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因特尔深度摄像头D400系列最新规格书 英特尔® 实感™ D400 系列摄像头采用安装简便的便携式设计,支持高深度分辨率,并包括具有标准或宽视场的主动红外双目传感器。对于高精度应用领域,请选择采用卷帘快门的 D415。如果是快速移动或室外应用场景,请选择采用全局快门的 D435 或 D435i 摄像头。
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Document Number: 337029-008
Intel
®
RealSense
TM
Product Family D400 Series
Datasheet
Intel
®
RealSense™ Vision Processor D4, Intel
®
RealSense™ Vision
Processor D4 Board, Intel
®
RealSense™ Vision Processor D4 Board V2,
Intel
®
RealSense™ Depth Module D400, Intel
®
RealSense™ Depth Module
D410, Intel
®
RealSense™ Depth Module D415, Intel
®
RealSense™ Depth
Camera D415, Intel
®
RealSense™ Depth Module D420, Intel
®
RealSense™
Depth Module D430, Intel
®
RealSense™ Depth Camera D435, Intel®
RealSense™ Depth Camera D435i
Revision 008
May 2020

2 337029-008
Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter
drafted which includes subject matter disclosed herein.
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service
activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with
your system manufacturer or retailer or learn more at intel.com.
Intel technologies may require enabled hardware, specific software, or services activation. Check with your system manufacturer
or retailer.
The products described may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness
for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or
usage in trade.
All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel
product specifications and roadmaps.
Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548-
4725 or visit www.intel.com/design/literature.htm.
Intel and the Intel logo, Intel
®
Core™, Intel
®
Atom™, trademarks of Intel Corporation in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others.
© 2020 Intel Corporation. All rights reserved.

Description and Features
337029-008 3
Contents
1 Description and Features .................................................................................. 13
2 Introduction .................................................................................................... 14
2.1 Purpose and Scope of this Document ....................................................... 14
2.2 Terminology ......................................................................................... 14
2.3 Stereo Vision Depth Technology Overview ................................................ 15
2.4 Camera System Block Diagram ............................................................... 17
2.5 Intel
®
RealSense™ Depth Module D400 series Product SKUs ...................... 18
2.6 Intel
®
RealSense™ Depth Camera D400 series Product SKUs ..................... 19
3 Component Specification .................................................................................. 20
3.1 Vision Processor D4 Camera System Components ..................................... 20
3.2 Host Processor ..................................................................................... 20
3.3 Intel
®
RealSense™ Vision Processor D4 ................................................... 20
3.3.1 Vision Processor D4 Features .................................................... 20
3.3.2 Vision Processor D4 Signal Description ....................................... 21
3.3.3 Vision Processor D4 Package Mechanical Attributes ...................... 26
3.3.4 Vision Processor D4 Power Requirements .................................... 32
3.3.5 Vision Processor D4 Power Sequencing ....................................... 32
3.3.6 Vision Processor D4 Spec Code .................................................. 33
3.3.7 Vision Processor D4 Storage and Operating Conditions ................. 33
3.3.8 Vision Processor D4 Thermals ................................................... 34
3.4 Clock ................................................................................................... 34
3.5 Serial (SPI) Flash Memory ...................................................................... 34
3.6 Stereo Depth Module ............................................................................. 34
3.6.1 Left and Right Imagers ............................................................. 36
3.6.2 Infrared Projector .................................................................... 37
3.6.3 Color Sensor ........................................................................... 38
3.6.4 Depth Module Connector .......................................................... 39
3.6.5 Stereo Depth Module Label ....................................................... 39
3.6.6 Stiffener ................................................................................. 40
3.6.7 Temperature Sensor ................................................................ 40
3.6.8 Other Stereo Depth Module Components .................................... 40
3.6.9 Mechanical Dimensions ............................................................. 41
3.6.10 Stereo Depth Module Power Sequence........................................ 42
3.6.11 Stereo Depth Module Storage and Powered Conditions ................. 42
3.7 Intel
®
RealSense™ Vision Processor D4 Board .......................................... 43
3.7.1 Mechanical Dimensions ............................................................. 44
3.7.2 Depth Module Receptacle .......................................................... 44
3.7.3 Flex and Rigid Interposer Interconnect ....................................... 44
3.7.4 External Sensor Sync Connector ................................................ 49
3.7.5 USB Peripheral Connector – Type-C ........................................... 49
3.7.6 Color Image Signal Processor (ISP) ............................................ 51
3.7.7 Vision Processor D4 Board Power Requirements .......................... 51
3.7.8 Vision Processor D4 Board Thermals .......................................... 51
3.7.9 Vision Processor D4 Board Storage and Powered Conditions .......... 52
3.7.10 Intel
®
RealSense™ Vision Processor D4 Board Product Identifier and
Material Code .......................................................................... 53
3.8 Intel
®
RealSense™ Depth Camera D400 Series ......................................... 53

