 support

Li-ion battery charger

■

Integrated

battery charger supporting up to 200 mA charge

current

■

Variable float (or termination) voltage adjustable in 50 mV

steps from 3.65 V to 4.4 V

■

Thermal monitoring and management are available in

application software

■

Pre-charge to fast charge transition configurable at 2.5 V,

2.9 V, 3.0 V, and 3.1 V

Power management

■

Integrated power management unit (PMU) to minimize

external components

■

QCC3040 VFBGA runs directly from a Li-ion, USB, or

external supply (2.8 V to 6.5 V)

■

Auto-switching between battery and USB (or other)

charging source

■

Power islands employed to optimize power consumption

for variety of use-cases

■

Dual switch-mode power supply (SMPS):

□

Automatic mode selection to minimize power

consumption

□

1.8 V SMPS generates power for both the device and

off-chip circuits

□

Dedicated digital SMPS (output voltage changes

automatically to minimize device power consumption)

80-CH155-1 Rev. AC Confidential – Qualcomm Technologies, Inc. and/or its affiliated companies – May Contain Trade Secrets

Y CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION

Audio engine and digital audio interfaces

■

x unidirectional 24‑bit inter-integrated circuit sound (I²S)

interface

■

Mono analog output configurable as differential Class-AB

earphone speaker output or differential high efficiency

Class-D output:

□

Class-D signal-to-noise ratio (SNR): 99.3 dBA typ.

□

Class-D total harmonic distortion plus noise (THD

+N): 93.5 dB typ.

□

Class-AB SNR: 100.9 dBA typ.

□

Class-AB THD+N: 93.5 dB typ.

■

Dual analog inputs configurable as single ended line inputs

or, unbalanced or balanced analog microphone inputs:

□

SNR single-ended: 101.1 dBA typ.

□

THD+N single-ended: 85.9 dB typ.

■

1 microphone bias (single bias shared by the two

channels):

□

Crosstalk attenuation between two inputs using

recommended application circuit: 80 dB typ.

■

Digital microphone inputs with capability to interface up to

8 digital microphones

■

Both analog-to-digital converter (ADC)s and the digital-to-

analog converter (DAC) support sample rates of 8 kHz,

16 kHz, 32 kHz, 44.1 kHz, 48 kHz, 96 kHz. The DAC also

supports 192 kHz and 384 kHz.

Peripherals and physical interfaces

■

universal asynchronous receiver transmitter (UART)

interface

■

2 x Bit Serializers (programmable serial peripheral

interface (SPI) and inter-integrated circuit interface (I²C)

hardware accelerator)

■

1 x USB interface:

□

A full speed USB (USB-FS) Device (12 Mbps)

– USB interface includes ESD protection to

IEC-61000-4-2 (device level)

■

Internal NOR flash interface

□

Encryption to protect developer code and data

□

Encryption programmable with a 128‑bit security key of

original equipment manufacturer (OEM) choice stored in

on-chip one-time programmable (OTP) memory

■

Up to 22 programmable input/output (PIO) and 5 open

drain/digital input light-emitting diode (LED) pads with

pulse width modulation (PWM)

Package and compliance

■

90-ball 5.6 mm x 5.9 mm x 1.0 mm, 0.5 mm pitch VFBGA

■

Green (restriction of hazardous substances (RoHS)

compliant, and no antimony or halogenated flame

retardants)

QCC3040 VFBGA Data Sheet QCC3040 VFBGA device details

80-CH155-1 Rev. AC Confidential – Qualcomm Technologies, Inc. and/or its affiliated companies – May Contain Trade Secrets

Y CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION

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