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首页03-DA14531 - HW design guidelines.pdf
03-DA14531 - HW design guidelines.pdf
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更新于2023-05-26
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DIALOG DA14531设计资料,硬件参考设计,原理图和layout参考设计文档资料。官方原版。
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1
Confidential – subject to Non-Disclosure Agreement restrictions.
DA14531 Hardware Design guides

2
Confidential – subject to Non-Disclosure Agreement restrictions.
Agenda
▪ Application overview
▪ Development kits
▪ Power section
▪ Board design
▪ Crystal selection
▪ RF section
▪ Qualification

3
Confidential – subject to Non-Disclosure Agreement restrictions.
DA14531 Application examples
▪ The DA14531 is capable of operating standalone for ultra low cost, ultra low power
Bluetooth applications
▪ The device is also very well suited to provide a wireless data pipe for existing MCU
applications
▪ Optional cost savers: running in by-pass mode without inductor or by sharing the
system clock
DA14531
DC-DC
converter
GPIO
battery
EE or
Flash
Optional
Sensors/
Actuators
DA14531
DC-DC
converter
Power
CLK
MCU
UART/SPI
RST
GPIO
Sensors/
Actuators

4
Confidential – subject to Non-Disclosure Agreement restrictions.
WLCSP:
• 17 balls
• 1.7 x 2.05 mm2
• 0.5mm pitch
• 6 GPIOs
DA14531 Packages availability
FCQFN:
• 24 pins
• 2.2 x 3.0 mm2
• 0.4mm pitch
• 12 GPIOs

5
Confidential – subject to Non-Disclosure Agreement restrictions.
▪ DA14531 has a 32MHz Xtal (iso 16MHz). The advantage is smaller size package
▪ Supply voltage range is from 1.1V till 3.3V (Buck and Boost). This allows for a wider
selection of battery types
▪ The power consumption of the RF front-end has been optimized.
▪ Applications will cover a wider Bluetooth range because of improved output power and
sensitivity
▪ Supporting BLE 5.1 standard
▪ Additional 1-wire UART for interfacing to sensors or external MCU
DA14585 vs DA14531 application related differences
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