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IMXRT1050RM(参考手册).pdf
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i.MX RT1050处理器是NXP在不断增长的实时处理产品系列中的最新产品,它提供了针对最低功耗和最佳实时响应而优化的高性能处理。 本手册面向董事会级产品设计师和产品软件开发人员。本手册假设读者具有计算机工程和/或软件工程背景,并理解数字系统设计、微处理器体系结构、输入/输出(I/O)设备、行业标准通信和设备接口协议的概念。 本文档涵盖系统级的芯片,并提供架构概述。它还包括系统内存映射、系统级中断事件、外部引脚和引脚复用、外部存储器、系统调试、系统引导、多媒体子系统、电源管理和系统安全性。
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i.MX RT1050 Processor Reference
Manual
Document Number: IMXRT1050RM
Rev. 0, 10/2017

i.MX RT1050 Processor Reference Manual, Rev. 0, 10/2017
2 NXP Semiconductors

Contents
Section number Title Page
Chapter 1
Introduction
1.1 About This Document...................................................................................................................................................201
1.1.1 Audience...................................................................................................................................................... 201
1.1.2 Organization.................................................................................................................................................201
1.1.3 Suggested Reading.......................................................................................................................................201
1.1.3.1 General Information...................................................................................................................202
1.1.3.2 Related Documentation..............................................................................................................202
1.1.4 Conventions................................................................................................................................................. 202
1.1.5 Register Access............................................................................................................................................204
1.1.5.1 Register Diagram Field Access Type Legend............................................................................204
1.1.5.2 Register Macro Usage................................................................................................................204
1.1.6 Signal Conventions...................................................................................................................................... 206
1.1.7 Acronyms and Abbreviations.......................................................................................................................206
1.2 Introduction...................................................................................................................................................................209
1.2.1 Block Diagram............................................................................................................................................. 209
1.3 Features.........................................................................................................................................................................211
1.4 Target Applications.......................................................................................................................................................212
1.5 Endianness Support.......................................................................................................................................................213
Chapter 2
Memory Maps
2.1 Memory system overview.............................................................................................................................................215
2.2 ARM Platform Memory Map....................................................................................................................................... 215
Chapter 3
Interrupts and DMA Events
3.1 Overview.......................................................................................................................................................................223
3.2 CM7 interrupts..............................................................................................................................................................223
3.3 DMA Mux.....................................................................................................................................................................231
i.MX RT1050 Processor Reference Manual, Rev. 0, 10/2017
NXP Semiconductors 3

Section number Title Page
3.4 XBAR Resource Assignments......................................................................................................................................239
Chapter 4
External Signals and Pin Multiplexing
4.1 Overview.......................................................................................................................................................................253
4.1.1 Muxing Options........................................................................................................................................... 253
Chapter 5
Fusemap
5.1 Boot Fusemap............................................................................................................................................................... 279
5.2 Lock Fusemap...............................................................................................................................................................289
5.3 Fusemap Descriptions Table.........................................................................................................................................290
Chapter 6
External Memory Controllers
6.1 Overview.......................................................................................................................................................................307
6.2 Smart External Memory Controller (SEMC) Overview...............................................................................................307
6.3 eMMC/eSD/SDIO.........................................................................................................................................................309
6.4 Quad Serial Peripheral Interface...................................................................................................................................310
Chapter 7
System Debug
7.1 Overview.......................................................................................................................................................................311
7.2 Chip and ARM Platform Debug Architecture.............................................................................................................. 311
7.2.1 Debug Features............................................................................................................................................ 312
7.2.2 Debug system components...........................................................................................................................312
7.2.2.1 AMBA Trace Bus (ATB)...........................................................................................................312
7.2.2.2 CoreSight trace port interface (TPIU)........................................................................................313
7.2.2.3 Embedded Trace Macrocell (ETM)........................................................................................... 314
7.2.2.4 Instrumentation Trace Macrocell...............................................................................................314
7.2.3 Chip-Specific SJC Features......................................................................................................................... 315
7.2.3.1 JTAG Disable Mode.................................................................................................................. 315
7.2.3.2 JTAG ID.....................................................................................................................................315
7.2.4 System JTAG controller main features........................................................................................................315
i.MX RT1050 Processor Reference Manual, Rev. 0, 10/2017
4 NXP Semiconductors

Section number Title Page
7.2.5 SJC TAP Port...............................................................................................................................................316
7.2.6 SJC main blocks...........................................................................................................................................316
7.3 Miscellaneous............................................................................................................................................................... 317
7.3.1 Clock/Reset/Power.......................................................................................................................................317
7.4 Supported tools............................................................................................................................................................. 317
Chapter 8
System Boot
8.1 Chip-specific Boot Information.................................................................................................................................... 319
8.2 Overview.......................................................................................................................................................................322
8.3 Boot modes................................................................................................................................................................... 323
8.3.1 Boot mode pin settings.................................................................................................................................324
8.3.2 High-level boot sequence.............................................................................................................................324
8.3.3 Boot From Fuses mode (BOOT_MODE[1:0] = 00b)..................................................................................325
8.3.4 Serial Downloader (BOOT_MODE[1:0] = 01b)......................................................................................... 326
8.3.5 Internal Boot mode (BOOT_MODE[1:0] = 0b10)...................................................................................... 326
8.3.6 Boot security settings...................................................................................................................................327
8.4 Device configuration.....................................................................................................................................................328
8.4.1 Boot eFUSE descriptions.............................................................................................................................328
8.4.2 GPIO boot overrides.................................................................................................................................... 329
8.4.3 Device Configuration Data (DCD).............................................................................................................. 330
8.5 Device initialization......................................................................................................................................................330
8.5.1 Internal ROM/RAM memory map...............................................................................................................331
8.5.2 Boot block activation .................................................................................................................................. 331
8.5.3 Clocks at boot time...................................................................................................................................... 332
8.5.4 Enabling Caches...........................................................................................................................................334
8.5.5 Exception handling...................................................................................................................................... 334
8.5.6 Interrupt handling during boot..................................................................................................................... 335
8.5.7 Persistent bits............................................................................................................................................... 335
8.6 Boot devices (internal boot)..........................................................................................................................................335
i.MX RT1050 Processor Reference Manual, Rev. 0, 10/2017
NXP Semiconductors 5
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