4 337029-008
3.8.1 Depth Camera D400 Series Mechanical Dimensions ..................... 54
3.8.2 Depth Camera D400 Series Thermals ......................................... 55
3.8.3 Depth Camera D400 Series Product Identifier and Material Code ... 56
3.8.4 Camera Lens Cleaning Procedure ............................................... 57
4 Functional Specification .................................................................................... 58
4.1 Vendor Identification (VID) and Device Identification (DID) ........................ 58
4.2 Vision Processor D4 Data Streams .......................................................... 58
4.3 Depth Field of View (FOV) ...................................................................... 60
4.4 Depth Field of View at Distance (Z) ......................................................... 61
4.5 Invalid Depth Band ............................................................................... 62
4.6 Minimum-Z Depth ................................................................................. 63
4.7 Depth Quality Specification .................................................................... 63
4.8 Depth Start Point (Ground Zero Reference) .............................................. 64
4.8.1 Depth Origin X-Y Coordinates .................................................... 67
4.9 Depth Camera Functions ........................................................................ 68
4.10 Color Camera Functions ......................................................................... 69
4.11 IMU Specifications ................................................................................. 70
5 Firmware ........................................................................................................ 71
5.1 Update ................................................................................................ 71
5.1.1 Update Limits .......................................................................... 71
5.2 Recovery ............................................................................................. 71
6 Software ......................................................................................................... 72
6.1 Intel
®
RealSense™ Software Development Kit 2.0 ..................................... 72
7 System Integration .......................................................................................... 73
7.1 System Level Block Diagram .................................................................. 73
7.2 Vision Processor D4 System Integration ................................................... 73
7.2.1 Vision Processor D4 Board ........................................................ 73
7.2.2 Vision Processor D4 on Motherboard .......................................... 74
7.3 D4 Camera System Power Delivery ......................................................... 75
7.4 Vision Processor D4 Board for Integrated Peripheral .................................. 76
7.4.1 USB 3.1 Gen 1 Receptacle ........................................................ 76
7.4.2 USB 3.1 Gen 1 High Speed Cable Assembly ................................ 76
7.4.3 Transmit to Receive Crossover .................................................. 77
7.4.4 Motherboard Receptacle ........................................................... 78
7.4.5 Vision Processor D4 Board for Integrated Peripheral Power
Requirements .......................................................................... 78
7.5 Thermals ............................................................................................. 78
7.6 Stereo Depth Module Flex ...................................................................... 80
7.7 Stereo Depth Module Mounting Guidance ................................................. 80
7.7.1 Screw Mount ........................................................................... 80
7.7.2 Bracket Mount ......................................................................... 81
7.7.3 Stereo Depth Module Air gap ..................................................... 82
7.8 Thermal Interface Material ..................................................................... 83
7.9 Heat Sink ............................................................................................. 83
7.10 Cover Design and Material Guidance ....................................................... 83
7.11 Gaskets ............................................................................................... 84
7.11.1 Optical Isolation ...................................................................... 85
7.11.2 Dust Protection ....................................................................... 86
7.12 Firmware Recovery ............................................................................... 86

Description and Features
337029-008 5
7.13 Calibration Support ............................................................................... 87
7.14 Multi-Camera Hardware Sync ................................................................. 87
7.15 Handling Conditions .............................................................................. 88
8 Platform Design Guidelines ............................................................................... 89
8.1 Vision Processor D4 on Motherboard ....................................................... 89
8.2 Kaby Lake U and Kaby Lake Y platforms .................................................. 90
8.2.1 Kaby Lake Platform Introduction ................................................ 90
8.2.2 Supported PCB Stack-Up and Routing Geometries ....................... 90
8.2.3 Vision Processor D4 on Motherboard with USB Host Interface ........ 91
8.2.4 Vision Processor D4 on Motherboard with MIPI Host Interface ....... 92
8.2.5 Vision Processor D4 Board for Integrated Peripheral (USB 3.1 Gen 1
Host to Vision Processor D4 Routing) ......................................... 94
8.2.6 USB2.0 Design Guidelines (USB2 Host to Vision Processor D4
Routing) ................................................................................. 95
8.3 Cherry Trail T4 Platform ......................................................................... 96
8.3.1 Cherry Trail T4 Platform Introduction ......................................... 96
8.3.2 Vision Processor D4 Platform Design Guidelines ........................... 96
9 Regulatory Compliance ..................................................................................... 97
9.1 System Laser Compliance ...................................................................... 97
9.1.1 Certification Statement............................................................. 97
9.1.2 Explanatory Label .................................................................... 97
9.1.3 Cautionary Statements ............................................................. 97
9.1.4 Manufacturer’s Information ....................................................... 98
9.1.5 US FDA Accession Number ........................................................ 98
9.1.6 NRTL Statement ...................................................................... 98
9.2 Ecology Compliance .............................................................................. 99
9.2.1 China RoHS Declaration ............................................................ 99
9.2.2 Waste Electrical and Electronic Equipment (WEEE) ...................... 100
10 Mechanical Drawings ....................................................................................... 101
11 Connector Drawings ........................................................................................ 109
12 Appendix A – Vision Processor D4 on Motherboard Schematic Checklist ................. 111
12.1 Power Delivery .................................................................................... 118
13 Appendix B- Cover Material .............................................................................. 121
Figures
Figure 2-1. Active Infrared (IR) Stereo Vision Technology ......................................................... 16
Figure 2-2. Depth Measurement (Z) versus Range (R) .............................................................. 16
Figure 2-3. Vision Processor D4 Camera System Block Diagram ................................................ 17
Figure 3-1. Vision Processor D4 Package Drawing .................................................................... 28
Figure 3-2. Vision Processor D4 Ball-out ................................................................................. 29
Figure 3-3. Vision Processor D4 Power Sequencing .................................................................. 33
Figure 3-4. Stereo Depth Module (Intel
®
RealSense™ Depth Module D410)................................. 35
Figure 3-5. Stereo Depth Module (Intel
®
RealSense™ Depth Module D430)................................. 35
Figure 3-6. Stereo Depth Module Power Sequence ................................................................... 42
Figure 3-7. Vision Processor D4 Board (USB Peripheral Type-C)................................................. 43
Figure 3-8. Flex Interposer (Illustration) ................................................................................. 45
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