PUBLISHED SFF-8436 Rev 4.9
QSFP+ 4X 10 GB/S Pluggable Transceiver Page 3
Change History:
Changes from Revision 3.5 to 3.6:
Section 1.1: Added descriptions for clauses 4 thru 7
Section 3:
Table 1 and 2: Added X to 10GFC column to match the 10GBE column.
Changed 'The overall package dimension shall conform to the indicated dimensions and
tolerances and the mounting features.' to: The overall package dimension shall conform to
the indicated dimensions and tolerances indicated in clause 5. The mounting features...
Changed from 'The electrical and optical specifications shall be compatible with….'
to 'The electrical and optical specifications may be compatible with …..'
Section 3 page 10 line 19: Add: ‘"For speeds above 6Gb/s the compliance board methodology
of IEEE802.3ba, FC-PI4 and SFF8431 should be used. Measurements taken with QSFP+
compliance boards should be corrected for any difference between the loss of these
compliance boards and the loss of the compliance boards specified in the standard.’
Section 4:
4.1.1.2: changed 'post' to 'asserting "low"’
4.1.1.5: Added the following text: 'The INTL pin is de-asserted “High” when byte 2 bit 0
(Data Not Ready)is read unless a flag is set (see 7.6.1.2).'
4.1.3.1: Changed 'Clause 6.6.5.2' to 'Clause 7.6.5.2'
4.1.3.2: Changed " For operation above 6 Gb/s see the appropriate specification for
required voltage swings. Note: for 10G Ethernet reference SFF-8431. For 40G Ethernet
operation reference 802.3ba." to "For operation above 6 GBd see the appropriate
specification, e.g. 802.3ba, FC-PI-4, FC-PI-5 or the InfiniBand specification. For 10G
Ethernet, see SFF-8431."
Deleted ‘(absolute value)’ after ‘1600mv’.
4.2.1: Change "… filtering shown in Figure 4", to "… filtering equivalent to that shown
in Figure 4".
4.2.1: In Table 6, added a reference to Figure 5 in the Condition column for Sustained
peak current at hot plug ... & Module Maximum Current Inrush....
4.2.1: At line 9, add a sentence "It is recommended that the 22 uF capacitors each have
an equivalent series resistance of 0.22 ohm."
Section 5:
5.1: Updated the two bottom images to show the same keying structure as the two top
images (modules).
5.3: Enlarged the scale of Fig. 8 to make it easier to read the dimensions and notes.
Figure 8: Added missing dimensions at the bottom of figure.
5.3.1: Figure 10: Change pad width from ‘0.60 +/-0.03’ to ‘0.55 -0, +0.08’
Figure 10 detail 2: Change the tolerances from ‘0.08 +/- 0.015’ to ‘0.10 +/-0.05’.
Figure 14: Deleted the MX1 product code
Figure 17A and 17B: Changed the dimension in section Y-Y from ‘.2mm’ to ‘2.0 mm’.
5.10: Updated IEC-xxx reference to IEC 61754-20. Updated TIA reference for dual LC to
TIA/EIA-604-10A.
Section 7:
7.1:Added the following text: 'This QSFP+ specification is based on the INF8438
specification however it is not backward compatible. Address 128 Page00 is used to
indicate the use of the QSFP+ memory map rather than the QSFP memory map.'
7.2.1: Changed reference from ‘clause 3.1.2’ to ‘clause 4.1.2’.
7.4: Changed reference from ‘clause 6.6’ to ‘clause 7.6’ ; changed reference from ‘clause
3.1.1.1’ to ‘clause 4.1.1.1’ ; changed reference from ‘clause 3.1.2’ to ‘clause 4.1.2’.
7.6: Changed the last byte designation in page 00 from ‘126’ to ‘128’
7.6: Changed ‘Page 03 is required if byte 2, bit 2 in the lower page is set high’ to
‘Page 03 is required if byte 2, bit 2 in the lower page is low.’
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